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公开(公告)号：KR100913762B1
公开(公告)日：2009-08-25
申请号：KR1020077029130
申请日：2006-05-24
申请人： 도와 일렉트로닉스 가부시키가이샤
发明人： 오시카요시카즈
CPC分类号： H05K1/053 , H01L23/142 , H01L23/15 , H01L23/3735 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/29144 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83192 , H01L2224/83801 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/8546 , H01L2224/85466 , H01L2224/85469 , H01L2224/85484 , H01L2924/00011 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01S5/02272 , H01S5/02476 , H05K2201/0179 , H01L2924/00014 , H01L2924/0105 , H01L2924/00 , H01L2924/01047 , H01L2924/01004
摘要： A metal-ceramic composite substrate having excellent heat dissipation and a method of manufacturing such a metal-ceramic composite substrate at low cost are disclosed. A metal-ceramic composite substrate (10) comprises a metal substrate (11), a ceramic layer (12) formed on the metal substrate (11), an electrode layer (13) formed on the ceramic layer (12) and a solder layer (14) formed on the electrode layer (13) wherein the ceramic layer (12) is in the form of a thin film of a ceramic. Forming the ceramic layer (12) in the form of a thin film of aluminum nitride provides a metal-ceramic composite substrate (10) of excellent heat dissipating property for an electronic circuit.
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公开(公告)号：KR101591619B1
公开(公告)日：2016-02-04
申请号：KR1020147019126
申请日：2009-08-11
申请人： 셈블란트 리미티드
发明人： 험프리즈,마크,롭슨 , 퍼디난디,프랑크 , 스미스,로드니,에드워드
IPC分类号： H05K3/28
CPC分类号： H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
摘要： 일부구체예에서, 인쇄회로보드(PCB)는절연재를포함하는기판을포함한다. 상기 PCB는기판의하나이상의표면에결합된복수의도전성트랙을더 포함한다. 상기 PCB는기판의하나이상의표면상에증착된다중층코팅을더 포함한다. 상기다중층코팅은 (i) 복수의도전성트랙의적어도일부를커버하고, (ii) 할로-하이드로카본폴리머로형성된하나이상의층을포함한다. 상기 PCB는하나이상의도전성트랙에솔더접합에의해연결된하나이상의전기소자를더 포함하며, 상기솔더접합은상기솔더접합이상기다중층코팅에인접하도록상기다중층을통해솔더된다.
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公开(公告)号：KR101574374B1
公开(公告)日：2015-12-03
申请号：KR1020117006208
申请日：2009-08-11
申请人： 셈블란트 리미티드
发明人： 험프리즈,마크,롭슨 , 퍼디난디,프랑크 , 스미스,로드니,에드워드
IPC分类号： H05K3/28
CPC分类号： H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
摘要： 일부구체예에서, 인쇄회로보드(PCB)는절연재를포함하는기판을포함한다. 상기 PCB는기판의하나이상의표면에결합된복수의도전성트랙을더 포함한다. 상기 PCB는기판의하나이상의표면상에증착된다중층코팅을더 포함한다. 상기다중층코팅은 (i) 복수의도전성트랙의적어도일부를커버하고, (ii) 할로-하이드로카본폴리머로형성된하나이상의층을포함한다. 상기 PCB는하나이상의도전성트랙에솔더접합에의해연결된하나이상의전기소자를더 포함하며, 상기솔더접합은상기솔더접합이상기다중층코팅에인접하도록상기다중층을통해솔더된다.
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公开(公告)号：KR1020140109134A
公开(公告)日：2014-09-15
申请号：KR1020130023461
申请日：2013-03-05
申请人： 삼성전자주식회사
发明人： 곽민근
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/5381 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/18 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/06135 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48157 , H01L2224/48227 , H01L2224/48639 , H01L2224/48644 , H01L2224/48655 , H01L2224/48666 , H01L2224/48669 , H01L2224/48681 , H01L2224/48684 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48766 , H01L2224/48769 , H01L2224/48781 , H01L2224/48784 , H01L2224/49113 , H01L2224/49175 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83885 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85466 , H01L2224/85469 , H01L2224/85476 , H01L2224/85481 , H01L2224/85484 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06589 , H01L2924/07802 , H01L2924/10161 , H01L2924/1431 , H01L2924/1436 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/0665 , H01L2924/0715 , H01L2924/066 , H01L2924/07001 , H01L2924/0635 , H01L2924/00
摘要： Arranged is a substrate which first to fourth quadrant are defined thereof, and has a plurality of inner wirings, a plurality of first finger electrodes, and a plurality of second electrodes. Formed are outside terminals connected to the first finger electrodes and the second finger electrodes after being connected to the inner wirings at the bottom of the substrate. Formed is a first tower having a plurality of first semiconductor chips on the substrate. First conductive wires are formed between the first semiconductor chips and the first finger electrodes. Formed is a second tower separated from the first tower on the substrate, having a plurality of second semiconductor chips. Second conductive wires are formed between the second semiconductor chips and the second finger electrodes. Outer terminals include a first group, which is connected to the first finger electrodes and forms a first channel; and a second group which is separated from the first group, is connected to the second finger electrodes, and forms a second channel. The first finger electrodes are formed on the third quadrant of the substrate, and the second finger electrodes are formed on the first quadrant of the substrate.
