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公开(公告)号：TWI598970B
公开(公告)日：2017-09-11
申请号：TW103145405
申请日：2014-12-25
发明人： 李立國 , LEE, LI GUO , 劉永盛 , LIU, YUNG SHENG , 劉宜臻 , LIU, YI CHEN , 賴怡仁 , LAI, YI JEN , 陳俊仁 , CHEN, CHUN JEN , 鄭錫圭 , CHENG, HSI KUEI
IPC分类号： H01L21/60 , H01L23/488
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/81 , H01L2224/0345 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05023 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05184 , H01L2224/05556 , H01L2224/05568 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/11831 , H01L2224/13007 , H01L2224/13017 , H01L2224/13018 , H01L2224/13021 , H01L2224/13023 , H01L2224/13076 , H01L2224/13082 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/81191 , H01L2224/81815 , H01L2924/13091 , H01L2924/00012 , H01L2924/00
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公开(公告)号：TWI582930B
公开(公告)日：2017-05-11
申请号：TW099125728
申请日：2010-08-03
发明人： 黃見翎 , HWANG, CHIEN LING , 吳逸文 , WU, YI WEN , 王俊傑 , WANG, CHUN CHIEH , 劉重希 , LIU, CHUNG SHI
IPC分类号： H01L23/488
CPC分类号： H01L21/76885 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/023 , H01L2224/0345 , H01L2224/0361 , H01L2224/03614 , H01L2224/03901 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05024 , H01L2224/05073 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05578 , H01L2224/05647 , H01L2224/0569 , H01L2224/10126 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11614 , H01L2224/1182 , H01L2224/11827 , H01L2224/11849 , H01L2224/11901 , H01L2224/11912 , H01L2224/13099 , H01L2224/13147 , H01L2224/13561 , H01L2224/13562 , H01L2224/13564 , H01L2224/13565 , H01L2224/13582 , H01L2224/13583 , H01L2224/13609 , H01L2224/13611 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/1369 , H01L2224/16238 , H01L2224/81024 , H01L2224/81191 , H01L2224/814 , H01L2224/81411 , H01L2224/81413 , H01L2224/81416 , H01L2224/81439 , H01L2224/81447 , H01L2224/81455 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/206 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/01028 , H01L2924/01022 , H01L2924/01046 , H01L2924/01083 , H01L2924/01051 , H01L2924/00
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公开(公告)号：TWI437679B
公开(公告)日：2014-05-11
申请号：TW099136436
申请日：2010-10-26
发明人： 沈文維 , SHEN, WEN WEI , 施應慶 , SHIH, YING CHING , 陳承先 , CHEN, CHEN SHIEN , 陳明發 , CHEN, MING FA
IPC分类号： H01L23/52 , H01L21/768
CPC分类号： H01L25/0657 , H01L21/486 , H01L23/3114 , H01L23/3192 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/5384 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/50 , H01L2224/0345 , H01L2224/03452 , H01L2224/0381 , H01L2224/03831 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/1162 , H01L2224/11622 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/13016 , H01L2224/13025 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13169 , H01L2224/1354 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06568 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2224/05552 , H01L2924/00
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4.发明专利矽晶圓上的直通矽穿孔的製造 FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS 审中-公开硅晶圆上的直通硅穿孔的制造 FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
公开(公告)号：TW201250882A
公开(公告)日：2012-12-16
申请号：TW100145067
申请日：2011-12-07
申请人： 應用材料股份有限公司
IPC分类号： H01L
CPC分类号： H01L24/13 , H01L21/02074 , H01L21/0214 , H01L21/02164 , H01L21/0217 , H01L21/02274 , H01L21/3065 , H01L21/31116 , H01L21/67103 , H01L21/67109 , H01L21/6719 , H01L21/6835 , H01L21/68792 , H01L21/76829 , H01L21/76831 , H01L21/76832 , H01L21/76834 , H01L21/76898 , H01L24/11 , H01L24/742 , H01L2221/68372 , H01L2221/68381 , H01L2224/11002 , H01L2224/11452 , H01L2224/1182 , H01L2224/13562 , H01L2224/1357 , H01L2224/13687 , H01L2224/742 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H01L2924/05042 , H01L2924/00
