公开(公告)号：KR20210027969A

公开(公告)日：2021-03-11

申请号：KR1020190109099A

申请日：2019-09-03

Applicant: 엘지전자 주식회사

Inventor： 김민표 ,  김정규 ,  김충의 ,  최정훈

IPC: H01L31/048 ,  H01L31/0203 ,  H01L31/05 ,  H01L31/18

CPC classification number: H01L31/0481 ,  H01L31/0203 ,  H01L31/0508 ,  H01L31/18 ,  Y02E10/50

Abstract: 본 발명의 실시예에 따른 태양 전지 패널은, 태양 전지; 상기 태양 전지의 일면 및 타면 쪽에 각기 위치하며, 적어도 하나가 유리 기판을 포함하는 제1 및 제2 커버 부재; 및 상기 제1 커버 부재와 상기 제2 커버 부재 사이에서 상기 태양 전지를 둘러싸서 밀봉하는 밀봉재를 포함하고, 상기 밀봉재는 상기 제1 또는 제2 커버 부재의 적어도 가장자리 부분에서 서로 다른 겔 함량을 가지는 복수의 밀봉 부분을 포함한다.

公开(公告)号：KR20210025768A

公开(公告)日：2021-03-10

申请号：KR1020190105455A

申请日：2019-08-27

Applicant: 주식회사 에이유이

Inventor： 김동경 ,  박상복

IPC: H01L31/12 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/048

CPC classification number: H01L31/12 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/048

Abstract: 본 발명은 동작 거리가 향상된 근거리 반사형 광센서에 관한 것이다. 일반적인 광센서와 같이 반사광의 유무에 의하여 물체를 검출하는 방법으로 사용되며, 광학적 구조에 따라 동작거리를 변형하여 사용할 수 있다.
본 발명에 따른 반사형 광센서는 인쇄회로기판, 리드프레임 또는 이들의 조합에서 선택되는 기판; 상기 기판에 실장되는 발광칩 및 수광칩; 상기 발광칩과 수광칩의 주변을 소정 높이로 둘러싸는 두 개의 우물형 딤플; 및 상기 우물형 딤플에 충진된 보호용 수지를 포함하고, 상기 우물형 딤플의 적어도 하나가 비대칭 딤플인 것을 특징으로 한다.

公开(公告)号：JP5201770B2

公开(公告)日：2013-06-05

申请号：JP2000576612

申请日：1999-10-11

Applicant: インテル・コーポレーション

Inventor： センガプタ，カブル・エス ,  アサディ，エイザー ,  アレイ，アラン・ビイ ,  サンダール，ロバート・シイ

IPC: G02B5/20 ,  H01L27/14 ,  H01L27/146 ,  H01L31/0203 ,  H05K3/34

CPC classification number: H01L31/0203 ,  H01L27/14601 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.

公开(公告)号：JP5030360B2

公开(公告)日：2012-09-19

申请号：JP2002374301

申请日：2002-12-25

Applicant: オリンパス株式会社

Inventor： 紀幸 藤森

IPC: H01L27/14 ,  A61B1/04 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225 ,  H04N5/335 ,  H04N5/369

CPC classification number: H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L27/14618 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3025 ,  H04N5/2253 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

公开(公告)号：JP4860119B2

公开(公告)日：2012-01-25

申请号：JP2004174650

申请日：2004-06-11

Applicant: 三星電子株式会社Samsung Electronics Co.,Ltd.

Inventor： 敬世 崔

IPC: H01L27/14 ,  H01L21/00 ,  H01L21/50 ,  H01L25/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/06 ,  H04N5/225 ,  H04N5/30

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate having a circuit to which the ship is connected. The image sensoring semiconductor chip is disposed on an upper surface of the substrate as spaced vertically from a digital signal processing second semiconductor chip mounted on a lower surface of the substrate. The transparent polymeric encapsulation material constitutes a sealing resin unit. The digital signal processing second semiconductor chip may also be encapsulated by the sealing resin unit. The sealing transfer unit can be formed by injection and/or transfer molding. The forming of the sealing resin unit by a single molding process keeps production costs low.

