公开(公告)号：US11174411B2

公开(公告)日：2021-11-16

申请号：US16249020

申请日：2019-01-16

申请人： AGC Inc.

发明人： Tomoya Hosoda ,  Tatsuya Terada ,  Shigeki Kobayashi ,  Atsumi Yamabe

IPC分类号： C08J3/12 ,  C09D127/18 ,  C08F18/08 ,  C08F20/04 ,  C08F16/24 ,  C08F22/06 ,  C08L27/18 ,  B32B15/082 ,  C08J5/18 ,  C08F14/26 ,  C08L101/00 ,  C08F20/18 ,  C08F234/00 ,  C08F20/32 ,  C08F214/26 ,  B32B15/08 ,  H05K1/03 ,  H05K3/28 ,  C09D5/00 ,  H05K3/06

摘要： To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 μm, the volume-based cumulative 90% diameter of the resin powder is at most 8 μm, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

公开(公告)号：US10677379B2

公开(公告)日：2020-06-09

申请号：US15722625

申请日：2017-10-02

申请人： AGC Inc.

发明人： Eiichi Nishi ,  Tomoya Hosoda ,  Toru Sasaki

IPC分类号： B32B7/10 ,  F16L11/12 ,  B32B27/30 ,  B32B1/08 ,  B32B27/08 ,  B32B27/32 ,  B32B27/34 ,  C08F214/26

摘要： To provide a laminate which is formed from resins and is excellent in heat resistance and excellent in flexibility and mechanical properties under high-temperature conditions and which undergoes no separation of layers even when contacted with oil such as engine oil for a long period of time. The laminate comprises a first layer containing a fluorinated copolymer and a second layer containing a polyamide directly laminated on the first layer, wherein the fluorinated copolymer has units based on tetrafluoroethylene, units based on ethylene, units based on a copolymerizable another monomer not having a carbonyl group, and carbonyl group-containing groups, wherein the amounts of the respective units are in specific ranges, and the tensile elongation at 200° C. of the fluorinated copolymer is at least 200%, and the melting point of the polyamide and the flexural elastic modulus at 23° C. of the second layer are in specific ranges.

公开(公告)号：US10448506B2

公开(公告)日：2019-10-15

申请号：US16238586

申请日：2019-01-03

申请人： AGC Inc.

发明人： Tomoya Hosoda ,  Tatsuya Terada

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K3/18 ,  H05K3/40 ,  H05K1/02 ,  H05K3/42 ,  H01Q1/38

摘要： To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.

公开(公告)号：US20200317948A1

公开(公告)日：2020-10-08

申请号：US16904645

申请日：2020-06-18

申请人： AGC Inc.

发明人： Tatsuya Terada ,  Tomoya Hosoda ,  Atsumi Yamabe

IPC分类号： C09D127/18 ,  B05D7/14 ,  C08J3/11 ,  C09D7/65 ,  H05K3/06 ,  H05K1/03

摘要： To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380° C. of from 1×102 to 1×106 Pa·s; the viscosity is from 50 to 10,000 mPa·s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.

公开(公告)号：US10716203B2

公开(公告)日：2020-07-14

申请号：US15140912

申请日：2016-04-28

申请人： AGC Inc.

发明人： Tomoya Hosoda ,  Eiichi Nishi ,  Toru Sasaki ,  Yasuhiko Matsuoka ,  Wataru Kasai

IPC分类号： H05K1/02 ,  B32B15/08 ,  C09J7/30 ,  C09J127/18 ,  B32B7/12 ,  C09J7/22 ,  H01P11/00 ,  H05K3/38 ,  B32B27/28 ,  C09J179/08 ,  H01P3/08 ,  H05K1/03 ,  H05K3/06 ,  H05K3/22 ,  H05K3/46

摘要： To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate.An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 μm.

公开(公告)号：US10304583B2

公开(公告)日：2019-05-28

申请号：US14944657

申请日：2015-11-18

申请人： AGC Inc.

