公开(公告)号：US20110056623A1

公开(公告)日：2011-03-10

申请号：US12615456

申请日：2009-11-10

Applicant: Min-Ho IM ,  Sung-Hwan Choi ,  Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jeon

Inventor： Min-Ho IM ,  Sung-Hwan Choi ,  Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jeon

IPC: B29C65/02

CPC classification number: C09J5/06 ,  B32B37/0015 ,  B32B37/06 ,  B32B2457/14 ,  C08G2650/56 ,  C08L31/06 ,  C08L75/14 ,  C08L2205/05 ,  C09J7/35 ,  C09J171/00 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/568 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/48175 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: This disclosure provides a method for laminating an adhesive tape and a lead frame, more specifically to reduce the warpage of a lead frame after heated lamination in which an adhesive tape for manufacturing semiconductor devices is attached to the lead frame, satisfying all the properties required for lamination, and avoiding adhesive residues from adhesive tapes and the leakage of a sealing resin. A method for laminating an adhesive tape and a lead frame comprises laminating an adhesive tape and a lead, wherein the lamination temperature of an adhesive tape surface and that of a lead frame surface are different from each other, for example, wherein the lamination temperature of the lead frame surface is lower than that of the adhesive tape surface by about 1 to about 200° C.

Abstract translation: 本公开内容提供了一种用于层压粘合带和引线框架的方法，更具体地说是为了减少加热层压之后的引线框架的翘曲，其中用于制造半导体器件的胶带粘附到引线框架上，满足所有的性能 层压，并避免胶带的粘合剂残留和密封树脂的泄漏。 粘合带和引线框架的层压方法包括层压粘合带和引线，其中粘合带表面和引线框架表面的层压温度彼此不同，例如其中层压温度为 引线框架表面比粘合带表面低约1至约200℃。

公开(公告)号：US08524833B2

公开(公告)日：2013-09-03

申请号：US12496768

申请日：2009-07-02

Applicant: Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jun

Inventor： Chang-Hoon Sim ,  Ki-Jeong Moon ,  Hae-Sang Jun

IPC: C08L63/02 ,  F21V9/00

CPC classification number: G02B1/04 ,  C08J5/18 ,  C08J2323/06 ,  C08J2371/12 ,  G02B5/0242 ,  G02B5/0278

Abstract: A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.

Abstract translation: 高效光扩散聚合物膜包括第一聚合物，其是透光介质，和形成光散射颗粒的第二聚合物，其中所述聚合物是不混溶的，折射率差为约0.001至约0.5，聚合物 相对于100重量份的第一聚合物，膜包含约30至约70重量份的第二聚合物。 进行制造高效聚合物膜的方法，使得第一聚合物形成连续相，第二聚合物通过涂布或挤出形成分散相。

公开(公告)号：US20120269990A1

公开(公告)日：2012-10-25

申请号：US13311369

申请日：2011-12-05

Applicant: Chang-Hoon SIM ,  Yeun-Soo KIM ,  Ki-Jeong MOON

Inventor： Chang-Hoon SIM ,  Yeun-Soo KIM ,  Ki-Jeong MOON

IPC: B32B27/00 ,  C08L71/10 ,  C08G65/28 ,  C08L33/00 ,  B32B27/08 ,  B32B5/00

CPC classification number: C08G65/48 ,  C08G18/4879 ,  C08G2650/56 ,  C08L71/00 ,  C08L75/08 ,  Y10T428/1086 ,  Y10T428/269 ,  C08L75/16

Abstract: Provided are a phenoxy resin composition for transparent plastic substrate and a transparent plastic substrate using the phenoxy resin composition, capable of effectively substituting for a conventional glass substrate since having excellent thermal and chemical resistance, high adhesiveness, low water infiltration, and a small coefficient of linear thermal expansion. In one general aspect, there is provided a phenoxy resin composition for transparent plastic substrate, including: phenoxy resin having a chemical structure expressed as follows: wherein the n value is 35 to 400.

Abstract translation: 提供一种透明塑料基材用苯氧基树脂组合物和使用该苯氧基树脂组合物的透明塑料基材，其能够有效地代替传统的玻璃基材，因为具有优异的耐热和耐化学性，高粘合性，低水渗透性和小系数 线性热膨胀。 一方面，提供了一种透明塑料基材用苯氧基树脂组合物，其包含：具有如下表示的化学结构的苯氧基树脂：其中n值为35〜400。

公开(公告)号：US20070126129A1

公开(公告)日：2007-06-07

申请号：US11633414

申请日：2006-12-05

Applicant: Yong-Kook Ahn ,  Chang-Hoon Sim ,  Kyo-Sung Hwang

Inventor： Yong-Kook Ahn ,  Chang-Hoon Sim ,  Kyo-Sung Hwang

IPC: H01L23/48

CPC classification number: H01L21/6836 ,  C09J7/35 ,  C09J7/381 ,  C09J2203/326 ,  C09J2409/00 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512

Abstract: Disclosed is a die bonding adhesive tape, which eliminates the requirement for additional adhesive tape for attaching a ring frame, decreases the curing time period upon die bonding, essentially prevents the transfer and diffusion of low-molecular-weight compounds between an adhesive film and an adhesive layer on a base substrate to thus exhibit excellent pick-up performance when picking up a die, and easily separates an adhesive film having a die from an adhesive layer on a base substrate when picking up slim and large dies. The die bonding adhesive tape of the invention includes a base substrate and an adhesive layer formed on the base substrate, has a structure in which a core film having a die bonding adhesive film attached thereto is bonded onto the adhesive layer, and enables direct die bonding via dicing and then die pick-up in a state of being mounted on a wafer.

