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公开(公告)号:TWI503946B
公开(公告)日:2015-10-11
申请号:TW102121683
申请日:2013-06-19
Inventor: 羅雪怡 , LO, SUT-I , 蕭景文 , HSIAO, CHING WEN , 陳旭賢 , CHEN, HSU HSIEN , 陳承先 , CHEN, CHEN SHIEN
CPC classification number: H01L21/56 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L23/642 , H01L24/19 , H01L24/20 , H01L25/105 , H01L28/40 , H01L28/60 , H01L2224/12105 , H01L2224/2413 , H01L2224/73267 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00
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公开(公告)号:TWI543310B
公开(公告)日:2016-07-21
申请号:TW102136459
申请日:2013-10-09
Inventor: 陳旭賢 , CHEN, HSU HSIEN , 陳志華 , CHEN, CHIH HUA , 葉恩祥 , YEH, EN HSIANG , 呂孟昇 , LIU, MONSEN , 陳承先 , CHEN, CHEN SHIEN
CPC classification number: H01L21/76885 , H01L21/568 , H01L21/6835 , H01L23/5389 , H01L24/19 , H01L24/83 , H01L24/97 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2221/68327 , H01L2221/6834 , H01L2221/68372 , H01L2224/12105 , H01L2224/16225 , H01L2224/73267 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2224/82 , H01L2224/81 , H01L2924/00
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公开(公告)号:TW201415586A
公开(公告)日:2014-04-16
申请号:TW102136459
申请日:2013-10-09
Inventor: 陳旭賢 , CHEN, HSU HSIEN , 陳志華 , CHEN, CHIH HUA , 葉恩祥 , YEH, EN HSIANG , 呂孟昇 , LIU, MONSEN , 陳承先 , CHEN, CHEN SHIEN
CPC classification number: H01L21/76885 , H01L21/568 , H01L21/6835 , H01L23/5389 , H01L24/19 , H01L24/83 , H01L24/97 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2221/68327 , H01L2221/6834 , H01L2221/68372 , H01L2224/12105 , H01L2224/16225 , H01L2224/73267 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2224/82 , H01L2224/81 , H01L2924/00
Abstract: 本揭露係提供封裝裝置及其製造方法,及提供半導體裝置之封裝方法。在一實施例中,封裝裝置包含基材,此基材包含一積體電路安裝區及一預防底部填充材料流動之元件圍繞此積體電路安裝區設置。
Abstract in simplified Chinese: 本揭露系提供封装设备及其制造方法,及提供半导体设备之封装方法。在一实施例中,封装设备包含基材,此基材包含一集成电路安装区及一预防底部填充材料流动之组件围绕此集成电路安装区设置。
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公开(公告)号:TW201405766A
公开(公告)日:2014-02-01
申请号:TW102121683
申请日:2013-06-19
Inventor: 羅雪怡 , LO, SUT-I , 蕭景文 , HSIAO, CHING WEN , 陳旭賢 , CHEN, HSU HSIEN , 陳承先 , CHEN, CHEN SHIEN
CPC classification number: H01L21/56 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L23/642 , H01L24/19 , H01L24/20 , H01L25/105 , H01L28/40 , H01L28/60 , H01L2224/12105 , H01L2224/2413 , H01L2224/73267 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00
Abstract: 一種封裝結構,包括一晶粒、一包覆層與一電容器。上述封裝物具有一封裝物第一側以及一封裝物第二側。上述晶粒具有一晶粒第一側相對於該封裝物第一側,以及一晶粒第二側相對於該封裝物第二側,該晶粒第一側係相對於該晶粒第二側。而該包覆層係環繞該晶粒。該電容器包括位於該包覆層內之一第一極板以及一第二極板,該第一極板與該第二極板之相對表面係沿自該封裝物第一側至該封裝物第二側之一方向而延伸。複數個外部導電連結物則接合於至少該封裝物第一側與該封裝物第二側其中之一。
Abstract in simplified Chinese: 一种封装结构,包括一晶粒、一包覆层与一电容器。上述封装物具有一封装物第一侧以及一封装物第二侧。上述晶粒具有一晶粒第一侧相对于该封装物第一侧,以及一晶粒第二侧相对于该封装物第二侧,该晶粒第一侧系相对于该晶粒第二侧。而该包覆层系环绕该晶粒。该电容器包括位于该包覆层内之一第一极板以及一第二极板,该第一极板与该第二极板之相对表面系沿自该封装物第一侧至该封装物第二侧之一方向而延伸。复数个外部导电链接物则接合于至少该封装物第一侧与该封装物第二侧其中之一。
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公开(公告)号:TWI576983B
公开(公告)日:2017-04-01
申请号:TW104133661
申请日:2015-10-14
Inventor: 曾華偉 , TSENG, HUA WEI , 杜尚耘 , TU, SHANG YUN , 陳旭賢 , CHEN, HSU HSIEN , 劉浩君 , LIU, HAO JUIN , 陳承先 , CHEN, CHEN SHIEN , 曾明鴻 , TSENG, MING HUNG , 莊其達 , CHUANG, CHITA
IPC: H01L25/065 , H01L23/31 , H01L23/00