摘要： 一種直通矽穿孔製造方法包括以下步驟:在矽板中蝕刻複數個直通孔。將氧化物襯沉積在矽板之表面上並且沉積在直通孔之側壁及底壁上。然後,在直通孔中沉積金屬導體。在可與氧化物襯同時使用之另一方案中,將氮化矽鈍化層沉積在基板之矽板之曝露後表面上。
简体摘要： 一种直通硅穿孔制造方法包括以下步骤:在硅板中蚀刻复数个直通孔。将氧化物衬沉积在硅板之表面上并且沉积在直通孔之侧壁及底壁上。然后,在直通孔中沉积金属导体。在可与氧化物衬同时使用之另一方案中,将氮化硅钝化层沉积在基板之硅板之曝露后表面上。
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5.发明专利半導體結構及形成元件的方法 SEMICONDUCTOR STRUCTURES AND METHOD OF FORMING A DEVICE 审中-公开半导体结构及形成组件的方法 SEMICONDUCTOR STRUCTURES AND METHOD OF FORMING A DEVICE
公开(公告)号：TW201203481A
公开(公告)日：2012-01-16
申请号：TW099137918
申请日：2010-11-04
申请人： 台灣積體電路製造股份有限公司
IPC分类号： H01L
CPC分类号： H01L23/3171 , H01L23/3192 , H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0345 , H01L2224/03452 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05166 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/11444 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/1147 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13099 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/1403 , H01L2224/14051 , H01L2224/14131 , H01L2224/14179 , H01L2224/14515 , H01L2224/14517 , H01L2224/16145 , H01L2224/16225 , H01L2224/17051 , H01L2224/17517 , H01L2224/29011 , H01L2224/29013 , H01L2224/29101 , H01L2224/29111 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2224/83193 , H01L2225/06513 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/01007 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： 本發明提供用於半導體元件的基底支撐架，在第一基底上形成主動支柱與偽支柱，使得偽支柱的高度大於主動支柱的高度，當第一基底接合至第二基底時，使用偽支柱作為支撐架可產生較佳的均勻性。在一實施例中，藉由圖案化遮罩的形成，可同時形成偽支柱與主動支柱，圖案化遮罩中用於偽支柱的開口之寬度小於主動支柱。當使用類似電鍍的製程形成偽支柱與主動支柱時，因為圖案化遮罩中偽支柱開口的寬度較小，使得偽支柱的高度大於主動支柱。
简体摘要： 本发明提供用于半导体组件的基底支撑架，在第一基底上形成主动支柱与伪支柱，使得伪支柱的高度大于主动支柱的高度，当第一基底接合至第二基底时，使用伪支柱作为支撑架可产生较佳的均匀性。在一实施例中，借由图案化遮罩的形成，可同时形成伪支柱与主动支柱，图案化遮罩中用于伪支柱的开口之宽度小于主动支柱。当使用类似电镀的制程形成伪支柱与主动支柱时，因为图案化遮罩中伪支柱开口的宽度较小，使得伪支柱的高度大于主动支柱。
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6.发明专利積體電路元件與封裝組件 INTEGRATED CIRCUIT DEVICES AND PACKAGING ASSEMBLY 审中-公开集成电路组件与封装组件 INTEGRATED CIRCUIT DEVICES AND PACKAGING ASSEMBLY
公开(公告)号：TW201138042A
公开(公告)日：2011-11-01
申请号：TW099135516
申请日：2010-10-19
申请人： 台灣積體電路製造股份有限公司
IPC分类号： H01L
CPC分类号： H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/0345 , H01L2224/0401 , H01L2224/05023 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05568 , H01L2224/05582 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05681 , H01L2224/05687 , H01L2224/10145 , H01L2224/11002 , H01L2224/1112 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11827 , H01L2224/11831 , H01L2224/11849 , H01L2224/11912 , H01L2224/13005 , H01L2224/13007 , H01L2224/13023 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13123 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13169 , H01L2224/1317 , H01L2224/13171 , H01L2224/13181 , H01L2224/13551 , H01L2224/13561 , H01L2224/13565 , H01L2224/1357 , H01L2224/1358 , H01L2224/13582 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13686 , H01L2224/13687 , H01L2224/13688 , H01L2224/1369 , H01L2224/81192 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/94 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/3841 , H01L2924/0105 , H01L2224/11 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/00 , H01L2224/05552
摘要： 本發明提供側壁保護結構,覆蓋凸塊結構的側壁表面的至少一部份,在銅柱側壁上以及凸塊下金屬(UBM)層的表面區域上的保護結構由至少一非金屬材料層形成,例如介電材料層、高分子材料層或前述之組合。
简体摘要： 本发明提供侧壁保护结构,覆盖凸块结构的侧壁表面的至少一部份,在铜柱侧壁上以及凸块下金属(UBM)层的表面区域上的保护结构由至少一非金属材料层形成,例如介电材料层、高分子材料层或前述之组合。
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公开(公告)号：TW201705366A
公开(公告)日：2017-02-01
申请号：TW105108445
申请日：2016-03-18
申请人： 艾馬克科技公司 , AMKOR TECHNOLOGY, INC.