Abstract translation: 公开了一种芯片粘合胶带，其消除了用于附接环框架的附加粘合带的需求，减少了芯片粘合时的固化时间段，基本上防止了低分子量化合物在粘合膜和 粘合剂层，从而在拾取模具时表现出优异的拾取性能，并且当拾取薄型和大型模具时，容易将具有模具的粘合剂膜与基材上的粘合剂层分离。 本发明的芯片接合胶带包括基底基材和形成在基底基材上的粘合剂层，具有其中附着有芯片接合粘合剂膜的芯膜粘合到粘合剂层上的结构，并且能够直接芯片粘合 通过切割，然后在安装在晶片上的状态下进行模头拾取。

公开(公告)号：US09090800B2

公开(公告)日：2015-07-28

申请号：US13254939

申请日：2009-03-09

Applicant: Sung-Hwan Choi ,  Ki-Jeong Moon ,  Hae-Sang Jeon ,  Chang-Hoon Sim

Inventor： Sung-Hwan Choi ,  Ki-Jeong Moon ,  Hae-Sang Jeon ,  Chang-Hoon Sim

IPC: C09J7/02 ,  C09J175/16 ,  C09J171/00 ,  C08L75/16 ,  C08L71/00 ,  C08L33/08

CPC classification number: C09J7/0242 ,  C08G2650/56 ,  C08L33/08 ,  C08L2312/06 ,  C08L2666/04 ,  C09J7/22 ,  C09J7/35 ,  C09J171/00 ,  C09J2463/00 ,  Y02P20/149 ,  Y10T428/2878

Abstract: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.

Abstract translation: 提供了一种用于制造电子部件的胶带，包括耐热基材和含有设置在耐热基材上的粘合剂组合物的粘合剂层，其中粘合剂组合物包含苯氧树脂，固化剂，能量射线固化丙烯酸 树脂和光引发剂，并且其中粘合剂层通过加热和能量射线固化。

公开(公告)号：US08263428B2

公开(公告)日：2012-09-11

申请号：US13254241

申请日：2010-03-22

Applicant: Chang-Hoon Sim ,  Sang-Pil Kim ,  Ki-Jeong Moon

Inventor： Chang-Hoon Sim ,  Sang-Pil Kim ,  Ki-Jeong Moon

IPC: H01L21/00

CPC classification number: H01G9/2009 ,  H01G9/2031 ,  H01G9/2059 ,  Y02E10/542 ,  Y02P70/521

Abstract: This disclosure provides polymer electrolytes for dye-sensitized solar cells that can not only prevent electrolytes from leaking, but also exhibit a higher solar conversion efficiency when compared with conventional polymer electrolytes, whereby the polymer electrolytes are applicable to a process for manufacturing dye-sensitized solar cells with a large surface area or flexible dye-sensitized solar cells, and methods for manufacturing modules of dye-sensitized solar cells using the same.

Abstract translation: 该公开内容提供了用于染料敏化太阳能电池的聚合物电解质，其不仅可以防止电解质泄漏，而且与常规的聚合物电解质相比也显示出更高的太阳能转换效率，由此聚合物​​电解质可用于制造染料敏化太阳能的方法 具有大表面积的电池或柔性染料敏化太阳能电池，以及使用其制造染料敏化太阳能电池组件的方法。

公开(公告)号：US20090294046A1

公开(公告)日：2009-12-03

申请号：US11950454

申请日：2007-12-05

Applicant: Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun

Inventor： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun

IPC: B32B37/00 ,  H01B5/00

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/083 ,  H05K2203/104

Abstract: The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.