发明人： Tomoya Hosoda ,  Yasuhiko Matsuoka ,  Toru Sasaki ,  Wataru Kasai

IPC分类号： H01B3/30 ,  B32B27/08 ,  H01B3/44 ,  C08F214/26 ,  C08J5/12 ,  B32B27/28 ,  B29C65/02 ,  B29C65/00 ,  H01B13/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/30 ,  B32B27/32 ,  B29K627/18 ,  B29K679/00 ,  B29L9/00 ,  B29L31/34 ,  B29C63/00 ,  B29C63/02

摘要： To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.

公开(公告)号：US12119142B2

公开(公告)日：2024-10-15

申请号：US17591755

申请日：2022-02-03

申请人： AGC INC.

发明人： Wataru Kasai ,  Tomoya Hosoda ,  Atsumi Mitsunaga ,  Tatsuya Terada ,  Sota Yuki

IPC分类号： H01B3/30 ,  B32B7/025 ,  B32B15/08 ,  B32B15/20 ,  B32B37/24 ,  H01B1/02 ,  H01B3/44

CPC分类号： H01B3/306 ,  B32B7/025 ,  B32B15/08 ,  B32B15/20 ,  B32B37/24 ,  H01B1/026 ,  H01B3/445 ,  B32B2037/243 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/7265 ,  B32B2457/04

摘要： A heat-resistant film that has high adhesion and low warping, a method for producing the film, and a metal-clad laminate and a coated metal conductor, using the film. The film includes an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

公开(公告)号：US11739211B2

公开(公告)日：2023-08-29

申请号：US16992180

申请日：2020-08-13

申请人： AGC Inc.

发明人： Norio Ozawa ,  Tomoya Hosoda ,  Takashi Sato

IPC分类号： C08L71/00

CPC分类号： C08L71/00 ,  C08L2203/02

摘要： To provide a molded product which is excellent in impact resistance, flexibility and bending resistance without impairing the characteristics (heat resistance, mechanical properties, etc.) of a polyaryletherketone, and has little appearance defects, and a resin composition, whereby it is possible to obtain such a molded product. This resin composition comprises a polyaryletherketone and a fluorinated elastomer. The ratio (MFRA/MFRB) of the melt flow rate MFRA of the polyaryletherketone at a temperature of 372° C. under a load of 49 N to the melt flow rate MFRB of the fluorinated elastomer at a temperature of 372° C. under a load of 49 N is from 0.2 to 5.0, and the proportion of the volume of the polyaryletherketone in the total of the volume of the polyaryletherketone and the volume of the fluorinated elastomer is from 60 to 97 vol %.

公开(公告)号：US11632859B2

公开(公告)日：2023-04-18

申请号：US16911492

申请日：2020-06-25

申请人： AGC Inc.

发明人： Wataru Kasai ,  Tomoya Hosoda ,  Atsumi Yamabe

IPC分类号： H05K1/03 ,  H05K1/09

摘要： Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 μm thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 μm. Also provided are a method for producing the long laminate, and the printed wiring board.

公开(公告)号：US10982063B2

公开(公告)日：2021-04-20

申请号：US16751301

申请日：2020-01-24

申请人： AGC Inc.

发明人： Norio Ozawa ,  Tomoya Hosoda ,  Takashi Sato

IPC分类号： C08J5/24 ,  B29C70/34 ,  B32B27/12 ,  B32B27/34 ,  C08L77/02 ,  B29K307/04

摘要： To provide a resin composition, wherein the resin composition is excellent in impregnation into a reinforcing fiber sheet as it contains a polyamide having a low viscosity number; wherein the resin composition can be molded into a film, a fiber, etc., even though it contains a polyamide having a low viscosity number; and wherein the resin composition can produce a fiber-reinforced molded product having excellent impact resistance; a molded product and a method for its production; and a fiber-reinforced molded product having excellent impact resistance and a method for its production.
A resin composition comprising: a polyamide having a viscosity number of from 100 to 170 determined by a method specified in ISO 307: 2007; and a melt-processable fluororesin having at least one type of a functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melting point of from 100 to 325° C.