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    Printed circuit board laminate
    22.
    发明专利
    Printed circuit board laminate 有权
    印刷电路板层压板

    公开(公告)号：JP2014138126A

    公开(公告)日：2014-07-28

    申请号：JP2013006760

    申请日：2013-01-17

    Applicant: Sumitomo Wiring Syst Ltd ,  住友電装株式会社

    Inventor： SEOK WEN-CHIEH

    IPC: H05K1/14 ,  H02G3/16

    CPC classification number: H05K1/144 ,  H01R12/523 ,  H05K7/026 ,  H05K2201/042 ,  H05K2201/10181 ,  H05K2201/10295 ,  H05K2201/10303

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board laminate of novel structure which allows for connection of the printed wires on printed circuit boards, arranged to face each other across a gap, with enhanced workability and connection stability.SOLUTION: In a first printed circuit board 18 and a second printed circuit board 20 arranged to face each other across a gap, a first tuning fork terminal 26 soldered to a printed wire 32 is stood on the first printed circuit board 18, and a second tuning fork terminal 34 soldered to a printed wire 36 is stood on the second printed circuit board 20. The printed wire 32 of the first printed circuit board 18, and the printed wire 36 of the second printed circuit board 20 are brought into conduction via a conduction member 56 including a pair of connections 57, 57 that are pressed between pressure contact blades 28, 28 of the first and second tuning fork terminal 26, 34.

    Abstract translation: 要解决的问题：提供一种新颖结构的印刷电路板层压板，其允许连接印刷电路板上的印刷电线，布置成跨越间隙彼此面对，具有增强的可加工性和连接稳定性。解决方案：在第一印刷 电路板18和布置成跨越间隙彼此相对的第二印刷电路板20，将焊接到印刷线32的第一音叉端子26放置在第一印刷电路板18上，并且将第二音叉端子34焊接到 印刷线36被放置在第二印刷电路板20上。第一印刷电路板18的印刷线32和第二印刷电路板20的印刷线36经由包括一对的导电部件56导通 连接件57,57被压在第一和第二音叉端子26,34的压力接触片28,28之间。

    プレスフィット端子および半導体装置
    24.
    发明专利
    プレスフィット端子および半導体装置 有权

    公开(公告)号：JPWO2011125747A1

    公开(公告)日：2013-07-08

    申请号：JP2012509519

    申请日：2011-03-30

    Applicant: 三菱電機株式会社

    Inventor： 稔 江草 ,  稔 江草 ,  進吾 須藤 ,  進吾 須藤 ,  林　建一 ,  建一 林

    IPC: H01R12/58

    CPC classification number: H01R12/585 ,  H01R13/03 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10818 ,  H05K2201/10856

    Abstract: 本発明は,容易に精度よく加工でき,圧入時の圧入力を増大させることなく貫通孔との接触抵抗を低減できるプレスフィット端子及び半導体装置を得ることを目的とする。本発明のプレスフィット端子(10)は,複数のプレスフィット端子単体ユニット(10L)を複数重ねて構成されている。プレスフィット端子単体ユニット(10L)の圧接部(15)は,先端部(14)から分岐した部分(15a)が所定の間隔(15s)を隔てて対向するように形成されている。プレスフィット端子単体ユニット(10L)の板厚(tL)は,所定の間隔(15s)の幅(Ws)又は先端部(14)から分岐した部分(15a)の幅(Wa)よりも薄い。こうすることで,プレスフィット端子(10)を容易に精度よく加工できるとともに,それぞれのプレスフィット端子単体ユニット(10L)の分岐部(15a)が独立して貫通孔(31)の内壁に対して圧接力を働かせるため,少ない圧入力での圧入が可能になる。

    Signal wiring board and signal transmission circuit
    25.
    发明专利
    Signal wiring board and signal transmission circuit 有权
    信号接线板和信号传输电路

    公开(公告)号：JP2012248653A

    公开(公告)日：2012-12-13

    申请号：JP2011118749

    申请日：2011-05-27

    Applicant: Hitachi Ltd ,  株式会社日立製作所

    Inventor： MURAOKA SATOSHI ,  YAGYU MASAYOSHI

    IPC: H05K3/46 ,  H05K1/02

    CPC classification number: H05K1/0251 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/10295 ,  H05K2203/0207

    Abstract: PROBLEM TO BE SOLVED: To maintain inserting and removing strength of connector pins connecting to a signal board and reduce a stub length of a through hole connecting to a signal wiring.SOLUTION: There is provided a signal wiring board in which through holes connected to internal-layer signal wirings are formed so as to be shorter than the other through holes, and the through holes into which connector pins connecting to the internal-layer signal wirings are inserted are formed so as to have lengths corresponding to depths of the internal-layer signal wirings.