公开(公告)号：JP4839084B2

公开(公告)日：2011-12-14

申请号：JP2005516367

申请日：2004-12-17

Applicant: パナソニック株式会社

Inventor： 琢己 山口 ,  繁孝 春日 ,  隆彦 村田

IPC: H01L27/14 ,  H01L23/02 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203 ,  H04N5/225

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/13091 ,  H04N5/2251 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Provided is a light-receiving chip whose transparent protection plate has an area equal to or smaller than an area of the light-receiving chip, and which does not require a base portion for mounting. Provision of the light-receiving chip contributes to reduction in size and weight of cameras. In addition, provision of a solid-state imaging apparatus having excellent productivity contributes to reduction in price of cameras. A solid-state imaging apparatus (10) having: a solid-state imaging device (11) (a light-receiving chip) provided with a plurality of light-receiving cells arranged either one dimensionally or two dimensionally on one main surface of a base substrate; and a transparent protection plate (12) provided to cover a light-receiving area (18) (the plurality of light-receiving cells), where an area of the transparent protection plate is equal to or smaller than an area of the light-receiving chip, and a space (20) is formed between the light-receiving cells and the transparent protection plate.

公开(公告)号：JP4710610B2

公开(公告)日：2011-06-29

申请号：JP2005513276

申请日：2004-08-10

Applicant: コニカミノルタオプト株式会社

Inventor： 淳 高山

IPC: H01L27/14 ,  G02B3/00 ,  G02B5/20 ,  H01L23/02 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225 ,  H04N5/369

CPC classification number: H04N5/2254 ,  G02B3/0018 ,  G02B3/0075 ,  G02B5/201 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H04N5/2253 ,  H01L2924/00014

公开(公告)号：JP4660259B2

公开(公告)日：2011-03-30

申请号：JP2005117857

申请日：2005-04-15

Applicant: 三洋電機株式会社

Inventor： 崇 野間

IPC: H01L23/12 ,  H01L21/60 ,  H01L21/78 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225

CPC classification number: H04N5/2253 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/013

公开(公告)号：JP4602557B2

公开(公告)日：2010-12-22

申请号：JP2000585617

申请日：1999-11-25

Applicant: ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングDr. Johannes Heidenhain Gesellschaft Mit Beschrankter Haftung

Inventor： シュヴァルツロック・ギュンター ,  シュペックバッハー・ペーター ,  シュミット・アンドレーアス ,  ブルクシャット・ライナー ,  ブローデ・ヴォルフガング ,  ホルツアプフェル・ヴォルフガング ,  ミヒェル・ディーター

IPC: G01B11/00 ,  H01L31/12 ,  G01D5/347 ,  H01L31/0203 ,  H01L31/167

CPC classification number: H01L31/0203 ,  G01D5/34715 ,  H01L31/167 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2224/05599

Abstract: An optoelectronic component that includes a substrate having a first optoelectronic component, a second optoelectronic component arranged next to the first optoelectronic component and a contact point. A support of the substrate includes a second contact point, wherein the second contact point is located opposite to the first contact point and is in electrical connection with the first contact point. An underfiller in a space between the substrate and the support, the underfiller forms a border area between the substrate and the support toward a space free of underfiller, wherein the border area restricts the space free of underfiller of at least one of the first and second optoelectronic components.

公开(公告)号：JP2010283380A

公开(公告)日：2010-12-16

申请号：JP2010185283

申请日：2010-08-20

Applicant: Optopac Inc ,  オプトパック、インコーポレイテッド

Inventor： KIM DEOK HOON ,  RECHE JOHN J H

IPC: H01L23/48 ,  H01L31/02 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L23/00 ,  H01L27/14 ,  H01L27/148 ,  H01L29/40 ,  H01L31/0203

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a photo-sensing device package which is inexpensive, compact, and easy to assemble, and to provide a packaging method thereof. SOLUTION: The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths, a sensing portion having at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths, and a plurality of first solder joints bonding the sensing portion to the assembly portion. The assembly portion is formed with at least one metal layer disposed on the substrate about a front surface region thereof, and at least one passivation layer formed to extend over the metal layer. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供廉价，紧凑且易于组装的光敏装置封装，并提供其封装方法。 解决方案：封装包括具有由在预定波长范围内对光基本上透明的材料形成的基板的组件部分，感测部分具有在预定范围内的至少一个感光芯光电转换光 以及将感测部分接合到组件部分的多个第一焊接接头。 组装部分形成有至少一个金属层，其围绕其前表面区域设置在基板上，以及形成为在金属层上延伸的至少一个钝化层。 版权所有（C）2011，JPO＆INPIT