CPC classification number: H01L25/0657 , H01L21/563 , H01L23/3142 , H01L23/3157 , H01L23/3171 , H01L23/3192 , H01L23/53214 , H01L23/53233 , H01L23/53257 , H01L23/5329 , H01L23/562 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0231 , H01L2224/02351 , H01L2224/0239 , H01L2224/0345 , H01L2224/03462 , H01L2224/03614 , H01L2224/0362 , H01L2224/03831 , H01L2224/0391 , H01L2224/0401 , H01L2224/05017 , H01L2224/05085 , H01L2224/05548 , H01L2224/05557 , H01L2224/05558 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05681 , H01L2224/05687 , H01L2224/1132 , H01L2224/11424 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/11903 , H01L2224/13017 , H01L2224/13018 , H01L2224/13022 , H01L2224/13024 , H01L2224/1308 , H01L2224/13083 , H01L2224/13084 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16145 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81815 , H01L2224/83102 , H01L2224/83862 , H01L2224/92125 , H01L2225/06513 , H01L2924/351 , H01L2924/3512 , H01L2924/35121 , H01L2924/381 , H01L2924/00014 , H01L2924/01029 , H01L2924/01082 , H01L2924/01047 , H01L2924/0103 , H01L2924/01083 , H01L2924/01049 , H01L2924/01079 , H01L2924/01051 , H01L2924/00012 , H01L2924/0665 , H01L2924/04941 , H01L2924/04953 , H01L2924/01013 , H01L2924/00
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公开(公告)号:TW201626539A
公开(公告)日:2016-07-16
申请号:TW104133661
申请日:2015-10-14
Inventor: 曾華偉 , TSENG, HUA WEI , 杜尚耘 , TU, SHANG YUN , 陳旭賢 , CHEN, HSU HSIEN , 劉浩君 , LIU, HAO JUIN , 陳承先 , CHEN, CHEN SHIEN , 曾明鴻 , TSENG, MING HUNG , 莊其達 , CHUANG, CHITA
IPC: H01L25/065 , H01L23/31 , H01L23/00
CPC classification number: H01L25/0657 , H01L21/563 , H01L23/3142 , H01L23/3157 , H01L23/3171 , H01L23/3192 , H01L23/53214 , H01L23/53233 , H01L23/53257 , H01L23/5329 , H01L23/562 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0231 , H01L2224/02351 , H01L2224/0239 , H01L2224/0345 , H01L2224/03462 , H01L2224/03614 , H01L2224/0362 , H01L2224/03831 , H01L2224/0391 , H01L2224/0401 , H01L2224/05017 , H01L2224/05085 , H01L2224/05548 , H01L2224/05557 , H01L2224/05558 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05681 , H01L2224/05687 , H01L2224/1132 , H01L2224/11424 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/11903 , H01L2224/13017 , H01L2224/13018 , H01L2224/13022 , H01L2224/13024 , H01L2224/1308 , H01L2224/13083 , H01L2224/13084 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16145 , H01L2224/16227 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81815 , H01L2224/83102 , H01L2224/83862 , H01L2224/92125 , H01L2225/06513 , H01L2924/351 , H01L2924/3512 , H01L2924/35121 , H01L2924/381 , H01L2924/00014 , H01L2924/01029 , H01L2924/01082 , H01L2924/01047 , H01L2924/0103 , H01L2924/01083 , H01L2924/01049 , H01L2924/01079 , H01L2924/01051 , H01L2924/00012 , H01L2924/0665 , H01L2924/04941 , H01L2924/04953 , H01L2924/01013 , H01L2924/00
Abstract: 一半導體封裝結構具有包括一傳導墊之第一半導體基板;以及位於傳導墊上之傳導柱,所述傳導柱設於第一半導體基板與第二半導體基板之間。傳導墊與第一半導體基板之電路耦接。傳導柱沿著縱軸並朝向第二半導體基板而延伸。傳導柱有一側壁,側壁上有朝向縱軸而內凹之粗糙表面。
Abstract in simplified Chinese: 一半导体封装结构具有包括一传导垫之第一半导体基板;以及位于传导垫上之传导柱,所述传导柱设于第一半导体基板与第二半导体基板之间。传导垫与第一半导体基板之电路耦接。传导柱沿着纵轴并朝向第二半导体基板而延伸。传导柱有一侧壁,侧壁上有朝向纵轴而内凹之粗糙表面。
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