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1.发明申请Microelectronic package including thermally conductive sealant between heat spreader and substrate 审中-公开微电子封装，包括散热器和基板之间的导热密封剂公开(公告)号：US20080237843A1
公开(公告)日：2008-10-02
申请号：US11729079
申请日：2007-03-27
申请人： Ashish Gupta , Leonel R. Arana , David Song , Chia-Pin Chiu , Ravi Prasher , Chris Matayabas , Nirupama Chakrapani
发明人： Ashish Gupta , Leonel R. Arana , David Song , Chia-Pin Chiu , Ravi Prasher , Chris Matayabas , Nirupama Chakrapani
IPC分类号： H01L23/367 , H01L21/58
CPC分类号： H01L23/10 , H01L23/04 , H01L2224/73253 , H01L2924/1433
摘要： A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.
摘要翻译： 微电子封装。 所述包装包括基材; 安装在基板上的管芯; 集成散热器，其安装在基板上，并热耦合到模具的背面; 以及将整体散热器粘合到基底上的密封剂材料，所述密封剂材料具有高于约1W / m /℃的体积热导率，并且弹性模量低于焊料的弹性模量。
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公开(公告)号：US20110163445A1
公开(公告)日：2011-07-07
申请号：US13050034
申请日：2011-03-17
IPC分类号： H01L23/28 , H01L23/498
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
摘要翻译： 通过改变包装表面的粗糙度，可以在集成电路封装中形成扩展或保留区域。 可以通过施加或生长具有小于500纳米尺寸的颗粒来改变表面粗糙度。 亲水性表面可以制成半吸水性，并且疏水表面可以由具有相同通用特征的颗粒制成半吸收。
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公开(公告)号：US08018073B2
公开(公告)日：2011-09-13
申请号：US13050034
申请日：2011-03-17
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
摘要翻译： 通过改变包装表面的粗糙度，可以在集成电路封装中形成扩展或保留区域。 可以通过施加或生长具有小于500纳米尺寸的颗粒来改变表面粗糙度。 亲水性表面可以制成半吸水性，并且疏水表面可以由具有相同通用特征的颗粒制成半吸收。
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4.发明授权公开(公告)号：US07952212B2
公开(公告)日：2011-05-31
申请号：US11479105
申请日：2006-06-30
IPC分类号： H01L23/29
CPC分类号： H01L21/563 , H01L23/295 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01057 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/014 , H01L2224/0401
摘要： Applications of smart polymer composites to integrated circuit packaging.
摘要翻译： 智能聚合物复合材料在集成电路封装中的应用。
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5.发明申请公开(公告)号：US20100237513A1
公开(公告)日：2010-09-23
申请号：US11479105
申请日：2006-06-30
CPC分类号： H01L21/563 , H01L23/295 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/2939 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01057 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/014 , H01L2224/0401
摘要： Applications of smart polymer composites to integrated circuit packaging.
摘要翻译： 智能聚合物复合材料在集成电路封装中的应用。
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公开(公告)号：US07927925B2
公开(公告)日：2011-04-19
申请号：US12756380
申请日：2010-04-08
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
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公开(公告)号：US20100190302A1
公开(公告)日：2010-07-29
申请号：US12756380
申请日：2010-04-08
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
摘要翻译： 通过改变包装表面的粗糙度，可以在集成电路封装中形成扩展或保留区域。 可以通过施加或生长具有小于500纳米尺寸的颗粒来改变表面粗糙度。 亲水性表面可以制成半吸水性，并且疏水表面可以由具有相同通用特征的颗粒制成半吸收。
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8.发明申请公开(公告)号：US20080067502A1
公开(公告)日：2008-03-20
申请号：US11521147
申请日：2006-09-14
IPC分类号： H01L51/00
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
摘要翻译： 通过改变包装表面的粗糙度，可以在集成电路封装中形成扩展或保留区域。 可以通过施加或生长具有小于500纳米尺寸的颗粒来改变表面粗糙度。 亲水性表面可以制成半吸水性，并且疏水表面可以由具有相同通用特征的颗粒制成半吸收。
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9.发明授权Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same 有权微电子器件的处理以及使用该微电子器件对微电子器件的损伤的方法公开(公告)号：US08304065B2
公开(公告)日：2012-11-06
申请号：US12655282
申请日：2009-12-28
申请人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
发明人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
IPC分类号： B32B7/02
CPC分类号： H01L21/6836 , H01L23/3164 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/131 , H01L2224/16 , H01L2224/81007 , H01L2224/81815 , H01L2924/0001 , H01L2924/10253 , Y10T428/24124 , Y10T428/2419 , Y10T428/24942 , Y10T428/2495 , Y10T428/25 , Y10T428/2839 , Y10T428/2852 , Y10T428/31703 , H01L2924/014 , H01L2224/13099 , H01L2924/00
摘要： A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.
摘要翻译： 微电子器件的处理包括切割带（110）和添加有颜料或其它着色剂的聚合物复合膜（120），并且在一些实施方案中，预固化玻璃化转变温度大于50℃。 膜可以包括多层，一层是粘性的，另一层在给定温度下是非粘性的。
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10.发明申请Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same 有权微电子器件的处理以及使用该微电子器件对微电子器件的损伤的方法公开(公告)号：US20110159256A1
公开(公告)日：2011-06-30
申请号：US12655282
申请日：2009-12-28
申请人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
发明人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
CPC分类号： H01L21/6836 , H01L23/3164 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/131 , H01L2224/16 , H01L2224/81007 , H01L2224/81815 , H01L2924/0001 , H01L2924/10253 , Y10T428/24124 , Y10T428/2419 , Y10T428/24942 , Y10T428/2495 , Y10T428/25 , Y10T428/2839 , Y10T428/2852 , Y10T428/31703 , H01L2924/014 , H01L2224/13099 , H01L2924/00
摘要： A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.
摘要翻译： 微电子器件的处理包括切割带（110）和添加有颜料或其它着色剂的聚合物复合膜（120），并且在一些实施方案中，预固化玻璃化转变温度大于50℃。 膜可以包括多层，一层是粘性的，另一层在给定温度下是非粘性的。
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