Abstract:
A metal-resin composite and method for producing the same are provided. The method comprises: A) forming nanopores in at least a part of a surface of a metal sheet; and B) injection molding a thermoplastic resin directly on the surface of the metal sheet. The thermoplastic resin includes a main resin and a polyolefin resin. The main resin includes a mixture of polyphenylene ether and polyphenylene sulfide. And the polyolefin resin has a melting point of about 65° C. to about 105° C.
Abstract:
A method for integrally molding a metal and a resin and a metal-resin composite structure obtainable by the same are provided. The method comprises forming a nanopore in a surface of a metal sheet; melting a thermoplastic resin on the surface of the metal sheet formed with the nanopore; and injection molding the thermoplastic resin onto the surface of the metal sheet. The thermoplastic resin is a mixture of a main resin and a polyolefin resin, the main resin is a mixture of polyphenylene oxide and a polyamide, and the polyolefin resin has a melting point of about 65° C. to about 105° C.
Abstract:
A method for integrally molding a metal and a resin and a metal-resin composite structure obtainable by the same are provided. The method comprises forming a nanopore in a surface of a metal sheet; melting a thermoplastic resin on the surface of the metal sheet formed with the nanopore; and injection molding the thermoplastic resin onto the surface of the metal sheet. The thermoplastic resin includes a mixture of a main resin and a polyolefin resin, the main resin is a polycarbonate, and the polyolefin resin has a melting point of about 65° C. to about 105° C.
Abstract:
Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-δ, Ca0.25Cu0.75TiO3-β, and TiO2-σ, wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
Abstract translation:金属化塑料基板及其方法在此提供。 该方法包括提供具有分散在塑料基板中的多个加速器的塑料基板。 所述促进剂具有选自CuFe 2 O 4-δ,Ca 0.25 La 0.75 TiO 3 - &bgr,和TiO 2 - & Gr,其中δ,&bgr; 表示相应促进剂中的氧空位,0.05& NlE;δ≦̸ 0.8,0.05≦̸&bgr;≦̸ 0.5和0.05≦̸&sgr;≦̸ 1.0。 该方法还包括去除塑料基板表面的至少一部分以暴露至少第一加速器。 该方法还包括电镀塑料基板的暴露表面以在至少第一加速器上形成至少第一金属层,然后电镀第一金属层以形成至少第二金属层。
Abstract:
The present invention discloses a low-dielectric resin composition, a low-dielectric resin/metal composite material and a preparation method thereof, and an electronic device. The resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a base resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliary. The base resin is selected from the PBT resin and/or the PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. With the same base resin component, the dielectric constant and dielectric loss of the low-dielectric resin material prepared with the low-dielectric resin composition are significantly reduced, which is advantageous for satisfying the requirements of use of plastics for antenna channels in metal shell of an electronic device, so as to improve the ability of the electronic device having antennas to receive and transmit signals.
Abstract:
The present invention discloses a method for metallizing a plastic surface. The method may comprise the steps of: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, the present invention discloses a method for preparing a plastic article and a plastic article as manufactured by the method as described.
Abstract:
Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.