Packaged Microchip with Patterned Interposer
    1.
    发明申请
    Packaged Microchip with Patterned Interposer 审中-公开
    封装Microchip与图形化插入器

    公开(公告)号:US20160229689A1

    公开(公告)日:2016-08-11

    申请号:US15004252

    申请日:2016-01-22

    CPC classification number: B81B7/0048

    Abstract: A packaged microchip has a base, a die with a mounting surface, and an electrically inactive interposer between the base and the die. The interposer has a first side with at least one recess that extends no more than part-way through the interposer from the first side. Accordingly, the recess defines a top portion (of the first side) with a top area. The die mounting surface, which is coupled with the interposer, correspondingly has a die area. The top area of the interposer preferably is less than the die area.

    Abstract translation: 封装的微芯片具有基座,具有安装表面的管芯,以及在基座和管芯之间的无电插拔器。 插入器具有第一侧面,该第一侧面具有至少一个凹槽,该凹槽不超过第一侧的插入件的一部分延伸。 因此,凹部限定具有顶部区域的顶部(第一侧的顶部)。 与插入器耦合的管芯安装表面相应地具有管芯区域。 插入件的顶部面积优选小于模具面积。

    ACCELEROMETER WITH TRANSLATIONAL MOTION OF MASSES

    公开(公告)号:US20220196699A1

    公开(公告)日:2022-06-23

    申请号:US17555002

    申请日:2021-12-17

    Abstract: A microelectromechanical systems (MEMS) accelerometer is provided, comprising a substrate disposed in a plane defined by a first axis and a second axis perpendicular to the first axis; a first proof mass and a second proof mass coupled to the substrate and configured to translate in opposite directions of each other along a third axis perpendicular to the first and second axes; and at least one lever coupling the first proof mass to the second proof mass, wherein, the MEMS accelerometer is configured to detect acceleration along the third axis via detection of translation of the first and second proof masses along the third axis; and the MEMS accelerometer exhibits symmetry about the first and second axes.

    Mechanically isolated MEMS device

    公开(公告)号:US10131538B2

    公开(公告)日:2018-11-20

    申请号:US14853251

    申请日:2015-09-14

    Abstract: A MEMS device has a substrate with a structure surface and an opposing exterior surface, microstructure formed on the structure surface of the substrate, and a cap coupled with the substrate to form a hermetically sealed interior chamber containing the microstructure. The substrate forms a trench extending from, and being open to, the opposing exterior surface to produce a sensor region and a second region. Specifically, the second region is radially outward of the sensor region. The MEMS device also has a spring integrally formed at least in part within the trench to mechanically connect the sensor region and the second region, and other structure integral with the substrate. The spring or the other structure at least in part hermetically seal the interior chamber.

    QUAD PROOF MASS MEMS GYROSCOPE WITH OUTER COUPLERS AND RELATED METHODS

    公开(公告)号:US20180058853A1

    公开(公告)日:2018-03-01

    申请号:US15253792

    申请日:2016-08-31

    CPC classification number: G01C19/5712 G01C19/5705

    Abstract: A two-axis microelectromechanical systems (MEMS) gyroscope having four proof masses disposed in respective quadrants of a plane is described. The quad proof mass gyroscope may comprise an inner coupler passing between a first and a third proof mass and between a second and a fourth proof mass, and coupling the four proof masses with one another. The quad proof mass gyroscope may further comprising a first outer coupler coupling the first and the second proof masses and a second outer coupler coupling the third and the fourth proof masses. The outer couplers may have masses configured to balance the center of masses of the four proof masses, and may have elastic constants matching the elastic constant of the inner coupler. The quad gyroscope may further comprise a plurality of sense capacitors configured to sense angular rates.

    LASER BEAM CONTROL IN A LIDAR SYSTEM

    公开(公告)号:US20210080584A1

    公开(公告)日:2021-03-18

    申请号:US16570538

    申请日:2019-09-13

    Inventor: Kemiao Jia

    Abstract: This disclosure describes techniques for operating a lidar device. The techniques include emitting light resulting in a plurality of non-parallel laser beam waves; directing the plurality of non-parallel laser beam waves towards a laser beam scanner; reflecting the non-parallel plurality of beam waves by the laser beam scanner towards a collimator device; collimating, with the collimator device, the plurality of non-parallel laser beam waves reflected by the laser beam scanner into a corresponding plurality of parallel plane waves; and directing the plurality of plane waves from the collimator device towards a field of interest.

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