摘要:
A semiconductor chip package and a semiconductor chip fabricating method are provided. A semiconductor chip package comprises at least two semiconductor chips having a stacked configuration, the semiconductor chips at least one of: sharing DC signals of DC generating circuits provided by one of the semiconductor chips; and sharing a DLL clock signal of a DLL circuit provided by the semiconductor chip having the DC generating circuits or provided by another semiconductor chip. Power consumption can be reduced, and sharing a DLL clock is valid. In addition, a stabilized DC supply can be guaranteed and an increase for level trimming range and productivity can be improved.
摘要:
A semiconductor chip package and a semiconductor chip fabricating method are provided. A semiconductor chip package comprises at least two semiconductor chips having a stacked configuration, the semiconductor chips at least one of: sharing DC signals of DC generating circuits provided by one of the semiconductor chips; and sharing a DLL clock signal of a DLL circuit provided by the semiconductor chip having the DC generating circuits or provided by another semiconductor chip. Power consumption can be reduced, and sharing a DLL clock is valid. In addition, a stabilized DC supply can be guaranteed and an increase for level trimming range and productivity can be improved.
摘要:
A delay-locked loop (DLL) circuit includes a standby signal generating circuit, a front stage circuit, and a back stage circuit. The standby signal generating circuit generates a first standby signal and a second standby signal in response to an active signal, a crock enable signal, a first column address strobe (CAS) latency signal, and a second CAS latency signal. The front stage circuit compares the phase of an external clock signal and the phase of a feedback signal and delays the external clock signal based on the phase difference between the external clock signal and the feedback signal to generate a first clock signal. The back stage circuit executes interpolation and duty-cycle correction on the first clock signal.
摘要:
A delay-locked loop (DLL) circuit includes a standby signal generating circuit, a front stage circuit, and a back stage circuit. The standby signal generating circuit generates a first standby signal and a second standby signal in response to an active signal, a crock enable signal, a first column address strobe (CAS) latency signal, and a second CAS latency signal. The front stage circuit compares the phase of an external clock signal and the phase of a feedback signal and delays the external clock signal based on the phase difference between the external clock signal and the feedback signal to generate a first clock signal. The back stage circuit executes interpolation and duty-cycle correction on the first clock signal.
摘要:
The present invention provides a semiconductor memory device comprising a memory cell array including a plurality of memory regions, an address decoding portion for decoding an address applied from an external portion for simultaneously selecting all of the plurality of memory regions during a test read operation, a data IO control portion for receiving test pattern data and writing the test pattern data to each of the plurality of memory regions during a test write operation, and reading the test pattern data from one of the plurality of memory regions and outputting the test pattern data during the test read operation, a data IO portion for receiving the test pattern data from the external portion and applying the test pattern data to the data IO control portion during the test write operation, and receiving the test pattern data output from the data IO control portion and conditionally outputting the test pattern data as test status data to the external portion in response to an output control signal during the test read operation, and a test control signal generating portion for comparing the test pattern data read from the plurality of memory regions to generate the output control signal for conditionally outputting the test pattern data as the test status data during the test read operation.
摘要:
A semiconductor device for generating a test voltage for a wafer burn-in test and method thereof is disclosed. To generate the test voltage for a wafer burn-in test, a control signal may be generated in response to a supply voltage from an external wafer burn-in test device. A supplementary voltage may be generated in response to the control signal by using an internal voltage driving circuit. The test voltage may be generated by combining the supply voltage and the supplementary voltage.
摘要:
In an embodiment, a semiconductor memory device includes a clock latency that can be controlled responsive to whether or not an output order of burst data is reordered. The semiconductor memory device may comprise a control unit and a latency control unit. The control unit may generate a latency control signal having a logic level that varies depending on whether or not an output order of burst data is reordered. The latency control unit may control a latency value in response to the latency control signal. The semiconductor memory device and the method of controlling the latency value responsive to a reordering of the burst data allow for an optimally fast memory access time.
摘要:
An integrated circuit device includes a test circuit and at least one flag generator circuit. The test circuit is configured to generate first and second sets of test results in parallel in response to a memory test operation. The first and second sets of test results respectively correspond to first and second memory banks. The test circuit is further configured to merge respective ones of the first set of test results with respective ones of the second set of test results to provide a set of merged test results to respective ones of a set of output terminals of the integrated circuit device. The at least one flag generator circuit is configured to generate a first flag signal that indicates a presence of at least one memory test error in the first set of test results, and a second flag signal that indicates a presence of at least one memory test error in the second set of test results. Based on the set of merged test results and the first and second flag signals, the test circuit may determine which of the memory blocks of the first and second memory banks includes a defective memory cell therein. Related methods are also discussed.
摘要:
A semiconductor memory device includes a plurality of sub-wordlines, a plurality of sub-wordlines corresponding a redundancy main wordline, a plurality of redundancy memory cells each being coupled to each of the redundancy sub-wordlines, and a redundancy control circuit for disabling the main wordline selector when among the sub-wordlines, a sub-wordline to which a defective memory cell is coupled is addressed, and for controlling the sub-wordline to be replaced by the redundancy main wordline. The number of the redundancy sub-wordlines coupled to the redundancy main wordline is smaller than the number of the sub-wordlines coupled to the main wordline. Therefore, when among the sub-wordlines coupled to the main wordline, a sub-wordline to which a normal main memory cell is coupled is addressed, the main wordline selector is enabled to improve a redundancy flexibility and reduce a circuit area.
摘要:
A word line driver for use in a semiconductor memory device includes a boosted voltage generator, a sub word line driver and a main word line driver. The boosted voltage generator generates a boosted voltage by receiving an internal power supply voltage and pumping electric charge. The sub word line driver receives the internal power supply voltage and activates a boosted voltage control signal after supplying the internal power supply voltage to a boost node in a command operating mode. The main word line driver enables a word line by supplying the boosted voltage to the boost node in response to the boosted voltage control signal in a normal operating mode, and enables the word line with the boosted voltage after boosting the word line to the internal power supply voltage by changing the boost node from the internal power supply voltage to the boosted voltage in the command operating mode.