摘要:
A method for selective metallization of a surface of a polymer article is provided. The polymer article contains a base polymer and at least one metal compound dispersed in the base polymer. The method includes gasifying at least a part of a surface of the polymer article by irradiating the surface with an energy source, and forming at least one metal layer on the surface of the polymer article by chemical plating. The metal compound contains a tin oxide doped with at least one doping element selected from a group including: V, Sb, In, and Mo.
摘要:
Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.
摘要:
A method of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO2-σ (I), M1M2pOq (II), 0.05≦σ
摘要:
The present invention discloses a method for metallizing a plastic surface. The method may comprise the steps of: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, the present invention discloses a method for preparing a plastic article and a plastic article as manufactured by the method as described.
摘要:
Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
摘要:
An ink composition is provided, a method of metalizing a surface of an insulation substrate and an article obtainable by the method are also provided. The ink composition may comprise a metal compound and an ink vehicle, the metal compound is at least one selected from a group consisting of a compound of formula I and a compound of formula II, TiO2-σ(I), M1M2pOq (II), 0.05≦σ
摘要:
A coating composition, a composite prepared by using the coating composition, and a method for preparing the composite are provided. The coating composition includes a solvent, an adhesive, and a catalyst precursor including at least one chosen from SnO2, ZnSnO3 and ZnTiO3.
摘要:
Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-δ, Ca0.25Cu0.75TiO3-β, and TiO2-σ, wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
摘要翻译:金属化塑料基板及其方法在此提供。 该方法包括提供具有分散在塑料基板中的多个加速器的塑料基板。 所述促进剂具有选自CuFe 2 O 4-δ,Ca 0.25 La 0.75 TiO 3 - &bgr,和TiO 2 - & Gr,其中δ,&bgr; 表示相应促进剂中的氧空位,0.05& NlE;δ≦̸ 0.8,0.05≦̸&bgr;≦̸ 0.5和0.05≦̸&sgr;≦̸ 1.0。 该方法还包括去除塑料基板表面的至少一部分以暴露至少第一加速器。 该方法还包括电镀塑料基板的暴露表面以在至少第一加速器上形成至少第一金属层,然后电镀第一金属层以形成至少第二金属层。
摘要:
The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0