Abstract translation: 本发明涉及用于粘附IC的各向异性导电膜，例如LCD显示器等。导电膜的特征在于包括热固性粘合剂，超顺磁性金属氧化物纳米颗粒和导电颗粒，超顺磁性金属氧化物纳米 颗粒和导电颗粒分散在热固性组合物中。 通过本发明的这样的结构，通过高频实现低温固化是有利的，并且可以通过粘附IC（例如LCD显示器）中的磁场来控制颗粒的位置，使得高连接可靠性 实现了细间距连接电极。

公开(公告)号：US20080226884A1

公开(公告)日：2008-09-18

申请号：US11950470

申请日：2007-12-05

Applicant: Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun ,  Jun-Ho Lee ,  Yun-Min Park

Inventor： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun ,  Jun-Ho Lee ,  Yun-Min Park

IPC: B32B7/02 ,  B32B27/38

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J2201/36 ,  C09J2461/00 ,  C09J2463/00 ,  H01L25/0657 ,  H01L2224/26135 ,  H01L2224/29083 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10T428/24975 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The invention concerns an adhesive film for stacking chips which enables chips to be stacked in layers without using a separate spacer usually provided to keep a given distance between wires of an upper chip and a lower chip to have the same area. The adhesive film of the invention has an intermediate adhesive layer of thermoplastic phenoxy resin on both side of which a thermosetting adhesive layer of epoxy resin is placed, respectively, to make a three-layer structure, the thermoplastic phenoxy resin comprising UV curable small molecule compounds. The adhesive film of the invention is a multi-layered adhesive film produced by a method of comprising the steps of achieving compatibility on an interface between the thermosetting epoxy resin and thermoplastic phenoxy resin and then directly forming a phenoxy film of a high elastic modulus through UV curing in an adhesive film. With such a configuration, the adhesive film for stacking semiconductor chips according to the invention enables the semiconductor silicone chips to be stacked in 3 or more layers without using a separate spacer between chips in order to keep a wire distance between upper and lower chips in stacking the chips. With the configuration, it is advantageous that reliability of semiconductors is not lowered because adhesiveness is kept despite of a repeated process of stacking chips subject to high temperature.

Abstract translation: 本发明涉及一种用于堆叠芯片的粘合膜，其使得芯片能够层叠而不使用通常设置用于保持上芯片和下芯片的导线之间的给定距离的单独间隔件具有相同的面积。 本发明的粘合膜具有热塑性苯氧基树脂的中间粘合剂层，其两侧分别放置环氧树脂的热固性粘合剂层以制成三层结构，所述热塑性苯氧基树脂包含可UV固化的小分子化合物 。 本发明的粘合膜是通过以下方法制造的多层粘合膜，该粘合膜包括以下步骤：在热固性环氧树脂和热塑性苯氧基树脂之间的界面上实现相容性，然后通过UV直接形成具有高弹性模量的苯氧基膜 在粘合膜中固化。 通过这样的结构，根据本发明的用于堆叠半导体芯片的粘合膜能够使半导体硅芯片层叠成3层以上，而不需要在芯片之间使用单独的间隔物，以便在堆叠中保持上下芯片之间的线间距 芯片。 通过该结构，由于尽管重叠堆叠处于高温的芯片的过程，因此保持了粘附性，因此有利的是半导体的可靠性不降低。

公开(公告)号：US20100295001A1

公开(公告)日：2010-11-25

申请号：US12496768

申请日：2009-07-02

Applicant: Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun

Inventor： Chang-Hoon SIM ,  Ki-Jeong Moon ,  Hae-Sang Jun

IPC: G02F1/361

CPC classification number: G02B1/04 ,  C08J5/18 ,  C08J2323/06 ,  C08J2371/12 ,  G02B5/0242 ,  G02B5/0278

Abstract: A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.

Abstract translation: 高效光扩散聚合物膜包括第一聚合物，其是透光介质，和形成光散射颗粒的第二聚合物，其中所述聚合物是不混溶的并且折射率差为约0.001至约0.5，聚合物 相对于100重量份的第一聚合物，膜包含约30至约70重量份的第二聚合物。 进行制造高效聚合物膜的方法，使得第一聚合物形成连续相，第二聚合物通过涂布或挤出形成分散相。

公开(公告)号：US20120009715A1

公开(公告)日：2012-01-12

申请号：US13254241

申请日：2010-03-22

Applicant: Chang-Hoon Sim ,  Sang-Pil Kim ,  Ki-Jeong Moon

Inventor： Chang-Hoon Sim ,  Sang-Pil Kim ,  Ki-Jeong Moon

IPC: H01L31/18 ,  H01G9/028

CPC classification number: H01G9/2009 ,  H01G9/2031 ,  H01G9/2059 ,  Y02E10/542 ,  Y02P70/521

Abstract: This disclosure provides polymer electrolytes for dye-sensitized solar cells that can not only prevent electrolytes from leaking, but also exhibit a higher solar conversion efficiency when compared with conventional polymer electrolytes, whereby the polymer electrolytes are applicable to a process for manufacturing dye-sensitized solar cells with a large surface area or flexible dye-sensitized solar cells, and methods for manufacturing modules of dye-sensitized solar cells using the same.

Abstract translation: 该公开内容提供了用于染料敏化太阳能电池的聚合物电解质，其不仅可以防止电解质泄漏，而且与常规的聚合物电解质相比也显示出更高的太阳能转换效率，由此聚合物​​电解质可用于制造染料敏化太阳能的方法 具有大表面积的电池或柔性染料敏化太阳能电池，以及使用其制造染料敏化太阳能电池组件的方法。