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公开(公告)号：JP5685473B2
公开(公告)日：2015-03-18
申请号：JP2011084634
申请日：2011-04-06
申请人： デクセリアルズ株式会社
CPC分类号： H01R4/04 , H01R13/2414 , H05K3/323 , H05K2203/1189
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公开(公告)号：JP5558184B2
公开(公告)日：2014-07-23
申请号：JP2010097358
申请日：2010-04-20
申请人： デクセリアルズ株式会社
CPC分类号： H01L24/29 , C08K9/04 , C09J9/02 , C09J11/00 , C09J2203/326 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/83851 , H01L2924/00011 , H01L2924/01012 , H01L2924/14 , H01L2924/15788 , H01L2224/29075 , H01L2924/00
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公开(公告)号：JP5539039B2
公开(公告)日：2014-07-02
申请号：JP2010127426
申请日：2010-06-03
申请人： デクセリアルズ株式会社
发明人： 朋之 石松
IPC分类号： C09J7/00 , B32B27/00 , B32B27/32 , C09J9/02 , C09J201/00
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公开(公告)号：JP5226562B2
公开(公告)日：2013-07-03
申请号：JP2009055308
申请日：2009-03-09
申请人： デクセリアルズ株式会社
发明人： 朋之 石松
CPC分类号： H05K3/323 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H05K2203/1189 , Y10T156/10 , H01L2924/00
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公开(公告)号：JP5192194B2
公开(公告)日：2013-05-08
申请号：JP2007194702
申请日：2007-07-26
申请人： デクセリアルズ株式会社
CPC分类号： H05K3/323 , C09J7/10 , C09J9/02 , C09J11/04 , C09J2201/36 , H01L24/16 , H01L24/29 , H01L24/31 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/29082 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/294 , H01L2224/2989 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/83192 , H01L2224/83851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H05K2203/1189 , Y10T428/24959 , Y10T428/25 , Y10T428/2826 , Y10T428/2852 , H01L2924/00 , H01L2224/0401
摘要： An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.
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公开(公告)号：JP5358328B2
公开(公告)日：2013-12-04
申请号：JP2009168081
申请日：2009-07-16
申请人： デクセリアルズ株式会社
IPC分类号： H01B5/00 , B22F1/02 , H01B1/00 , H01B1/22 , H01B5/16 , H01R11/01 , H05K1/14 , H05K3/32 , H05K3/36
CPC分类号： H05K3/323 , B22F1/02 , C22C5/02 , C22C19/03 , H01B1/02 , H05K2201/0218 , Y10T428/12181 , Y10T428/12944 , Y10T428/256 , Y10T428/287 , Y10T428/2991
摘要： To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.
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公开(公告)号：JP5650611B2
公开(公告)日：2015-01-07
申请号：JP2011181695
申请日：2011-08-23
申请人： デクセリアルズ株式会社
CPC分类号： H05K1/181 , H01R4/04 , H05K3/323 , H05K13/046 , H05K2201/0209 , H05K2201/0221 , H05K2201/0224 , Y10T156/10 , Y10T428/2991
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公开(公告)号：JP5643623B2
公开(公告)日：2014-12-17
申请号：JP2010269422
申请日：2010-12-02
申请人： デクセリアルズ株式会社
CPC分类号： H05K7/04 , H01B1/08 , H01B1/10 , H01B1/20 , H01L24/29 , H01L2224/29 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15788 , H01R4/04 , H01R43/00 , H05K3/323 , H05K2201/0209 , H05K2201/0239 , Y10T29/49117 , H01L2924/00 , H01L2924/05442 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
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10.发明专利
公开(公告)号：JP5430093B2
公开(公告)日：2014-02-26
申请号：JP2008191098
申请日：2008-07-24
申请人： デクセリアルズ株式会社
CPC分类号： H05K3/323 , H05K2201/0212 , H05K2201/0218 , H05K2201/0221 , Y10T29/4913 , Y10T428/254 , Y10T428/26 , Y10T428/2991 , Y10T428/31663
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