Abstract:
PROBLEM TO BE SOLVED: To provide a printing machine which may form a lamination structure having a conductive layer even in a narrow installation space.SOLUTION: A printing machine (100) of this invention includes: a transfer roll (10); a first plate roll (20a); and a second plate roll (20b). The second plate roll (20b) transfers a second ink (Kb) to the transfer roll (10) so that at least a part of the second ink (Kb) overlaps with a first ink (Ka). The transfer roll (10) includes: a base (16) including multiple base parts (16a); at least one blanket (14) provided on an outer peripheral surface (16at) of at least one of the multiple base parts (16a); and a core (12) having an outer peripheral surface (12t) which matches with an inner peripheral surface (16s) of the base (16).
Abstract:
PROBLEM TO BE SOLVED: To provide a circuit board capable of overcoming the problems related to corrosion of a plating layer in conventional selective surface treatment using an electroless gold plating system and OSP.SOLUTION: The circuit board includes a circuit pattern 120 formed on a substrate 110, a first solder resist layer 130 formed on the circuit pattern 120, electroless plating layers 140, 150 and 160 formed on a circuit pattern 120 where the first solder resist layer 130 is opened, and a second solder resist layer 230 formed on the first solder resist layer 130.
Abstract:
PROBLEM TO BE SOLVED: To provide a shield film which has good shield characteristics in a high frequency region of the shield film, and to provide a shield printed wiring board.SOLUTION: A shield film 1 is provided on a flexible printed wiring board 8 including a base film 5 where a signal circuit 6a is formed and an insulation film 7 which is provided on an entire surface of the base film 5 covering the signal circuit 6a. The shield film 1 includes: a conductive adhesive layer 15 laminated on an entire surface of the insulation film 7; and a metal layer 11 laminated on an entire surface of the conductive adhesive layer 15.
Abstract:
PROBLEM TO BE SOLVED: To provide a proximity sensor capable of precisely detecting an object having a simply designed base plate in which light emission timing of a light-emitting part is previously adjusted.SOLUTION: A proximity sensor 19 is manufactured by incorporating light emitting devices 10A, 10B and 10C and a light receiving device 32 into a three-dimensional circuit board 1 manufactured through a manufacturing process using an MID technique. In a touch less motion, when an object like a hand or finger moves upward with respect to the proximity sensor 19, beams of lights each emitted from the light emitting device 10A and 10B are reflected by the object. The light receiving device 32 detects the reflected light and outputs detection signals 1 and 2. Subsequently, when the object reaches the top of the light emitting device 10C, the light receiving device 32 detects a beam of reflected light from the light emitting device 10C and outputs a detection signal 3. The upward movement of the object is detected based on an output pattern of the detection signals 1, 2 and 3.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal film material exhibiting an excellent adhesion to various base materials constituting the metal film material and a high etching resistance and improving an accuracy of a pattern shape obtained, and the metal film material using the method.SOLUTION: The method of manufacturing the metal film material 1 includes: an ink applying step of discharging ink compositions respectively containing a first monomer and a second monomer onto the base material 2 using an ink jet technique; a cured film forming step of forming a cured film 3 by curing the applied ink composition; a catalyst applying step for the cured film; and a plating processing step of plating the plating catalyst or a precursor thereof, wherein the metal film material 1 includes an inclined structure in which the compositions of the cured material containing the first monomer and the cured material containing the second monomer continuously change so that a ratio of the cured material containing the first monomer in the cured film increases and a ratio of the cured material containing the second monomer decreases from a side B closest to the base material toward a side A farthest from the base material in a film thickness direction.
Abstract:
PROBLEM TO BE SOLVED: To provide a flexible printed board which has excellent elasticity, and to provide a manufacturing method of the flexible printed board.SOLUTION: A flexible printed board 100 includes an insulation substrate 10 and a wiring circuit 30 provided on at least one main surface 10 side of the insulation substrate 10. In the flexible printed board 100, the wiring circuit 30 includes a lamination body 35 having first metal layers 33 containing first metal crystal grains 36 and second metal layers 34 which are located adjacent to the first metal layers 33 and contain second metal crystal grains 37, the first metal layers 33 and the second metal layers 34 laminated in a direction perpendicular to the main surface 10a of the insulation substrate 10. An average grain diameter of the first metal crystal grains 36 is smaller than an average grain diameter of the second metal crystal grains 37.