公开(公告)号：US20180332716A1

公开(公告)日：2018-11-15

申请号：US16045986

申请日：2018-07-26

Applicant: CCL Label, Inc.

Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

IPC: H05K3/34 ,  H05K1/02 ,  H05K13/04 ,  H05K1/03

CPC classification number: H05K3/3494 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/1545

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

公开(公告)号：US20150180094A1

公开(公告)日：2015-06-25

申请号：US14415284

申请日：2013-07-18

Applicant: CCL LABEL, INC.

Inventor： Jamie Rieg ,  Anne Shim ,  John Walsh ,  Peikang Liu ,  Paul Janousek

IPC: H01M10/48 ,  H01M2/02

CPC classification number: H01M10/488 ,  G01R31/387 ,  H01M2/0267 ,  H01M6/505 ,  H01M10/48 ,  H01M2220/30 ,  Y10T83/04

Abstract: A battery assembly includes a battery, an outer layer, and a power indicator apparatus. The battery includes a first terminal and a second terminal. The power indicator apparatus comprises an electrical conductor and a mechanical switch. The electrical conductor is configured to be in continuous electrical communication with the first terminal. The mechanical switch is configured to be actuated by an application of pressure at a single location, and upon actuation, to place the electrical conductor in electrical communication with the second terminal such that the power indicator apparatus can facilitate a reading of a potential energy stored in the battery. Methods of assembly and methods of determining a potential energy stored in the battery are also provided herein.

Abstract translation: 电池组件包括电池，外层和电源指示装置。 电池包括第一端子和第二端子。 电源指示器装置包括电导体和机械开关。 电导体被配置为与第一端子连续电连通。 机械开关被配置为通过在单个位置处施加压力来致动，并且在致动时，将电导体与第二端子电连通，使得电力指示器装置可以便于读取存储在 电池。 本文还提供了组装方法和确定存储在电池中的势能的方法。

公开(公告)号：US20150111092A1

公开(公告)日：2015-04-23

申请号：US14397100

申请日：2013-04-26

Applicant: CCL Label, Inc.

Inventor： Paul Janousek ,  Vadim Zaikov ,  Farid Ghiam ,  Robert Quattlebaum ,  Walter Mueller

IPC: B32B27/08 ,  B32B1/02 ,  H01M2/02 ,  B65D75/00 ,  B32B27/32 ,  B32B27/30 ,  B29D99/00 ,  B32B27/36 ,  B29D7/01

CPC classification number: B32B27/08 ,  B29D7/01 ,  B29D99/006 ,  B29K2023/0633 ,  B29K2023/083 ,  B29K2023/12 ,  B29K2033/04 ,  B29K2067/00 ,  B29K2995/0051 ,  B29L2009/00 ,  B32B1/02 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/05 ,  B32B2250/24 ,  B32B2250/242 ,  B32B2250/246 ,  B32B2250/40 ,  B32B2307/736 ,  B32B2323/046 ,  B32B2323/10 ,  B32B2331/04 ,  B32B2333/08 ,  B32B2367/00 ,  B32B2439/40 ,  B65D75/002 ,  H01M2/026 ,  H01M2/0262 ,  H01M2/0267 ,  H01M2/0287 ,  Y10T428/1352 ,  Y10T428/31797 ,  Y10T428/31913

Abstract: A multi-layer shrink film. The shrink film can exhibit a significant amount of shrink within a certain temperature range that is above the onset temperature of the film. The film can exhibit a shrinkage that is at least about 50% of the total shrink within a temperature range T1 above the onset temperature of the film. In one aspect, the shrink film comprises a core layer and skin layers disposed about opposite surfaces of the core layer, and tie layers disposed between the core and the skin layers, the skin layers individually comprising a polyester, e.g., a glycol-modified polyester, and the tie layers individually comprising an anhydride modified material.

Abstract translation: 多层收缩膜。 收缩膜可以在高于膜的起始温度的一定温度范围内显示出显着的收缩量。 该膜可以在高于膜的起始温度T1的温度范围内表现出至少约50％的总收缩率的收缩率。 在一个方面，收缩膜包括芯层和设置在芯层的相对表面周围的表层，以及设置在芯和表皮层之间的连接层，皮层分别包含聚酯，例如二醇改性聚酯 并且粘结层各自包含酸酐改性材料。

公开(公告)号：US20160031185A1

公开(公告)日：2016-02-04

申请号：US14776851

申请日：2014-03-12

Applicant: CCL LABEL, INC.

Inventor： Paul Janousek ,  Alfredo YANES

IPC: B32B7/14 ,  H01M6/50 ,  G01K11/12 ,  B32B38/10 ,  H01R13/42 ,  B32B15/20 ,  H01M10/42

CPC classification number: B32B7/14 ,  B32B15/08 ,  B32B15/20 ,  B32B27/10 ,  B32B27/308 ,  B32B38/10 ,  B32B2307/202 ,  B32B2457/00 ,  B32B2457/10 ,  G01K11/12 ,  H01M2/0267 ,  H01M6/5083 ,  H01M10/4285 ,  H01R13/035 ,  H01R13/42

Abstract: Electrically conductive thin metallic films are disclosed. The thin films can be used to form shaped or patterned electrical conductors for consumer goods and electronic applications. Various connectors are also described which can be used in conjunction with the conductors to form thin layered assemblies such as battery testers. Also disclosed are methods for producing the shaped or patterned electrical conductors.

Abstract translation: 公开了导电薄金属膜。 薄膜可以用于形成用于消费品和电子应用的成形或图案化电导体。 还描述了各种连接器，其可以与导体结合使用以形成诸如电池测试器的薄层组件。 还公开了用于制造成形或图案化电导体的方法。

公开(公告)号：US20170311454A1

公开(公告)日：2017-10-26

申请号：US15497309

申请日：2017-04-26

Applicant: CCL Label, Inc.

Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

IPC: H05K3/34 ,  H05K13/04 ,  H05K1/02

CPC classification number: H05K3/3494 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/1545

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

公开(公告)号：US10356913B2

公开(公告)日：2019-07-16

申请号：US16045986

申请日：2018-07-26

Applicant: CCL Label, Inc.

Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

IPC: H05K3/34 ,  H05K13/04 ,  H05K1/02 ,  H05K1/03

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.

公开(公告)号：US10064289B2

公开(公告)日：2018-08-28

申请号：US15497309

申请日：2017-04-26

Applicant: CCL Label, Inc.

Inventor： Jamie Rieg ,  Randal Taylor ,  Willie Fowlkes ,  John Walsh ,  Paul Janousek

IPC: F27B9/06 ,  H05K1/11 ,  A21B1/22 ,  H05K3/34 ,  H05K1/02 ,  H05K13/04 ,  H05K1/03

CPC classification number: H05K3/3494 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/1545

Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.