    Abstract translation: 要解决的问题：为了保持连接到信号板的连接器引脚的插入和移除强度，并减少连接到信号线的通孔的短截线长度。 解决方案：提供了一种信号线路板，其中连接到内层信号布线的通孔形成为比其他通孔短，并且连接器引脚连接到内层的通孔 信号布线被插入形成为具有对应于内层信号布线的深度的长度。 版权所有（C）2013，JPO＆INPIT

    Contact and connecting device
    28.
    发明专利
    Contact and connecting device 审中-公开
    联系和连接设备

    公开(公告)号：JP2009146820A

    公开(公告)日：2009-07-02

    申请号：JP2007325011

    申请日：2007-12-17

    Applicant: Hosiden Corp ,  ホシデン株式会社

    Inventor： OMORI YASUHIRO

    IPC: H01R33/02 ,  H01J5/50 ,  H01R33/975

    CPC classification number: H05K3/301 ,  F21V19/008 ,  H01H85/202 ,  H01R33/0836 ,  H05K2201/10113 ,  H05K2201/10265 ,  H05K2201/10295 ,  H05K2201/10393

    Abstract: PROBLEM TO BE SOLVED: To provide a contact and a connecting device capable of stably connecting and supporting an electronic component such as a cold cathode fluorescent lamp in midair.
    SOLUTION: A contact 200 for connection with a cold cathode fluorescent lamp 10 includes a base 210, a supporting part 220 that is provided on the base 210 for supporting a lead terminal 12 of the cold cathode fluorescent lamp 10, and at least two clamps 230 that are provided on the base 210 so as to be located on respective outer sides of the supporting part 220 and capable of sandwiching and holding the lead terminal 12 of the cold cathode fluorescent lamp 10 between themselves and the supporting part 220.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供能够在空中稳定地连接和支撑诸如冷阴极荧光灯的电子部件的接触和连接装置。 解决方案：用于与冷阴极荧光灯10连接的触点200包括基座210，支撑部分220，其设置在基座210上，用于支撑冷阴极荧光灯10的引线端子12，并且至少 两个夹具230，其设置在基座210上，以便位于支撑部件220的相应的外侧上，并且能够将冷阴极荧光灯10的引线端子12夹持并保持在它们之间和支撑部件220之间。 P>版权所有（C）2009，JPO＆INPIT

    Electronic control device
    30.
    发明专利
    Electronic control device 有权
    电子控制装置

    公开(公告)号：JP2008162341A

    公开(公告)日：2008-07-17

    申请号：JP2006352260

    申请日：2006-12-27

    Applicant: Mitsubishi Electric Corp ,  三菱電機株式会社

    Inventor： TOMINAGA TSUTOMU ,  KIMATA MASAHIRO ,  KIFUKU TAKAYUKI ,  AKIYAMA SHUZO ,  FUJIMOTO TADAYUKI

    IPC: B62D5/04

    CPC classification number: H05K7/20509 ,  H05K3/308 ,  H05K3/32 ,  H05K3/328 ,  H05K7/20854 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10962

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic control device in which a device is miniaturized and the cost is reduced by abolishing a part such as a power substrate or the like, and reliability of electric connection is enhanced.
    SOLUTION: The electronic control device is provided with a housing 3; a heat sink provided in the housing 3; a semiconductor switching element 2 mounted on the heat sink; a circuit board formed with an electronic circuit including a control circuit provided opposed to the heat sink and controlling the semiconductor switching element 2; and a plurality of electric conduction plates 6a, 6b, 6c for electrically connecting the circuit board and the semiconductor switching element 2. The respective electric conduction plates 6a, 6b, 6c are arranged in a leading out direction that respective terminals VS, GT1, OUT, GT2, GND of the semiconductor switching element 2 are led out and are joined to the terminals VS, GT1, OUT, GT2, GND.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种电子控制装置，其中装置小型化并且通过消除诸如电力基板等的部件来降低成本，并且提高了电连接的可靠性。 电解质：电子控制装置设有壳体3; 设置在壳体3内的散热器; 安装在散热器上的半导体开关元件2; 形成有电子电路的电路板，包括与散热器相对设置并控制半导体开关元件2的控制电路; 以及用于电连接电路板和半导体开关元件2的多个导电板6a，6b，6c。各个导电板6a，6b，6c沿导向方向布置，各个端子VS，GT1，OUT ，半导体开关元件2的GT2，GND被引出并接合到端子VS，GT1，OUT，GT2，GND。 版权所有（C）2008，JPO＆INPIT

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