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公开(公告)号：KR1020080080458A
公开(公告)日：2008-09-04
申请号：KR1020080019169
申请日：2008-02-29
申请人： 닛토덴코 가부시키가이샤
CPC分类号： H01L24/83 , H01L21/6836 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/0657 , H01L2221/68327 , H01L2224/05599 , H01L2224/274 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83885 , H01L2224/85001 , H01L2224/85099 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/0635 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A thermosetting die bonding film is provided to ensure excellent adhesiveness with an object, and to prevent contamination of a substrate or semiconductor chip caused by exudation of an adhesive. A thermosetting die bonding film(3a) is used in the manufacture of a semiconductor apparatus. The thermosetting die bonding film contains 5-15wt% of a thermoplastic resin component and 45-55wt% of a thermosetting resin component, and has a melt viscosity of 400-2500 Pa . s at 100 °C before thermosetting. The die bonding film has a tensile storage elastic modulus of 10 MPa or more at 250 °C after thermosetting. The thermoplastic resin component is an acrylic resin component, and the thermosetting resin component is an epoxy resin component and a phenol resin component.
摘要翻译： 提供热固性芯片接合膜以确保与物体的优异的粘合性，并且防止由粘合剂渗出引起的基板或半导体芯片的污染。 热固性芯片接合薄膜（3a）用于制造半导体装置。 热固性芯片接合膜含有5-15重量％的热塑性树脂组分和45-55重量％的热固性树脂组分，熔体粘度为400-2500Pa。 在100℃下热固化。 芯片接合膜在热固化后的250℃下的拉伸储能弹性模量为10MPa以上。 热塑性树脂组分是丙烯酸树脂组分，热固性树脂组分是环氧树脂组分和酚醛树脂组分。
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公开(公告)号：KR1020090107557A
公开(公告)日：2009-10-13
申请号：KR1020097017946
申请日：2008-02-04
申请人： 닛토덴코 가부시키가이샤
发明人： 다까모또,나오히데
IPC分类号： B32B27/28
CPC分类号： H01L24/83 , H01L21/6836 , H01L23/3121 , H01L23/49513 , H01L23/49575 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/50 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83855 , H01L2224/83885 , H01L2224/85001 , H01L2224/85201 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/0101 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/3025 , Y10T428/28 , H01L2924/0635 , H01L2924/066 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A thermosetting die bonding film which has excellent adhesion to adherends and satisfactory suitability for pickup; and a dicing/die bonding film comprising the film. The thermosetting die bonding film is one for use in producing a semiconductor device, and is characterized in that it comprises 15-30 wt.% thermoplastic resin ingredient and 60-70 wt.% thermosetting resin ingredient as major components and has a surface free energy before heat curing of 37-40 mJ/m2, excluding 40 mJ/m2.
摘要翻译： 一种与被粘附物具有优异粘附性和令人满意的拾取适合性的热固性芯片接合膜; 以及包含该膜的切割/芯片接合薄膜。 热固性芯片接合膜是用于制造半导体器件的热固性芯片接合膜，其特征在于，其包含15-30重量％的热塑性树脂成分和60-70重量％的热固性树脂成分作为主要成分，并具有表面自由能 热固化37-40 mJ / m2，不超过40 mJ / m2。
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公开(公告)号：KR101140512B1
公开(公告)日：2012-04-30
申请号：KR1020097017946
申请日：2008-02-04
申请人： 닛토덴코 가부시키가이샤
发明人： 다까모또,나오히데
IPC分类号： B32B27/28
CPC分类号： H01L24/83 , H01L21/6836 , H01L23/3121 , H01L23/49513 , H01L23/49575 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/50 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83855 , H01L2224/83885 , H01L2224/85001 , H01L2224/85201 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/0101 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/3025 , Y10T428/28 , H01L2924/0635 , H01L2924/066 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： 피착체와의 밀착성이 우수하고, 픽업성이 양호한 열경화형 다이본드 필름 및 그것을 구비한 다이싱ㆍ다이본드 필름을 제공한다. 본 발명의 열경화형 다이본드 필름은, 반도체 장치의 제조시에 이용하는 열경화형 다이본드 필름이며, 열가소성 수지 성분 15 내지 30중량％ 및 열경화성 수지 성분 60 내지 70중량％를 주성분으로서 함유하고, 열경화 전의 표면 자유 에너지가 37mJ/m
2 이상 40mJ/m
2 미만인 것을 특징으로 한다.
반도체 장치, 열경화형 다이본드 필름, 표면 자유 에너지, 다이싱ㆍ다이본드 필름-
公开(公告)号：KR100941832B1
公开(公告)日：2010-02-11
申请号：KR1020080019169
申请日：2008-02-29
申请人： 닛토덴코 가부시키가이샤
CPC分类号： H01L24/83 , H01L21/6836 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/0657 , H01L2221/68327 , H01L2224/05599 , H01L2224/274 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83885 , H01L2224/85001 , H01L2224/85099 , H01L2224/85205 , H01L2224/85399 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/0635 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： 본 발명의 열경화형 다이 본딩 필름은 반도체 장치의 제조시에 사용하는 열경화형 다이 본딩 필름으로서, 열가소성 수지 성분 5 내지 15 중량％ 및 열경화성 수지 성분 45 내지 55 중량％를 주성분으로 함유하고, 열경화 전의 100 ℃에서의 용융 점도가 400 Paㆍs 이상 2500 Paㆍs 이하인 것을 특징으로 한다.
열경화형 다이 본딩 필름
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