发明人： 韓意書 , HAN, YI SEUL , 新及補 , SHIM, JAE BEUM , 金本俊 , KIM, BYONG JIN , 朴銀班 , PARK, IN BAE
IPC分类号： H01L21/768 , H01L21/683 , H01L21/288 , H01L21/56
CPC分类号： H01L21/6836 , H01L21/2885 , H01L21/76885 , H01L23/3114 , H01L23/3192 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/94 , H01L2224/02311 , H01L2224/02313 , H01L2224/02331 , H01L2224/0235 , H01L2224/0239 , H01L2224/024 , H01L2224/03009 , H01L2224/0345 , H01L2224/03462 , H01L2224/03614 , H01L2224/0391 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05569 , H01L2224/05647 , H01L2224/05655 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11848 , H01L2224/11849 , H01L2224/1191 , H01L2224/13017 , H01L2224/13022 , H01L2224/13024 , H01L2224/13025 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1316 , H01L2224/13166 , H01L2224/13171 , H01L2224/13184 , H01L2224/1329 , H01L2224/13294 , H01L2224/133 , H01L2224/13562 , H01L2224/13564 , H01L2224/13566 , H01L2224/136 , H01L2224/94 , H01L2924/01029 , H01L2924/01013 , H01L2924/01028 , H01L2924/01026 , H01L2924/01047 , H01L2924/01079 , H01L2924/01022 , H01L2924/01024 , H01L2924/01074 , H01L2924/00014 , H01L2224/05147 , H01L2924/0665 , H01L2924/00012 , H01L2924/014 , H01L2224/11 , H01L2224/03 , H01L2224/0231
摘要： 一種電子裝置以及一種製造電子裝置之方法。作為非限制性的例子的是，此揭露內容的各種特點係提供各種製造電子裝置之方法以及藉此所製造的電子裝置，其係利用一種膜輔助的模製製程。
简体摘要： 一种电子设备以及一种制造电子设备之方法。作为非限制性的例子的是，此揭露内容的各种特点系提供各种制造电子设备之方法以及借此所制造的电子设备，其系利用一种膜辅助的模制制程。
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公开(公告)号：TWI552292B
公开(公告)日：2016-10-01
申请号：TW103123585
申请日：2014-07-09
发明人： 貝哈卡爾 馬希斯 安特 , BHATKAR, MAHESH ANANT , 陳 元文 , TAN, JUAN BOON , 劉 威 , LIU, WEI , 歐沙德 詹 , OSWALD, JENS
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L24/13 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/0345 , H01L2224/03831 , H01L2224/0384 , H01L2224/0401 , H01L2224/05085 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05647 , H01L2224/10126 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11616 , H01L2224/13022 , H01L2224/13147 , H01L2224/13565 , H01L2224/1357 , H01L2224/13647 , H01L2924/13091 , H01L2924/14 , H01L2924/384 , H01L2924/00 , H01L2924/00014 , H01L2924/04941 , H01L2924/04953
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公开(公告)号：TW201608653A
公开(公告)日：2016-03-01
申请号：TW104114915
申请日：2015-05-11
