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公开(公告)号:US20240426523A1
公开(公告)日:2024-12-26
申请号:US18824748
申请日:2024-09-04
Applicant: DENSO CORPORATION
Inventor: Junki HIRAYAMA , Toru OKAMURA , Naoya MAKIMOTO , Hiroaki KAWANO , Naito MUTO , Yoshiki KATO
Abstract: A refrigeration cycle device includes a compressor, a radiator, a first decompression unit, a first evaporator, a second decompression unit, and a second evaporator. A refrigerant joining portion joins refrigerant having passed through the first evaporator and the second evaporator, on a refrigerant suction side of the compressor. The first decompression unit regulates a degree of superheating of the refrigerant between the first evaporator and the refrigerant joining portion on the basis of a first physical quantity having a correlation with the degree of superheating of the refrigerant flowing between the first evaporator and the refrigerant joining portion. The second decompression unit regulates a degree of superheating of the refrigerant between the refrigerant joining portion and the compressor on the basis of a second physical quantity having a correlation with the degree of superheating of the refrigerant flowing between the refrigerant joining portion and the compressor.
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公开(公告)号:US20210316594A1
公开(公告)日:2021-10-14
申请号:US17354591
申请日:2021-06-22
Applicant: DENSO CORPORATION
Inventor: Hiroaki KAWANO , Yoshiki KATO , Masamichi MAKIHARA , Takahiro MAEDA , Kuniyoshi TANIOKA , Toru OKAMURA , Naoya MAKIMOTO
Abstract: A vehicular air conditioner includes a refrigeration cycle system, a high-temperature heat medium circuit, and a low-temperature heat medium circuit. The high-temperature heat medium circuit includes an air-heat medium heat exchanger, a heater core, a branching portion, a common passage, a flow rate adjuster, and an auxiliary heat source. The air-heat medium heat exchanger exchanges heat between the heat medium and an outside air. The heater core is arranged parallel to the air-heat medium heat exchanger and causes the heat medium to transfer heat to a ventilation air. The branching portion divides a flow of the heat medium into a flow toward the air-heat medium heat exchanger and a flow toward the heater core. The auxiliary heat source is arranged in the common passage at a position upstream of the branching portion.
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公开(公告)号:US20190190102A1
公开(公告)日:2019-06-20
申请号:US16285275
申请日:2019-02-26
Applicant: DENSO CORPORATION
Inventor: Koji MIURA , Takashi YAMANAKA , Yasumitsu OMI , Yoshiki KATO , Masayuki TAKEUCHI , Takeshi YOSHINORI
IPC: H01M10/6569 , F28D15/06 , H01M10/613 , H01M10/625 , H01M10/633 , H01M10/6552 , B60L58/26
CPC classification number: H01M10/6569 , B60K6/28 , B60L58/26 , B60Y2200/91 , B60Y2200/92 , B60Y2306/05 , B60Y2400/112 , F28D15/02 , F28D15/06 , H01M10/613 , H01M10/625 , H01M10/633 , H01M10/6552 , H01M10/6556 , H01M2220/20 , H05K7/20
Abstract: A device temperature regulator is provided with a gas passage part that guides a gaseous working fluid evaporated in a device heat exchanger to a condenser, and a liquid passage part that guides a liquid working fluid condensed in the condenser to the device heat exchanger. The device temperature regulator is provided with a supply amount regulator that increases or decreases a supply amount of the liquid working fluid supplied to the device heat exchanger. The supply amount regulator decreases the supply amount of the liquid working fluid to the device heat exchanger such that a liquid surface is formed in a state where the gaseous working fluid is positioned at a lower side lower than a heat exchanging portion exchanging heat with a temperature regulation target device in the device heat exchanger, when a condition for keeping the temperature regulation target device at a temperature is satisfied.
