-
公开(公告)号：US08517565B2
公开(公告)日：2013-08-27
申请号：US13190683
申请日：2011-07-26
申请人： Kiyohisa Ohta
发明人： Kiyohisa Ohta
IPC分类号： F21V7/00
摘要： An LED light bulb includes a light source unit. The light source unit includes an LED light emitting element for emitting light and a reflecting plate on which a part of the light emitted from the LED light emitting element is incident. The reflecting plate changes a direction of the part of the light so that the direction of the part of the light is inclined from a direction of an optical axis of the light emitted from the LED light emitting element toward a plane vertical to the direction of the optical axis.
摘要翻译： LED灯泡包括光源单元。 光源单元包括用于发射光的LED发光元件和从LED发光元件发射的光的一部分入射到其上的反射板。 反射板改变光的一部分的方向，使得光的一部分的方向从从LED发光元件发射的光的光轴的方向朝向与LED发光元件的方向垂直的平面倾斜 光轴。
-
公开(公告)号：US08300177B2
公开(公告)日：2012-10-30
申请号：US12596789
申请日：2008-06-18
IPC分类号： G02F1/1335
CPC分类号： G02B6/0031 , G02B6/005
摘要： A backlight device (10) includes: an LED package (12) including an LED chip (12A) and an Ag reflective layer (12B); and an optical member (for example, a prism sheet (16)) for adjusting light emitted from the LED package (12). The optical member (16) adjusts an amount of a halogen thus contained and the like so that emission of halogen is decreased to a degree in which no silver halide is generated on the Ag reflective layer (12B).
摘要翻译： 背光装置（10）包括：LED封装（12），包括LED芯片（12A）和Ag反射层（12B）; 以及用于调整从LED封装（12）发射的光的光学构件（例如，棱镜片（16））。 光学构件（16）调节如此含有的卤素的量等，使得卤素的发射降低到在Ag反射层（12B）上不产生卤化银的程度。
-
公开(公告)号：US20100053498A1
公开(公告)日：2010-03-04
申请号：US12596789
申请日：2008-06-18
IPC分类号： G02F1/1335 , F21V7/04 , F21V7/00
CPC分类号： G02B6/0031 , G02B6/005
摘要： A backlight device (10) includes: an LED package (12) including an LED chip (12A) and an Ag reflective layer (12B); and an optical member (for example, a prism sheet (16)) for adjusting light emitted from the LED package (12). The optical member (16) adjusts an amount of a halogen thus contained and the like so that emission of halogen is decreased to a degree in which no silver halide is generated on the Ag reflective layer (12B).
摘要翻译： 背光装置（10）包括：LED封装（12），包括LED芯片（12A）和Ag反射层（12B）; 以及用于调整从LED封装（12）发射的光的光学构件（例如，棱镜片（16））。 光学构件（16）调节如此含有的卤素的量等，使得卤素的发射降低到在Ag反射层（12B）上不产生卤化银的程度。
-
4.发明申请公开(公告)号：US20090315057A1
公开(公告)日：2009-12-24
申请号：US12490192
申请日：2009-06-23
申请人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
摘要翻译： 本发明的发光装置具有：（i）朝向比基板高的位置发光的半导体装置，（ii）多个外部连接端子，具有：设置在基板上的光反射层 ，其反映由半导体器件发射的光; 以及至少覆盖所述光反射层并透射由所述光反射层反射的光的覆盖层。 此外，半导体器件设置在覆盖层上，并且经由连接部分电连接到外部连接端子，半导体器件和连接部分用密封树脂密封以被覆盖。 因此，发光装置具有提高光线的效率，能够防止反射层的变化，劣化，反射率的降低。
-
5.发明申请METHOD FOR CUTTING MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, AND BACKLIGHT DEVICE 审中-公开切割多层基板的方法，制造半导体器件的方法，半导体器件，发光器件和背光器件公开(公告)号：US20090026620A1
公开(公告)日：2009-01-29
申请号：US12119920
申请日：2008-05-13
申请人： Kiyohisa OHTA
发明人： Kiyohisa OHTA
IPC分类号： B26D3/06 , H01L21/302 , H05K1/00 , H01L23/00
CPC分类号： H05K3/0052 , H01L21/4857 , H01L23/13 , H01L33/0095 , H01L2924/0002 , H05K3/46 , H05K2201/10106 , H05K2203/0228 , H05K2203/1476 , Y10T83/0304 , H01L2924/00
摘要： In order to cut off, without causing any burr, a multilayer substrate having a metal layer on a front surface and a second metal layer on a back surface, a method for cutting the multilayer substrate is a method for cutting the multilayer substrate having a metal layer on the front surface and a backside electrode on the back surface, the method including the step of cutting the multilayer substrate into certain depth respectively from a metal layer side and from a backside electrode side, width of a notch on the metal layer side and width of a notch on the backside electrode side being different from each other.
