公开(公告)号：US08975116B2

公开(公告)日：2015-03-10

申请号：US13515137

申请日：2010-12-14

Applicant: Andreas Ostmann ,  Dionysios Manessis ,  Lars Böttcher ,  Stefan Karaszkiewicz

Inventor： Andreas Ostmann ,  Dionysios Manessis ,  Lars Böttcher ,  Stefan Karaszkiewicz

IPC: H01L21/00 ,  H05K1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H05K3/02

CPC classification number: H05K1/188 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/16 ,  H01L24/24 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/136 ,  H01L2224/2402 ,  H01L2224/2919 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H05K3/025 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/0353 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/014

Abstract: An electronic unit is produced including at least one electronic component at least partially embedded in an insulating material. A film assembly is provided with at least one conductive layer and a carrier layer. The conductive layer includes openings in the form of holes for receiving bumps, which are connected to contact surfaces of the at least one electronic component. The at least one component is placed on the film assembly such that the bumps engage with the openings of the conductive layer. The at least one component is partially embedded from the side opposite of the bumps into a dielectric layer. The carrier layer of the film assembly is removed such that the surface of the bumps is exposed. A metallization layer is then deposited on the side of the remaining conductive layer having the exposed bumps and so as to produce conductor tracks that overlap with the bumps.

Abstract translation: 制造的电子单元包括至少部分地嵌入绝缘材料中的至少一个电子部件。 膜组件设置有至少一个导电层和载体层。 导电层包括用于接收凸块形式的开口，凸起连接到至少一个电子部件的接触表面。 将至少一个部件放置在胶片组件上，使得凸块与导电层的开口接合。 所述至少一个部件从与所述凸块相对的一侧部分嵌入到电介质层中。 除去膜组件的载体层，使得凸块的表面露出。 然后在具有暴露的凸块的剩余导电层的侧面上沉积金属化层，以便产生与凸块重叠的导体轨迹。

公开(公告)号：US08042724B2

公开(公告)日：2011-10-25

申请号：US11882824

申请日：2007-08-06

Applicant: Andreas Ostmann ,  Alexander Neumann ,  Dionysios Manessis ,  Rainer Patzelt

Inventor： Andreas Ostmann ,  Alexander Neumann ,  Dionysios Manessis ,  Rainer Patzelt

IPC: B23K31/00 ,  H01L21/44

CPC classification number: H05K1/188 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13193 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/83 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.

Abstract translation: 提供了一种用于与布置在电路板层或衬底的表面上或嵌入电路板层或衬底的表面中的微电子组件进行电连接的方法。 微电子部件具有可在微电子部件的表面上接近的电接触面。 将导电凸起施加到微电子部件的电接触面。 金属箔或金属涂层通过绝缘粘合剂的涂层在压力和/或热的作用下施加到电路板的表面，使得导电凸块穿透绝缘粘合剂的涂层，以使电连接 金属箔或金属涂层和电接触面。

公开(公告)号：US20080257589A1

公开(公告)日：2008-10-23

申请号：US11940640

申请日：2007-11-15

Applicant: Andreas Ostmann ,  Manuel Seckel ,  Thomas Loher ,  Dionysios Manessis ,  Rainer Patzelt

Inventor： Andreas Ostmann ,  Manuel Seckel ,  Thomas Loher ,  Dionysios Manessis ,  Rainer Patzelt

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/02

CPC classification number: H05K1/0271 ,  H05K1/0283 ,  H05K1/188 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/382 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/2009 ,  H05K2203/0271

Abstract: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.

Abstract translation: 本发明涉及一种制造可扩展电路载体的方法，其中将可扩展基底的原材料施加在导电箔上，该导电箔形成连接到箔的可发射基底层，然后将箔结构化 使得其形成具有至少一个可扩展带状导体的导体结构。 本发明还涉及可通过该方法制造的可扩展电路载体。

公开(公告)号：US20080061115A1

公开(公告)日：2008-03-13

申请号：US11882824

申请日：2007-08-06

Applicant: Andreas Ostmann ,  Alexander Neumann ,  Dionysios Manessis ,  Rainer Patzelt

Inventor： Andreas Ostmann ,  Alexander Neumann ,  Dionysios Manessis ,  Rainer Patzelt

IPC: B23K1/20 ,  B23K20/00

CPC classification number: H05K1/188 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13193 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/83 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.

Abstract translation: 提供了一种用于与布置在电路板层或衬底的表面上或嵌入电路板层或衬底的表面中的微电子组件进行电连接的方法。 微电子部件具有可在微电子部件的表面上接近的电接触面。 将导电凸起施加到微电子部件的电接触面。 金属箔或金属涂层通过绝缘粘合剂的涂层在压力和/或热的作用下施加到电路板的表面，使得导电凸块穿透绝缘粘合剂的涂层，以使电连接 金属箔或金属涂层和电接触面。

公开(公告)号：US08654536B2

公开(公告)日：2014-02-18

申请号：US11940640

申请日：2007-11-15

Applicant: Andreas Ostmann ,  Manuel Seckel ,  Thomas Löher ,  Dionysios Manessis ,  Rainer Patzelt

Inventor： Andreas Ostmann ,  Manuel Seckel ,  Thomas Löher ,  Dionysios Manessis ,  Rainer Patzelt

IPC: H05K1/00

CPC classification number: H05K1/0271 ,  H05K1/0283 ,  H05K1/188 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/382 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/2009 ,  H05K2203/0271

Abstract: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.

Abstract translation: 本发明涉及一种制造可扩展电路载体的方法，其中将可扩展基底的原材料施加在导电箔上，该导电箔形成连接到箔的可发射基底层，然后将箔结构化 使得其形成具有至少一个可扩展带状导体的导体结构。 本发明还涉及可通过该方法制造的可扩展电路载体。

公开(公告)号：US20130015572A1

公开(公告)日：2013-01-17

申请号：US13515137

申请日：2010-12-14

Applicant: Andreas Ostmann ,  Dionysios Manessis ,  Lars Böttcher ,  Stefan Karaszkiewicz

Inventor： Andreas Ostmann ,  Dionysios Manessis ,  Lars Böttcher ,  Stefan Karaszkiewicz

IPC: H01L21/50 ,  H01L23/498

CPC classification number: H05K1/188 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/16 ,  H01L24/24 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/136 ,  H01L2224/2402 ,  H01L2224/2919 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H05K3/025 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/0353 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/014

Abstract: An electronic unit is produced including at least one electronic component at least partially embedded in an insulating material. A film assembly is provided with at least one conductive layer and a carrier layer. The conductive layer includes openings in the form of holes for receiving bumps, which are connected to contact surfaces of the at least one electronic component. The at least one component is placed on the film assembly such that the bumps engage with the openings of the conductive layer. The at least one component is partially embedded from the side opposite of the bumps into a dielectric layer. The carrier layer of the film assembly is removed such that the surface of the bumps is exposed. A metallization layer is then deposited on the side of the remaining conductive layer having the exposed bumps and so as to produce conductor tracks that overlap with the bumps.

Abstract translation: 制造的电子单元包括至少部分地嵌入绝缘材料中的至少一个电子部件。 膜组件设置有至少一个导电层和载体层。 导电层包括用于接收凸块形式的开口，凸起连接到至少一个电子部件的接触表面。 将至少一个部件放置在胶片组件上，使得凸块与导电层的开口接合。 所述至少一个部件从与所述凸块相对的一侧部分嵌入到电介质层中。 除去膜组件的载体层，使得凸块的表面露出。 然后在具有暴露的凸块的剩余导电层的侧面上沉积金属化层，以便产生与凸块重叠的导体轨迹。