-
公开(公告)号:US20160229689A1
公开(公告)日:2016-08-11
申请号:US15004252
申请日:2016-01-22
Applicant: Analog Devices, Inc.
Inventor: Bradley C. Kaanta , John A. Alberghini , Kemiao Jia
CPC classification number: B81B7/0048
Abstract: A packaged microchip has a base, a die with a mounting surface, and an electrically inactive interposer between the base and the die. The interposer has a first side with at least one recess that extends no more than part-way through the interposer from the first side. Accordingly, the recess defines a top portion (of the first side) with a top area. The die mounting surface, which is coupled with the interposer, correspondingly has a die area. The top area of the interposer preferably is less than the die area.
Abstract translation: 封装的微芯片具有基座,具有安装表面的管芯,以及在基座和管芯之间的无电插拔器。 插入器具有第一侧面,该第一侧面具有至少一个凹槽,该凹槽不超过第一侧的插入件的一部分延伸。 因此,凹部限定具有顶部区域的顶部(第一侧的顶部)。 与插入器耦合的管芯安装表面相应地具有管芯区域。 插入件的顶部面积优选小于模具面积。
-
公开(公告)号:US20220196699A1
公开(公告)日:2022-06-23
申请号:US17555002
申请日:2021-12-17
Applicant: Analog Devices, Inc.
Inventor: Kemiao Jia , Xin Zhang , Michael Judy
IPC: G01P15/125 , G01P1/00
Abstract: A microelectromechanical systems (MEMS) accelerometer is provided, comprising a substrate disposed in a plane defined by a first axis and a second axis perpendicular to the first axis; a first proof mass and a second proof mass coupled to the substrate and configured to translate in opposite directions of each other along a third axis perpendicular to the first and second axes; and at least one lever coupling the first proof mass to the second proof mass, wherein, the MEMS accelerometer is configured to detect acceleration along the third axis via detection of translation of the first and second proof masses along the third axis; and the MEMS accelerometer exhibits symmetry about the first and second axes.
-
公开(公告)号:US10131538B2
公开(公告)日:2018-11-20
申请号:US14853251
申请日:2015-09-14
Applicant: Analog Devices, Inc.
Inventor: Bradley C. Kaanta , Kemiao Jia
Abstract: A MEMS device has a substrate with a structure surface and an opposing exterior surface, microstructure formed on the structure surface of the substrate, and a cap coupled with the substrate to form a hermetically sealed interior chamber containing the microstructure. The substrate forms a trench extending from, and being open to, the opposing exterior surface to produce a sensor region and a second region. Specifically, the second region is radially outward of the sensor region. The MEMS device also has a spring integrally formed at least in part within the trench to mechanically connect the sensor region and the second region, and other structure integral with the substrate. The spring or the other structure at least in part hermetically seal the interior chamber.
-
公开(公告)号:US20180058853A1
公开(公告)日:2018-03-01
申请号:US15253792
申请日:2016-08-31
Applicant: Analog Devices, Inc.
Inventor: Kemiao Jia , Xin Zhang , Jianglong Zhang , Jinbo Kuang
IPC: G01C19/5712
CPC classification number: G01C19/5712 , G01C19/5705
Abstract: A two-axis microelectromechanical systems (MEMS) gyroscope having four proof masses disposed in respective quadrants of a plane is described. The quad proof mass gyroscope may comprise an inner coupler passing between a first and a third proof mass and between a second and a fourth proof mass, and coupling the four proof masses with one another. The quad proof mass gyroscope may further comprising a first outer coupler coupling the first and the second proof masses and a second outer coupler coupling the third and the fourth proof masses. The outer couplers may have masses configured to balance the center of masses of the four proof masses, and may have elastic constants matching the elastic constant of the inner coupler. The quad gyroscope may further comprise a plurality of sense capacitors configured to sense angular rates.
-
公开(公告)号:US10759659B2
公开(公告)日:2020-09-01
申请号:US16160965
申请日:2018-10-15
Applicant: Analog Devices, Inc.
Inventor: Xin Zhang , Michael Judy , George M. Molnar , Christopher Needham , Kemiao Jia
IPC: B81B7/00
Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.
-
公开(公告)号:US20190047846A1
公开(公告)日:2019-02-14
申请号:US16160965
申请日:2018-10-15
Applicant: Analog Devices, Inc.
Inventor: Xin Zhang , Michael Judy , George M. Molnar , Christopher Needham , Kemiao Jia
IPC: B81B7/00
CPC classification number: B81B7/0048 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.
-
公开(公告)号:US20240300808A1
公开(公告)日:2024-09-12
申请号:US18596223
申请日:2024-03-05
Applicant: Analog Devices, Inc.
Inventor: Kemiao Jia , Gaurav Vohra , Xin Zhang , Christine H. Tsau , Chen Yang , Andrew Proudman , Matthew Kent Emsley , George M. Molnar, II , Nikolay Pokrovskiy , Ali Mohammed Shakir , Michael Judy
CPC classification number: B81C1/00666 , B81B3/0072 , B81B2203/0118 , B81B2203/0307 , B81B2203/0315 , B81C2201/0111 , B81C2201/019
Abstract: Described herein are manufacturing techniques for achieving stress isolation in microelectromechanical systems (MEMS) devices that involve isolation trenches formed from the backside of the substrate. The techniques described herein involve etching a trench in the bottom side of the substrate subsequent to forming a MEMS platform, and processing the MEMS platform to form a MEMS device on the top side of the substrate subsequent to etching the trench.
-
公开(公告)号:US11774244B2
公开(公告)日:2023-10-03
申请号:US17515271
申请日:2021-10-29
Applicant: Analog Devices, Inc.
Inventor: Jeffrey A. Gregory , Charles Blackmer , Tyler Adam Dunn , Eugene Oh Hwang , Jinbo Kuang , Kemiao Jia , Laura Cornelia Popa , Igor P. Prikhodko , Erdinc Tatar
IPC: G01C19/5747 , G01C19/5712 , G01C19/5719 , G01C19/574
CPC classification number: G01C19/5747 , G01C19/574 , G01C19/5712 , G01C19/5719
Abstract: Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.
-
公开(公告)号:US20210381834A1
公开(公告)日:2021-12-09
申请号:US16894717
申请日:2020-06-05
Applicant: Analog Devices, Inc.
Inventor: Jeffrey A. Gregory , Charles Blackmer , Tyler Adam Dunn , Eugene Oh Hwang , Jinbo Kuang , Kemiao Jia , Laura Cornelia Popa , Igor P. Prikhodko , Erdinc Tatar
IPC: G01C19/5747 , G01C19/5712
Abstract: Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.
-
公开(公告)号:US20210080584A1
公开(公告)日:2021-03-18
申请号:US16570538
申请日:2019-09-13
Applicant: Analog Devices, Inc.
Inventor: Kemiao Jia
Abstract: This disclosure describes techniques for operating a lidar device. The techniques include emitting light resulting in a plurality of non-parallel laser beam waves; directing the plurality of non-parallel laser beam waves towards a laser beam scanner; reflecting the non-parallel plurality of beam waves by the laser beam scanner towards a collimator device; collimating, with the collimator device, the plurality of non-parallel laser beam waves reflected by the laser beam scanner into a corresponding plurality of parallel plane waves; and directing the plurality of plane waves from the collimator device towards a field of interest.
-
-
-
-
-
-
-
-
-