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公开(公告)号:US20180269122A1
公开(公告)日:2018-09-20
申请号:US15907883
申请日:2018-02-28
Applicant: DENSO CORPORATION
Inventor: Yoshiki KATO , Yasuhiro ISHIMOTO
CPC classification number: H01L23/16 , H01L21/563 , H01L23/3178 , H01L24/26
Abstract: A printed substrate having a first surface to which an electronic component is to be fixed through an underfill material includes a groove that is recessed from the first surface. The first surface includes a pair of lands that is to be electrically connected to the electronic component. The groove extends in a first direction in which the pair of lands extends and is located in a facing region of the first surface in which the first surface is to face the electronic component. An electronic device includes the printed substrate, the electronic component fixed to the first surface and the underfill material disposed between the first surface and the electronic component.
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公开(公告)号:US20250012518A1
公开(公告)日:2025-01-09
申请号:US18886515
申请日:2024-09-16
Applicant: DENSO CORPORATION
Inventor: Junki HIRAYAMA , Toru OKAMURA , Naoya MAKIMOTO , Hiroaki KAWANO , Naito MUTO , Yoshiki KATO
Abstract: A composite heat exchanger is used in a vapor compression refrigeration cycle. The vapor compression refrigeration cycle includes: a compressor; a decompressor configured to decompress a high-pressure refrigerant discharged from the compressor; and an evaporator configured to evaporate a low-pressure refrigerant decompressed at the decompressor by exchanging heat between the low-pressure refrigerant and a first heat medium. The composite heat exchanger includes a condenser unit, a liquid storage unit temporarily storing a high-pressure liquid refrigerant, a sub-cooler unit sub-cooling the high-pressure liquid refrigerant through heat exchange with a second heat medium, and an internal heat exchanger unit exchanging heat between the high-pressure liquid refrigerant passed through the sub-cooler unit and the low-pressure refrigerant. The condenser unit, the sub-cooler unit and the internal heat exchanger unit are joined together by a predetermined binding element and thereby form an integral structure.
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公开(公告)号:US20240424857A1
公开(公告)日:2024-12-26
申请号:US18825937
申请日:2024-09-05
Applicant: DENSO CORPORATION
Inventor: Yoshio HAYASHI , Yoshiki KATO , Yukihisa IJUIN , Hiroaki KAWANO , Yasuhiro YOKOO , Junki HIRAYAMA , Naito MUTO , Kohei NOGUCHI
Abstract: A combined heat exchanger exchanges heat between a refrigerant circulating through a vapor compression type refrigeration cycle, a first heat medium flowing through a first heat medium circuit including a first heat generating element, and a second heat medium flowing through a second heat medium circuit including a second heat generating element. The combined heat exchanger includes a refrigerant flow channel portion through which the refrigerant flows, a first heat medium flow channel portion through which the first heat medium flows, and a second heat medium flow channel portion through which the second heat medium flows. The refrigerant flow channel portion, the first heat medium flow channel portion, and the second heat medium flow channel portion are arranged to transfer heat of the refrigerant to both the first heat medium and the second heat medium.
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公开(公告)号:US20200158380A1
公开(公告)日:2020-05-21
申请号:US16774139
申请日:2020-01-28
Applicant: DENSO CORPORATION
Inventor: Satoshi SUZUKI , Yoshiki KATO
Abstract: A combined heat exchanger includes a heat exchange unit having a plurality of plate-like members stacked together. The heat exchange unit includes a heat absorption evaporation unit and an internal heat exchange unit. The heat absorption evaporation unit includes a heat absorption refrigerant passage, and the internal heat exchange unit includes a high pressure refrigerant passage and a low pressure refrigerant passage. The combined heat exchanger has at least one of a high pressure refrigerant outlet port that allows the refrigerant flowing out of the high pressure refrigerant passage to flow out to a cooling refrigerant passage and a low pressure refrigerant inlet port that allows the refrigerant flowing out of the cooling refrigerant passage to flow into the low pressure refrigerant passage.