摘要翻译： 排列是由第一至第四象限定义的衬底，并且具有多个内部布线，多个第一指状电极和多个第二电极。 形成在连接到基板底部的内部布线之后连接到第一指状电极和第二指状电极的外部端子。 形成在基板上具有多个第一半导体芯片的第一塔架。 第一导电线形成在第一半导体芯片和第一指状电极之间。 形成了与衬底上的第一塔分离的第二塔，具有多个第二半导体芯片。 在第二半导体芯片和第二指状电极之间形成第二导线。 外部端子包括第一组，其连接到第一指状电极并形成第一通道; 并且与第一组分离的第二组连接到第二指状电极，并形成第二通道。 第一指状电极形成在基板的第三象限上，第二指状电极形成在基板的第一象限上。
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公开(公告)号：KR1020140099949A
公开(公告)日：2014-08-13
申请号：KR1020147019126
申请日：2009-08-11
申请人： 셈블란트 리미티드
发明人： 험프리즈,마크,롭슨 , 퍼디난디,프랑크 , 스미스,로드니,에드워드
IPC分类号： H05K3/28
CPC分类号： H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758 , H05K3/28
摘要： 일부 구체예에서, 인쇄 회로 보드(PCB)는 절연재를 포함하는 기판을 포함한다. 상기 PCB는 기판의 하나 이상의 표면에 결합된 복수의 도전성 트랙을 더 포함한다. 상기 PCB는 기판의 하나 이상의 표면상에 증착된 다중층 코팅을 더 포함한다. 상기 다중층 코팅은 (i) 복수의 도전성 트랙의 적어도 일부를 커버하고, (ii) 할로-하이드로카본 폴리머로 형성된 하나 이상의 층을 포함한다. 상기 PCB는 하나 이상의 도전성 트랙에 솔더 접합에 의해 연결된 하나 이상의 전기 소자를 더 포함하며, 상기 솔더 접합은 상기 솔더 접합이 상기 다중층 코팅에 인접하도록 상기 다중층을 통해 솔더된다.
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公开(公告)号：KR1020110044792A
公开(公告)日：2011-04-29
申请号：KR1020117006208
申请日：2009-08-11
申请人： 셈블란트 리미티드
发明人： 험프리즈,마크,롭슨 , 퍼디난디,프랑크 , 스미스,로드니,에드워드
IPC分类号： H05K3/28
CPC分类号： H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758 , H05K3/28
摘要： In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
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公开(公告)号：KR1020080014033A
公开(公告)日：2008-02-13
申请号：KR1020077029130
申请日：2006-05-24
申请人： 도와 일렉트로닉스 가부시키가이샤
发明人： 오시카요시카즈
CPC分类号： H05K1/053 , H01L23/142 , H01L23/15 , H01L23/3735 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/29144 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83192 , H01L2224/83801 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/8546 , H01L2224/85466 , H01L2224/85469 , H01L2224/85484 , H01L2924/00011 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01S5/02272 , H01S5/02476 , H05K2201/0179 , H01L2924/00014 , H01L2924/0105 , H01L2924/00 , H01L2924/01047 , H01L2924/01004
摘要： A metal-ceramic composite substrate having an excellent heat dissipating characteristic and a method for manufacturing such composite substrate at low cost. The metal-ceramic composite substrate (10) is composed of a metal substrate (11), a ceramic layer (12) formed on the metal substrate (11), an electrode layer (13) formed on the ceramic layer (12), and a solder layer (14) formed on the electrode layer (13). The ceramic layer (12) is composed of a ceramic thin film. When the ceramic layer (12) is formed of an aluminum nitride thin film, the metal-ceramic composite substrate (10) having the excellent heat dissipating characteristic is provided for an electronic circuit.
摘要翻译： 具有优异的散热特性的金属陶瓷复合基板和低成本地制造这种复合基板的方法。 金属陶瓷复合基板（10）由金属基板（11），形成在金属基板（11）上的陶瓷层（12），形成在陶瓷层（12）上的电极层（13） 形成在电极层（13）上的焊料层（14）。 陶瓷层（12）由陶瓷薄膜构成。 当陶瓷层（12）由氮化铝薄膜形成时，具有优异的散热特性的金属 - 陶瓷复合衬底（10）被提供给电子电路。
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