公开(公告)号：US20140284643A1

公开(公告)日：2014-09-25

申请号：US14221982

申请日：2014-03-21

Applicant: Cree, Inc.

Inventor： Peter Scott Andrews ,  Ban P. Loh

IPC: H01L33/60 ,  H01L33/52 ,  H01L33/64

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

Abstract translation: 提供一种发光管芯封装，其包括在第一表面上具有第一表面和第一导电引线的金属基板。 第一导电引线通过绝缘膜与基板绝缘。 第一导电引线形成用于安装发光器件的安装焊盘。 该封装包括电连接到第一导电引线并远离第一表面延伸的金属引线。

公开(公告)号：US20140256072A1

公开(公告)日：2014-09-11

申请号：US14284940

申请日：2014-05-22

Applicant: Cree, Inc.

Inventor： Ban P. Loh ,  Nathaniel O. Cannon ,  Norbert Hiller ,  John Edmond ,  Mitch Jackson ,  Nicholas W. Medendorp, JR.

IPC: H01L33/52 ,  H01L33/62

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A submount for a light emitting device package includes a substrate with a first bond pad and a second bond pad on a first surface. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are on the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad.

Abstract translation: 用于发光器件封装的基座包括在第一表面上具有第一接合焊盘和第二接合焊盘的衬底。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘位于衬底的第二表面上。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。

公开(公告)号：US20130323865A1

公开(公告)日：2013-12-05

申请号：US13897952

申请日：2013-05-20

Applicant: CREE, INC.

Inventor： Ban P. Loh ,  Gerald H. Negley

IPC: H01L33/64

CPC classification number: H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

Abstract translation: 公开了一种发光管芯封装及其制造方法。 模具封装包括引线框架，至少一个发光器件（LED），成型体和透镜。 引线框架包括多个引线并且具有顶侧和底侧。 引线框架的一部分限定了安装垫。 LED装置安装在安装垫上。 成型体与引线框架的一部分一体化并且在引线框架的顶侧上限定开口，围绕安装垫的开口。 成型体还包括在引线框的底侧上的闩锁。 透镜与成型体相连。 复合透镜用作反射器和成像工具，用于收集和引导由LED发射的光以获得期望的光谱和发光性能。

公开(公告)号：US08932886B2

公开(公告)日：2015-01-13

申请号：US13897952

申请日：2013-05-20

Applicant: Cree, Inc.

Inventor： Ban P. Loh ,  Gerald H. Negley

IPC: H01L21/56 ,  H01L33/64 ,  H01L33/48 ,  H01L33/58

CPC classification number: H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

Abstract translation: 公开了一种发光管芯封装及其制造方法。 模具封装包括引线框架，至少一个发光器件（LED），成型体和透镜。 引线框架包括多个引线并且具有顶侧和底侧。 引线框架的一部分限定了安装垫。 LED装置安装在安装垫上。 成型体与引线框架的一部分一体化并且在引线框架的顶侧上限定开口，围绕安装垫的开口。 成型体还包括在引线框的底侧上的闩锁。 透镜与成型体相连。 复合透镜用作反射器和成像工具，用于收集和引导由LED发射的光以获得期望的光谱和发光性能。