公开(公告)号：US20190131195A1

公开(公告)日：2019-05-02

申请号：US15795203

申请日：2017-10-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An FANG ,  Chi Sheng TSENG

IPC: H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/053 ,  H01L23/34 ,  H01L21/48 ,  H01L33/48 ,  H01L33/62 ,  H01L31/0203 ,  H01L31/024 ,  H01L31/02

CPC classification number: H01L23/10 ,  H01L21/4803 ,  H01L23/053 ,  H01L23/13 ,  H01L23/34 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/024 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00014

Abstract: A semiconductor package device comprises a substrate, an electronic component and a protection layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a first opening penetrating the substrate. The electronic component is disposed on the first surface of the substrate. The protection layer is disposed on the second surface of the substrate. The protection layer has a first portion adjacent to the first opening and a second portion disposed farther away from the first opening than is the first portion of the protection layer. The first portion of the protection layer has a surface facing away from the second surface of the substrate. The second portion of the protection layer has a surface facing away from the second surface of the substrate. A distance between the surface of the first portion of the protection layer and the second surface of the substrate is greater than a distance between the surface of the second portion of the protection layer and the second surface of the substrate.

公开(公告)号：US20180138099A1

公开(公告)日：2018-05-17

申请号：US15351241

申请日：2016-11-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An FANG ,  Ying-Chung Chen ,  Cheng-Ling Huang

IPC: H01L23/053 ,  H01L23/10

CPC classification number: H01L23/053 ,  B81B7/0032 ,  B81B7/0061 ,  B81C1/00269 ,  B81C1/00309 ,  H01L21/6836 ,  H01L23/04 ,  H01L23/10 ,  H01L2221/68331

Abstract: A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.

公开(公告)号：US20180130719A1

公开(公告)日：2018-05-10

申请号：US15347683

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An FANG ,  Ying-Chung CHEN

IPC: H01L23/10 ,  H01L23/055 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L21/52 ,  H01L23/055 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/19106 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: A semiconductor device package includes a carrier, a lid, an electronic component and a sealant. The carrier has a first surface and a second surface opposite the first surface, and defines a hole extending from the first surface to the second surface. The lid is attached to the first surface of the carrier. The lid and the carrier define a chamber. The electronic component is attached to the first surface of the carrier and is disposed in the chamber. The sealant is attached to the second surface of the carrier and covers the hole.