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公开(公告)号:TWI431744B
公开(公告)日:2014-03-21
申请号:TW100105364
申请日:2011-02-18
Inventor: 林正忠 , LIN, CHENG CHUNG , 劉重希 , LIU, CHUNG SHI , 周孟緯 , CHOU, MENG WEI , 林國誠 , LIN, KUO CHENG , 呂文雄 , LU, WEN HSIUNG , 黃見翎 , HWANG, CHIEN LING , 黃英叡 , HUANG, YING JUI , 陸德源 , LU, DE YUAN
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L24/11 , H01L21/02052 , H01L21/32125 , H01L21/76873 , H01L21/76885 , H01L23/488 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2221/1084 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05541 , H01L2224/05573 , H01L2224/1111 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/11614 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/1191 , H01L2224/11912 , H01L2224/13005 , H01L2224/13017 , H01L2224/13018 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0541 , H01L2924/07025 , H01L2924/10329 , H01L2924/14 , H01L2924/20102 , H01L2924/3512 , H01L2924/381 , H01L2924/3841 , H01L2924/0105 , H01L2924/00014 , H01L2224/13099 , H01L2924/207
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公开(公告)号:TW201401482A
公开(公告)日:2014-01-01
申请号:TW102119883
申请日:2013-06-05
Inventor: 徐君蕾 , HSU, CHUN LEI , 劉重希 , LIU, CHUNG SHI , 陸德源 , LU, DE YUAN , 何明哲 , HO, MING CHE , 陳玉芬 , CHEN, YU FENG
CPC classification number: H01L25/50 , H01L21/4857 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L24/16 , H01L24/81 , H01L25/105 , H01L2224/16225 , H01L2224/16238 , H01L2224/26175 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/81 , H01L2224/81193 , H01L2224/81411 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/00 , H01L2924/00012 , H01L2924/10253 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15321 , H01L2924/15323 , H01L2924/15331 , H01L2924/15333 , H01L2924/157 , H01L2924/15788 , H01L2924/18161 , H01L2924/3651
Abstract: 本發明一實施例提供一種堆疊式封裝元件,包括:一第一封裝晶片;一第二封裝晶片,耦接第一封裝晶片;以及多個金屬柱,耦接第一封裝晶片,各金屬柱包括一第一部分與一第二部分,其中第一部分接近第一封裝晶片,第二部分配置於第一部分上,各金屬柱耦接至一接近第二封裝晶片的焊料接點。
Abstract in simplified Chinese: 本发明一实施例提供一种堆栈式封装组件,包括:一第一封装芯片;一第二封装芯片,耦接第一封装芯片;以及多个金属柱,耦接第一封装芯片,各金属柱包括一第一部分与一第二部分,其中第一部分接近第一封装芯片,第二部分配置于第一部分上,各金属柱耦接至一接近第二封装芯片的焊料接点。
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公开(公告)号:TWI524499B
公开(公告)日:2016-03-01
申请号:TW102119883
申请日:2013-06-05
Inventor: 徐君蕾 , HSU, CHUN LEI , 劉重希 , LIU, CHUNG SHI , 陸德源 , LU, DE YUAN , 何明哲 , HO, MING CHE , 陳玉芬 , CHEN, YU FENG
CPC classification number: H01L25/50 , H01L21/4857 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L24/16 , H01L24/81 , H01L25/105 , H01L2224/16225 , H01L2224/16238 , H01L2224/26175 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/81 , H01L2224/81193 , H01L2224/81411 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/00 , H01L2924/00012 , H01L2924/10253 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15321 , H01L2924/15323 , H01L2924/15331 , H01L2924/15333 , H01L2924/157 , H01L2924/15788 , H01L2924/18161 , H01L2924/3651
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4.半導體裝置及其製法 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME 审中-公开
Simplified title: 半导体设备及其制法 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME公开(公告)号:TW201209976A
公开(公告)日:2012-03-01
申请号:TW100105364
申请日:2011-02-18
Applicant: 台灣積體電路製造股份有限公司
IPC: H01L
CPC classification number: H01L24/11 , H01L21/02052 , H01L21/32125 , H01L21/76873 , H01L21/76885 , H01L23/488 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2221/1084 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05541 , H01L2224/05573 , H01L2224/1111 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/11474 , H01L2224/11614 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/1191 , H01L2224/11912 , H01L2224/13005 , H01L2224/13017 , H01L2224/13018 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0541 , H01L2924/07025 , H01L2924/10329 , H01L2924/14 , H01L2924/20102 , H01L2924/3512 , H01L2924/381 , H01L2924/3841 , H01L2924/0105 , H01L2924/00014 , H01L2224/13099 , H01L2924/207
Abstract: 本發明提供一種焊料柱狀凸塊。藉由電鍍導電材料於積體電路端點之上,以形成導電材料之柱狀物,亦即柱狀凸塊連接點係形成於輸出/輸入端點之上。柱狀凸塊之底端部分具有比上段部分更寬的之寬度。柱狀凸塊之底部部分之剖面圖可形成梯形、矩形或傾斜形狀。焊料材料可形成於柱狀結構上表面上。因此,焊接柱狀凸塊之成品形成細微間距(fine pitch)封裝焊料連接,此結構比先前技術更具可靠度(reliable)。
Abstract in simplified Chinese: 本发明提供一种焊料柱状凸块。借由电镀导电材料于集成电路端点之上,以形成导电材料之柱状物,亦即柱状凸块连接点系形成于输出/输入端点之上。柱状凸块之底端部分具有比上段部分更宽的之宽度。柱状凸块之底部部分之剖面图可形成梯形、矩形或倾斜形状。焊料材料可形成于柱状结构上表面上。因此,焊接柱状凸块之成品形成细微间距(fine pitch)封装焊料连接,此结构比先前技术更具可靠度(reliable)。
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