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    Combination parallel path heatsink and EMI shield
    4.
    发明授权
    Combination parallel path heatsink and EMI shield 有权

    公开(公告)号：US10963024B2

    公开(公告)日：2021-03-30

    申请号：US16042804

    申请日：2018-07-23

    Applicant: Apple Inc.

    Inventor： Jonathan A. Matheson ,  Vinh H. Diep ,  Brian L. Chuang ,  Judith C. Segura ,  Frank F. Liang ,  Leanne Bach Lien T. Ly ,  Kevin Z. Lo ,  Po W. Chiu ,  Lukose Ninan ,  Chong Li

    IPC: G06F1/20 ,  G06F1/16 ,  H05K7/20 ,  H05K9/00 ,  H05K1/02

    Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

    THERMAL BLOCKER FOR MOBILE DEVICE SKIN HOT SPOT MANAGEMENT
    9.
    发明申请
    THERMAL BLOCKER FOR MOBILE DEVICE SKIN HOT SPOT MANAGEMENT 有权
    用于移动设备皮肤热点管理的热阻塞器

    公开(公告)号：US20140085911A1

    公开(公告)日：2014-03-27

    申请号：US13940171

    申请日：2013-07-11

    Applicant: Apple Inc.

    Inventor： Lian Zhang ,  Amaury J. Heresztyn ,  Frank F. Liang

    IPC: H05K7/20 ,  F21V29/00 ,  H05K5/00

    CPC classification number: H05K7/20436 ,  G02F1/13338 ,  G06F3/0412 ,  H01L23/373 ,  H01L2924/0002 ,  H04M1/0266 ,  H05K5/0017 ,  Y10T156/10 ,  H01L2924/00

    Abstract: The described embodiments relate generally to thermal management and more particularly to a method and apparatus for providing thermal insulation from relatively small heat sources in small form factor electronic devices. An insulator layer can be placed between a small heat source and an exterior surface of the device, such as a cover glass layer. In one embodiment, a graphite layer can also be included between the cover glass layer and the insulator layer to spread any transmitted heat across the cover glass layer.

    Abstract translation: 所描述的实施例总体上涉及热管理，更具体地涉及用于在小尺寸电子设备中从较小的热源提供热绝缘的方法和设备。 绝缘体层可以放置在小热源和装置的外表面之间，例如盖玻璃层。 在一个实施例中，也可以在覆盖玻璃层和绝缘体层之间包含石墨层，以将透射的热量散布穿过覆盖玻璃层。

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