公开(公告)号：US12009347B1

公开(公告)日：2024-06-11

申请号：US17345272

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Dariusz Golda ,  Chae Hyuck Ahn ,  Clayton K Chan ,  Hyeun-Su Kim

IPC: H01L25/075 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L2933/0066

Abstract: Donor substrate micro device stabilization structures and display structures are described. In an embodiment, a patterned electrically conductive layer is used to stabilize an array of micro devices on donor substrate with a plurality of tethers, which can be broken during a transfer sequence to transfer the array of micro devices from the donor substrate.

公开(公告)号：US10276419B1

公开(公告)日：2019-04-30

申请号：US15183608

申请日：2016-06-15

Applicant: Apple Inc.

Inventor： Hyeun-Su Kim ,  Dariusz Golda ,  John A. Higginson

IPC: H01L21/683 ,  B81C99/00 ,  H02N13/00 ,  B25J15/00

Abstract: A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.

公开(公告)号：US11948815B2

公开(公告)日：2024-04-02

申请号：US17345253

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Antoine Manens ,  Dariusz Golda ,  Hyeun-Su Kim

IPC: H01L21/67 ,  B65G47/90 ,  H01L25/075 ,  H01L33/62 ,  B41F16/00

CPC classification number: H01L21/67144 ,  B65G47/90 ,  H01L25/0753 ,  H01L33/62 ,  B41F16/00 ,  H01L2933/0066

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

公开(公告)号：US10804127B2

公开(公告)日：2020-10-13

申请号：US15562738

申请日：2016-03-14

Applicant: Apple Inc.

Inventor： Stephen P. Bathurst ,  John A. Higginson ,  Dariusz Golda ,  Hyeun-Su Kim

IPC: H01L21/67 ,  H01L21/677 ,  B08B6/00 ,  H01L21/683

Abstract: An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a cleaning electrode area including a first electrode pattern, a first trace line connected to the first electrode pattern, and a dielectric layer covering the cleaning electrode and the first trace line. In an embodiment, a mass transfer tool includes a translatable transfer head assembly that is translatable over a carrier substrate stage, a receiving substrate stage, and an electrostatic cleaning stage.

公开(公告)号：US12057331B2

公开(公告)日：2024-08-06

申请号：US17345258

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Hyeun-Su Kim ,  Dariusz Golda ,  Chae Hyuck Ahn ,  Kevin T. Huang ,  Eric B. Newton

IPC: H01L21/00 ,  B65G47/90 ,  H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B41F16/00

CPC classification number: H01L21/67144 ,  B65G47/90 ,  H01L25/0753 ,  H01L33/62 ,  B41F16/00 ,  H01L2933/0066

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

公开(公告)号：US20220013379A1

公开(公告)日：2022-01-13

申请号：US17345253

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Antoine Manens ,  Dariusz Golda ,  Hyeun-Su Kim

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90 ,  B41F16/00

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

公开(公告)号：US20220013380A1

公开(公告)日：2022-01-13

申请号：US17345258

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Hyeun-Su Kim ,  Dariusz Golda ,  Chae Hyuck Ahn ,  Kevin T. Huang ,  Eric B. Newton

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

公开(公告)号：US10734269B1

公开(公告)日：2020-08-04

申请号：US15914595

申请日：2018-03-07

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  James M. Perkins ,  Andreas Bibl ,  Sumant Sood ,  Hyeun-Su Kim

IPC: H01L21/683 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L21/67 ,  B65G47/92 ,  H01L33/06 ,  H01L33/30 ,  H01L33/28 ,  H01L33/60

Abstract: Metal-to-metal adhesion joints are described as a manner to hold down micro devices to a carrier substrate within the context of a micro device transfer manufacturing process. In accordance with embodiments, the metal-to-metal adhesion joints must be broken in order to pick up the micro devices from a carrier substrate, resulting in micro devices with nubs protruding from bottom contacts of the micro devices. Once integrated, the micro devices are bonded to a receiving substrate, the nubs may be embedded in a metallic joint, or alternatively be diffused within the metallic joint as interstitial metallic material that is embedded within the metallic joint.