METALIZED PLASTIC ARTICLES AND METHODS THEREOF
    4.
    发明申请
    METALIZED PLASTIC ARTICLES AND METHODS THEREOF 有权
    金属化塑料制品及其方法

    公开(公告)号:US20140356645A1

    公开(公告)日:2014-12-04

    申请号:US14462293

    申请日:2014-08-18

    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-δ, Ca0.25Cu0.75TiO3-β, and TiO2-σ, wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

    Abstract translation: 金属化塑料基板及其方法在此提供。 该方法包括提供具有分散在塑料基板中的多个加速器的塑料基板。 所述促进剂具有选自CuFe 2 O 4-δ,Ca 0.25 La 0.75 TiO 3 - &bgr,和TiO 2 - & Gr,其中δ,&bgr; 表示相应促进剂中的氧空位,0.05& NlE;δ≦̸ 0.8,0.05≦̸&bgr;≦̸ 0.5和0.05≦̸&sgr;≦̸ 1.0。 该方法还包括去除塑料基板表面的至少一部分以暴露至少第一加速器。 该方法还包括电镀塑料基板的暴露表面以在至少第一加速器上形成至少第一金属层,然后电镀第一金属层以形成至少第二金属层。

    LOW-DIELECTRIC RESIN COMPOSITION, LOW-DIELECTRIC RESIN/METAL COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF, AND ELECTRONIC EQUIPMENT

    公开(公告)号:US20200224030A1

    公开(公告)日:2020-07-16

    申请号:US16608649

    申请日:2018-03-28

    Abstract: The present invention discloses a low-dielectric resin composition, a low-dielectric resin/metal composite material and a preparation method thereof, and an electronic device. The resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a base resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliary. The base resin is selected from the PBT resin and/or the PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. With the same base resin component, the dielectric constant and dielectric loss of the low-dielectric resin material prepared with the low-dielectric resin composition are significantly reduced, which is advantageous for satisfying the requirements of use of plastics for antenna channels in metal shell of an electronic device, so as to improve the ability of the electronic device having antennas to receive and transmit signals.

    METALIZED PLASTIC ARTICLES AND METHODS THEREOF
    7.
    发明申请
    METALIZED PLASTIC ARTICLES AND METHODS THEREOF 审中-公开
    金属化塑料制品及其方法

    公开(公告)号:US20150104668A1

    公开(公告)日:2015-04-16

    申请号:US14576950

    申请日:2014-12-19

    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

    Abstract translation: 金属化塑料基板及其方法在此提供。 该方法包括提供具有分散在塑料中的多个加速器的塑料。 加速剂具有式ABO 3,其中A是选自元素周期表第9,10和11族的一种或多种元素,B是选自元素周期表的第4B和5B族的一种或多种元素,以及 O是氧气。 该方法包括照射塑料基板的表面以暴露至少第一加速器的步骤。 该方法还包括电镀塑料基板的照射表面以在至少第一加速器上形成至少第一金属层,然后电镀第一金属层以形成至少第二金属层。

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