-
公开(公告)号：JP5685473B2
公开(公告)日：2015-03-18
申请号：JP2011084634
申请日：2011-04-06
申请人： デクセリアルズ株式会社
CPC分类号： H01R4/04 , H01R13/2414 , H05K3/323 , H05K2203/1189
-
-
公开(公告)号：JP5192194B2
公开(公告)日：2013-05-08
申请号：JP2007194702
申请日：2007-07-26
申请人： デクセリアルズ株式会社
CPC分类号： H05K3/323 , C09J7/10 , C09J9/02 , C09J11/04 , C09J2201/36 , H01L24/16 , H01L24/29 , H01L24/31 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/29082 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/294 , H01L2224/2989 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/83192 , H01L2224/83851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H05K2203/1189 , Y10T428/24959 , Y10T428/25 , Y10T428/2826 , Y10T428/2852 , H01L2924/00 , H01L2224/0401
摘要： An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise.
-
-
公开(公告)号：JP5643623B2
公开(公告)日：2014-12-17
申请号：JP2010269422
申请日：2010-12-02
申请人： デクセリアルズ株式会社
CPC分类号： H05K7/04 , H01B1/08 , H01B1/10 , H01B1/20 , H01L24/29 , H01L2224/29 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15788 , H01R4/04 , H01R43/00 , H05K3/323 , H05K2201/0209 , H05K2201/0239 , Y10T29/49117 , H01L2924/00 , H01L2924/05442 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
-
6.发明专利
公开(公告)号：JP5430093B2
公开(公告)日：2014-02-26
申请号：JP2008191098
申请日：2008-07-24
申请人： デクセリアルズ株式会社
CPC分类号： H05K3/323 , H05K2201/0212 , H05K2201/0218 , H05K2201/0221 , Y10T29/4913 , Y10T428/254 , Y10T428/26 , Y10T428/2991 , Y10T428/31663
-
公开(公告)号：JP5311772B2
公开(公告)日：2013-10-09
申请号：JP2007168964
申请日：2007-06-27
申请人： デクセリアルズ株式会社
CPC分类号： H01R4/04 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2203/326 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/16225 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H05K2201/10674 , H05K2203/1189 , Y10T428/28 , H01L2924/00
摘要： An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles.
-
8.发明专利
公开(公告)号：JP5186157B2
公开(公告)日：2013-04-17
申请号：JP2007218863
申请日：2007-08-24
申请人： デクセリアルズ株式会社
IPC分类号： H01R11/01 , C09J5/06 , C09J7/00 , C09J9/02 , C09J11/02 , C09J109/00 , C09J163/00 , C09J163/02 , C09J171/10 , C09J201/00 , H01B1/22 , H01B5/16 , H01R43/00
CPC分类号： H01R4/04 , C08G2650/56 , C08L47/00 , C08L63/00 , C08L71/00 , C08L2666/02 , C08L2666/22 , C09J163/00 , C09J171/00 , H01R12/62 , H01R13/03 , H05K3/323 , H05K3/361 , H05K2201/0133 , H05K2201/0212 , Y10T156/1089
摘要： An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film (2) is composes of an insulating adhesive resin containing polybutadiene particles, a cationic polymerizable resin and a cationic curing agent, and conductive particles dispersed in the insulating adhesive resin, with the lowest melt viscosity of the anisotropic conductive film being 300 to 1000 Pa·s. This anisotropic conductive film is placed in contact with terminal electrodes of a glass substrate (1). A flexible printed circuit board (3) is placed on top of the anisotropic conductive film so that terminal electrodes of the flexible printed circuit board (3) are in contact with the anisotropic conductive film (2). A heating tool is thrust onto the flexible printed circuit board side for electrically interconnecting the terminal electrodes.
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.019 秒)