发明人： 黃文濬 , HUANG, WENCHUN , 李建成 , LI, CHIENCHEN , 劉國洲 , LIU, KUOCHIO , 薛瑞雲 , SHIUE, RUEYYUN , 鄭錫圭 , CHENG, HSIKUEI , 林志賢 , LIN, CHIHHSIEN , 林俊成 , LIN, JINGCHENG , 陸湘台 , LU, HSIANGTAI , 謝子逸 , SHIEH, TZIYI
CPC分类号： H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012
摘要： 本揭露的實施例包含半導體封裝體及其製造方法。一實施例為方法，包含安裝一晶粒至一基板的頂表面，以形成一元件，密封晶粒及基板的頂表面於一模塑化合物內，此模塑化合物於晶粒上具有一第一厚度，以及移除模塑化合物於晶粒上的厚度的一部分，而非全部。此方法更包含對元件進行進一步的處理，以及移除模塑化合物於晶粒上的剩餘厚度。
简体摘要： 本揭露的实施例包含半导体封装体及其制造方法。一实施例为方法，包含安装一晶粒至一基板的顶表面，以形成一组件，密封晶粒及基板的顶表面于一模塑化合物内，此模塑化合物于晶粒上具有一第一厚度，以及移除模塑化合物于晶粒上的厚度的一部分，而非全部。此方法更包含对组件进行进一步的处理，以及移除模塑化合物于晶粒上的剩余厚度。
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公开(公告)号：TW201537679A
公开(公告)日：2015-10-01
申请号：TW103146103
申请日：2014-12-29
发明人： 陳憲偉 , CHEN, HSIENWEI , 陳潔 , CHEN, JIE , 葉德強 , YEH, DERCHYANG , 鄭心圃 , JENG, SHINPUU , 余振華 , YU, CHENHUA
IPC分类号： H01L21/768 , H01L23/48
CPC分类号： H01L25/0655 , H01L21/4857 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/5383 , H01L23/5389 , H01L23/544 , H01L24/03 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/81 , H01L24/96 , H01L25/105 , H01L25/50 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/02319 , H01L2224/03438 , H01L2224/0345 , H01L2224/0401 , H01L2224/04105 , H01L2224/05166 , H01L2224/05568 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05684 , H01L2224/06181 , H01L2224/11332 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/12105 , H01L2224/13005 , H01L2224/13006 , H01L2224/13022 , H01L2224/13023 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13181 , H01L2224/16237 , H01L2224/17181 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2224/96 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/12042 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2224/13124 , H01L2924/01082 , H01L2224/03 , H01L2224/11 , H01L2924/2064 , H01L2924/01046 , H01L2924/01079 , H01L2924/01029 , H01L2924/014 , H01L2924/01074
摘要： 本揭露之實施方式包含半導體封裝件與其形成方法。實施方式之一為一種半導體封裝件，其包含第一封裝件，第一封裝件包含一或多個第一晶片，以及半導體封裝件包含第一重分佈層，其透過第一組接合點於第一封裝件之第一側邊耦合至一或多個的第一晶片，第一重分佈層包含設置於多於一個鈍化層中的多於一個金屬層，第一組接合點直接耦合至一或多個金屬層的其中至少一者，且第一組連接部耦合至第二重分佈層的第二側邊，第二側邊相對第一側邊。
简体摘要： 本揭露之实施方式包含半导体封装件与其形成方法。实施方式之一为一种半导体封装件，其包含第一封装件，第一封装件包含一或多个第一芯片，以及半导体封装件包含第一重分布层，其透过第一组接合点于第一封装件之第一侧边耦合至一或多个的第一芯片，第一重分布层包含设置于多于一个钝化层中的多于一个金属层，第一组接合点直接耦合至一或多个金属层的其中至少一者，且第一组连接部耦合至第二重分布层的第二侧边，第二侧边相对第一侧边。
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