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    High voltage chuck for a probe station
    1.
    发明授权
    High voltage chuck for a probe station 有权

    公开(公告)号：US10062597B2

    公开(公告)日：2018-08-28

    申请号：US15670364

    申请日：2017-08-07

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael E. Simmons ,  Kazuki Negishi ,  Ryan Garrison ,  Philip Wolf

    IPC: H01L21/683 ,  G01R31/28

    Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

    PROBE SYSTEMS AND METHODS INCLUDING ELECTRIC CONTACT DETECTION
    2.
    发明申请
    PROBE SYSTEMS AND METHODS INCLUDING ELECTRIC CONTACT DETECTION 审中-公开

    公开(公告)号：US20180284155A1

    公开(公告)日：2018-10-04

    申请号：US15934672

    申请日：2018-03-23

    Applicant: Cascade Microtech, Inc.

    Inventor： Sia Choon Beng ,  Kazuki Negishi

    IPC: G01R1/073 ,  G01R31/28 ,  G01R1/067

    CPC classification number: G01R1/07342 ,  G01R1/06777 ,  G01R1/07314 ,  G01R31/2886 ,  G01R31/2887 ,  G01R31/2891

    Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.

    Systems and methods for on-wafer dynamic testing of electronic devices
    3.
    发明授权
    Systems and methods for on-wafer dynamic testing of electronic devices 有权

    公开(公告)号：US10281518B2

    公开(公告)日：2019-05-07

    申请号：US14625385

    申请日：2015-02-18

    Applicant: Cascade Microtech, Inc.

    Inventor： Kazuki Negishi ,  Eric Hill

    IPC: G01R1/04 ,  G01R31/26 ,  G01R31/28

    Abstract: Systems and methods for on-wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conductive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another to selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.

    SYSTEMS AND METHODS FOR ON-WAFER DYNAMIC TESTING OF ELECTRONIC DEVICES
    5.
    发明申请
    SYSTEMS AND METHODS FOR ON-WAFER DYNAMIC TESTING OF ELECTRONIC DEVICES 审中-公开
    电子设备的静态动态测试系统和方法

    公开(公告)号：US20150241472A1

    公开(公告)日：2015-08-27

    申请号：US14625385

    申请日：2015-02-18

    Applicant: Cascade Microtech, Inc.

    Inventor： Kazuki Negishi ,  Eric Hill

    IPC: G01R1/04 ,  G01R1/073 ,  G01R31/26 ,  G01R1/067

    CPC classification number: G01R31/2601 ,  G01R31/2889

    Abstract: Systems and methods for on-wafer dynamic testing of electronic devices. The systems include a probe head assembly, a probe-side contacting structure, a chuck, and a chuck-side contacting structure. The probe head assembly includes a probe configured to electrically contact a first side of a device under test (DUT). The probe-side contacting structure includes a probe-side contacting region. The chuck includes an electrically conductive support surface configured to support a substrate that includes the DUT and to electrically contact a second side of the DUT. The probe head assembly and the chuck are configured to translate relative to one another to selectively establish electrical contact between the probe and the DUT. The chuck-side contacting structure includes a chuck-side contacting region that is in electrical communication with the electrically conductive support surface and opposed to the probe-side contacting structure. The methods may include methods of operating the system or systems.

    Abstract translation: 电子器件晶圆动态测试的系统和方法。 该系统包括探针头组件，探针侧接触结构，卡盘和卡盘侧接触结构。 探头组件包括被配置为电接触被测器件（DUT）的第一侧的探针。 探针侧接触结构包括探针侧接触区域。 卡盘包括被配置为支撑包括DUT的基板并且电接触DUT的第二侧的导电支撑表面。 探针头组件和卡盘被配置为相对于彼此平移以选择性地建立探针和DUT之间的电接触。 卡盘侧接触结构包括与导电支撑表面电连通并与探针侧接触结构相对的卡盘侧接触区域。 这些方法可以包括操作系统或系统的方法。

    Shielded probe systems
    6.
    发明授权
    Shielded probe systems 有权

    公开(公告)号：US10060950B2

    公开(公告)日：2018-08-28

    申请号：US14997345

    申请日：2016-01-15

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael E Simmons ,  Bryan Conrad Bolt ,  Christopher Anthony Storm ,  Kazuki Negishi ,  Joseph George Frankel ,  Robbie Ingram-Goble

    IPC: G01R31/00 ,  G01R1/18 ,  G01R1/067 ,  G01R31/28

    CPC classification number: G01R1/18 ,  G01R1/06705 ,  G01R31/2849

    Abstract: Shielded probe systems are disclosed herein. The probe systems are configured to test a device under test (DUT) and include a measurement chamber that at least partially bounds an enclosed volume, an aperture defined by the measurement chamber, a probing assembly, and a shielding structure. The probing assembly includes a probe, which is oriented within the enclosed volume, a probe arm, which is operatively attached to the probe, and a manipulator, which is operatively attached to the probe arm. At least a portion of the probing assembly extends through the aperture. The shielding structure extends between the measurement chamber and the probing assembly and is configured to restrict fluid flow through the aperture and shield the enclosed volume from an ambient environment that surrounds the measurement chamber while maintaining at least a threshold separation distance from the probe arm throughout a probe arm range-of-motion thereof.

    SHIELDED PROBE SYSTEMS
    8.
    发明申请
    SHIELDED PROBE SYSTEMS 审中-公开

    公开(公告)号：US20170205446A1

    公开(公告)日：2017-07-20

    申请号：US14997345

    申请日：2016-01-15

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael E. Simmons ,  Bryan Conrad Bolt ,  Christopher Anthony Storm ,  Kazuki Negishi ,  Joseph George Frankel ,  Robbie Ingram-Goble

    IPC: G01R1/18 ,  G01R1/067

    CPC classification number: G01R1/18 ,  G01R1/06705 ,  G01R31/2849

    Abstract: Shielded probe systems are disclosed herein. The probe systems are configured to test a device under test (DUT) and include a measurement chamber that at least partially bounds an enclosed volume, an aperture defined by the measurement chamber, a probing assembly, and a shielding structure. The probing assembly includes a probe, which is oriented within the enclosed volume, a probe arm, which is operatively attached to the probe, and a manipulator, which is operatively attached to the probe arm. At least a portion of the probing assembly extends through the aperture. The shielding structure extends between the measurement chamber and the probing assembly and is configured to restrict fluid flow through the aperture and shield the enclosed volume from an ambient environment that surrounds the measurement chamber while maintaining at least a threshold separation distance from the probe arm throughout a probe arm range-of-motion thereof.

    Probe systems and methods including electric contact detection
    9.
    发明授权
    Probe systems and methods including electric contact detection 有权

    公开(公告)号：US10330703B2

    公开(公告)日：2019-06-25

    申请号：US15934672

    申请日：2018-03-23

    Applicant: Cascade Microtech, Inc.

    Inventor： Sia Choon Beng ,  Kazuki Negishi

    IPC: G01R31/28 ,  G01R1/073 ,  G01R1/067

    Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.

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