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公开(公告)号:US20190204014A1
公开(公告)日:2019-07-04
申请号:US16326403
申请日:2017-08-02
Applicant: DENSO CORPORATION
Inventor: Takeshi YOSHINORI , Takashi YAMANAKA , Yoshiki KATO , Masayuki TAKEUCHI , Koji MIURA , Yasumitsu OMI
IPC: F28D15/02 , H01M10/613 , H01M10/625 , H01M10/6556 , H01M10/6569 , H05K7/20
CPC classification number: F28D15/025 , F28D15/02 , F28D15/0266 , H01M10/613 , H01M10/625 , H01M10/6556 , H01M10/6569 , H01M2220/20 , H05K7/20 , H05K7/20309 , H05K7/20318 , H05K7/20327
Abstract: An evaporator includes a fluid chamber in which a working fluid flows. A condenser includes a gas-phase portion in which the working fluid evaporated in the evaporator flows and a liquid-phase portion in which the working fluid from the gas-phase portion, condensed by heat exchange with an external medium, flows. A gas-phase passage causes the working fluid evaporated in the evaporator to flow to the condenser. A liquid-phase passage causes the working fluid condensed in the condenser to flow to the evaporator. A bypass passage has one end connected to the liquid-phase portion of the condenser or the liquid-phase passage and another end connected to the gas-phase portion of the condenser or the gas-phase passage. A flow rate of a liquid-phase working fluid per unit volume in the bypass passage is smaller than a flow rate of a liquid-phase working fluid per unit volume in the liquid-phase portion of the condenser or the liquid-phase passage.
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公开(公告)号:US20190186843A1
公开(公告)日:2019-06-20
申请号:US16282477
申请日:2019-02-22
Applicant: DENSO CORPORATION
Inventor: Masayuki TAKEUCHI , Yasumitsu OMI , Takashi YAMANAKA , Yoshiki KATO , Takeshi YOSHINORI , Koji MIURA
IPC: F28D15/06 , H01M10/613 , H01M10/625 , H01M10/63 , H01M10/647 , H01M10/6556 , H01M10/6569 , H05K7/20
CPC classification number: F28D15/06 , B60H2001/00307 , F28D15/02 , H01M10/613 , H01M10/625 , H01M10/63 , H01M10/633 , H01M10/647 , H01M10/652 , H01M10/6556 , H01M10/6569 , H01M2220/20 , H05K7/20
Abstract: A device temperature regulator includes a forward passage in which a forward flow passage is formed to cause a working fluid to flow to a heat absorber from a heat radiator, and a backward passage in which a backward flow passage is formed to cause the working fluid to flow to the heat radiator from the heat absorber. In addition, the device temperature regulator includes a bubble generator, which generates a bubble in the working fluid collecting in the heat absorber and having a liquid phase, and a controller that causes the bubble generator to generate the bubble in a precondition is satisfied.
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公开(公告)号:US20180238223A1
公开(公告)日:2018-08-23
申请号:US15763850
申请日:2016-09-06
Applicant: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor: Norihiko ENOMOTO , Yoshiki KATO , Masayuki TAKEUCHI , Koji MIURA , Keigo SATO , Kengo SUGIMURA , Nobuharu KAKEHASHI , Ikuo OZAWA , Ariel MARASIGAN , Yoshikazu SHINPO , Yoichi ONISHI , Toshio MURATA
CPC classification number: F01P7/16 , F01N5/02 , F01P3/18 , F01P3/20 , F01P5/10 , F01P11/0295 , F01P2005/105 , F01P2005/125 , F01P2007/146 , F01P2025/32 , F01P2060/08 , F01P2060/14 , F01P2060/16 , F02G5/02 , F02M26/23 , Y02T10/16 , Y10S903/903
Abstract: A vehicular heat management device includes a first heat source, a second heat source, a first heat generator, a second heat generator, a heat generator pathway, a first heat source pathway, a second heat source pathway, and a switching portion. The first heat source and the second heat source heat a heat medium. The first heat generator generates heat according to operation. The second heat generator generates heat according to operation. The first heat generator and the second heat generator are provided in the heat generator pathway. The first heat generator is provided in the first heat generator pathway. The second heat generator is provided in the second heat generator pathway. The switching portion switches between a condition where the heat generator pathway is in flowing communication with the first heat generator pathway and a condition where the heat generator pathway is in flowing communication with the second heat generator pathway.
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