摘要翻译： 为了切断而不引起毛刺，在前表面具有金属层的多层基板和背面上的第二金属层，切割多层基板的方法是切割具有金属的多层基板的方法 在背面的背面电极和背面电极的背面电极，分别从金属层侧和背面侧电极侧切割多层基板一定深度的步骤，金属层侧的切口宽度以及 背面电极侧的切口的宽度彼此不同。
-
6.发明授权公开(公告)号：US08680546B2
公开(公告)日：2014-03-25
申请号：US12490192
申请日：2009-06-23
申请人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
摘要翻译： 本发明的发光装置具有：（i）朝向比基板高的位置发光的半导体装置，（ii）多个外部连接端子，具有：设置在基板上的光反射层 ，其反映由半导体器件发射的光; 以及至少覆盖所述光反射层并透射由所述光反射层反射的光的覆盖层。 此外，半导体器件设置在覆盖层上，并且经由连接部分电连接到外部连接端子，半导体器件和连接部分用密封树脂密封以被覆盖。 因此，发光装置具有提高光线的效率，能够防止反射层的变化，劣化，反射率的降低。
-
公开(公告)号：US20120026735A1
公开(公告)日：2012-02-02
申请号：US13190683
申请日：2011-07-26
申请人： Kiyohisa OHTA
发明人： Kiyohisa OHTA
IPC分类号： F21V7/22
摘要： An LED light bulb includes a light source unit. The light source unit includes an LED light emitting element for emitting light and a reflecting plate on which a part of the light emitted from the LED light emitting element is incident. The reflecting plate changes a direction of the part of the light so that the direction of the part of the light is inclined from a direction of an optical axis of the light emitted from the LED light emitting element toward a plane vertical to the direction of the optical axis.
摘要翻译： LED灯泡包括光源单元。 光源单元包括用于发射光的LED发光元件和从LED发光元件发射的光的一部分入射到其上的反射板。 反射板改变光的一部分的方向，使得光的一部分的方向从从LED发光元件发射的光的光轴的方向朝向与LED发光元件的方向垂直的平面倾斜 光轴。
-
公开(公告)号：US20080101072A1
公开(公告)日：2008-05-01
申请号：US11926703
申请日：2007-10-29
申请人： Kiyohisa Ohta , Masashi Takemoto , Nobuo Ogata
发明人： Kiyohisa Ohta , Masashi Takemoto , Nobuo Ogata
摘要： A light emitter includes reflectors that are spaced apart by a short distance to reduce a thickness of the light emitter. A fabrication method of such light emitters, and an image display using such light emitters are also provided. A light emitter includes: an LED chip 7, reflectors 2 provided on both sides of the LED chip 7, and a second resin layer 4 on which the LED chip 7 and the reflectors 2 are provided. Reflecting faces 9 of the reflectors 2 reflect light emitted by the LED chip 7. In the light emitter, the reflecting faces 9 of the reflectors 2 are formed perpendicular to the second resin layer 4 on which the LED chip 7 is provided.
摘要翻译： 光发射器包括间隔开短距离的反射器，以减小光发射器的厚度。 还提供了这种发光体的制造方法和使用这种发光体的图像显示。 光发射器包括：LED芯片7，设置在LED芯片7的两侧的反射器2，以及设置有LED芯片7和反射器2的第二树脂层4。 反射镜2的反射面9反射由LED芯片7发出的光。 在光发射器中，反射器2的反射面9垂直于设置有LED芯片7的第二树脂层4形成。
-
公开(公告)号：US07005682B2
公开(公告)日：2006-02-28
申请号：US10766606
申请日：2004-01-27
IPC分类号： H01L33/00
CPC分类号： H01L33/30 , H01L33/305
摘要： A semiconductor light emitting element of a monolithic structure, including: a first-conductivity-type semiconductor substrate; an active layer formed on the first-conductivity-type semiconductor substrate; a second-conductivity-type clad layer formed on the active layer; and a current diffusion layer formed on the second-conductivity-type clad layer, wherein the active layer is of a first conductivity type.
摘要翻译： 一种单片结构的半导体发光元件，包括：第一导电型半导体衬底; 形成在所述第一导电型半导体基板上的有源层; 形成在有源层上的第二导电型覆盖层; 以及形成在所述第二导电型覆盖层上的电流扩散层，其中所述有源层是第一导电类型。
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.017 秒)
