公开(公告)号：US20190140122A1

公开(公告)日：2019-05-09

申请号：US16222112

申请日：2018-12-17

Applicant: Dow Global Technologies LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Michael D. White

IPC: H01L31/048 ,  H01L31/18

Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

公开(公告)号：US20170338360A1

公开(公告)日：2017-11-23

申请号：US15522477

申请日：2015-10-30

Applicant: Dow Global Technologies LLC

Inventor： Fanny Deplace ,  Kumar Nanjundiah ,  Jeffrey E. Bonekamp ,  John A. Naumovitz

IPC: H01L31/049 ,  C09D7/12 ,  H01L31/048 ,  C09D123/08 ,  C08K3/36 ,  C08K9/04

CPC classification number: H01L31/049 ,  C08K3/36 ,  C08K9/04 ,  C08L2203/204 ,  C08L2312/08 ,  C09D7/62 ,  C09D123/0815 ,  C09D123/10 ,  C09D151/06 ,  C09D153/00 ,  H01L31/0481 ,  H01L31/0488 ,  H02S40/44 ,  Y02E10/50 ,  C08L51/06

Abstract: The present disclosure provides a photovoltaic module. In an embodiment, the photovoltaic module includes a photovoltaic cell, and a layer composed of a film. The film includes a silane-grafted polyolefin (Si-g-PO) resin composition comprising (i) one or more silane grafted polyolefins and (ii) from greater than 0 wt % to less than 5.0 wt % of a micronized silica gel, based on the total weight of the Si-g-PO resin composition. The film has a glass adhesion greater than or equal to 15 N/mm after aging the film at 40° C. and 0% relative humidity for 60 days as measured in accordance with ASTM F88/88M-09.

公开(公告)号：US20140174509A1

公开(公告)日：2014-06-26

申请号：US14119588

申请日：2012-06-28

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Jeffrey E. Bonekamp ,  Yushan Hu ,  Nichole E. Nickel ,  Lih-Long Chu ,  John A. Naumovitz ,  Mark G. Hofius

IPC: H01L31/048 ,  B32B27/08 ,  H01L31/18 ,  B32B27/32

CPC classification number: H01L31/049 ,  B29C41/003 ,  B29C41/26 ,  B29C41/32 ,  B29K2023/06 ,  B29K2023/0625 ,  B29L2009/00 ,  B32B27/08 ,  B32B27/32 ,  B32B37/185 ,  B32B2270/00 ,  B32B2323/04 ,  B32B2457/12 ,  C08L53/00 ,  C08L2203/204 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2205/12 ,  H01L31/0481 ,  H01L31/18 ,  Y02E10/50

Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 1255 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell. Also disclosed is a lamination process to construct a laminated PV module comprising such multilayer film structures.

Abstract translation: 公开了包括包含结晶嵌段共聚物复合物（CBC）或特定嵌段共聚物复合材料（BC）的层（B）的多层膜结构，其包含i）包含至少80mol％聚合的乙烯的乙烯聚合物（EP） ii）基于α-烯烃的结晶聚合物（CAOP）和iii）包含（a）包含至少80mol％聚合的乙烯和（b）结晶α-烯烃嵌段（CAOB））的乙烯聚合物嵌段的嵌段共聚物; 以及包含聚烯烃的层C，其具有大于1255℃的至少一个熔融峰，层C的上表面与层B的底面表面粘合接触。这种多层膜结构优选包含（A）密封层 A具有与层B的顶面表面粘合接触的底部面部表面。这种膜适用于包括诸如PV电池的电子器件的电子器件（ED）模块。 还公开了构成包含这种多层膜结构的叠层PV模块的叠层工艺。

公开(公告)号：US20180304602A1

公开(公告)日：2018-10-25

申请号：US15768384

申请日：2016-11-18

Applicant: Dow Global Technologies LLC

Inventor： Carmelo Declet Perez ,  Brian W. Walther ,  James L. Cooper ,  Michael B. Biscoglio ,  John A. Naumovitz

IPC: B32B27/30 ,  B32B15/082 ,  B32B7/12 ,  C08F210/02 ,  C08F220/18 ,  C08F10/02 ,  C08F10/06

CPC classification number: B32B27/308 ,  B32B7/12 ,  B32B15/082 ,  C08F10/02 ,  C08F10/06 ,  C08F210/02 ,  C08F220/18 ,  C08F2500/07 ,  C08F2500/08 ,  C08F2500/12 ,  C08F2500/17 ,  C08L23/0815 ,  C08L2203/16 ,  C08L33/08 ,  C08L33/10 ,  C08L67/00

Abstract: The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having an acid content greater than 4 and up to 25 weight percent based on the weight of the copolymer and having a melt index (I2) of 1 to 60 g/10 minutes, wherein the total amount of ethylene acrylic acid copolymer and ethylene methacrylic acid copolymer comprises 45 to 99 weight percent of the blend based on the total weight of the blend, and a polyolefin having a density of 0.870 g/cm3 or more and having a melt index (I2) of 20 g/10 minutes or less, wherein the polyolefin comprises 1 to 55 weight percent of the blend based on the total weight of the blend.

公开(公告)号：US20130118583A1

公开(公告)日：2013-05-16

申请号：US13667744

申请日：2012-11-02

Applicant: Dow Global Technologies LLC

Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC: H01L31/048 ,  H01L31/18

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Abstract translation: 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点小于约95℃，（d）基于聚合物的重量，至少约15至小于约50重量％的烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

公开(公告)号：US10759152B2

公开(公告)日：2020-09-01

申请号：US16205687

申请日：2018-11-30

Applicant: Dow Global Technologies LLC

Inventor： Jeffrey E Bonekamp ,  Yushan Hu ,  Nichole E. Nickel ,  Lih-Long Chu ,  John A. Naumovitz ,  Mark G. Hofius

IPC: B32B27/32 ,  H01L31/049 ,  H01L31/048 ,  C08L53/00 ,  B32B27/08 ,  H01L31/18

Abstract: A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

公开(公告)号：US20200048448A1

公开(公告)日：2020-02-13

申请号：US15738866

申请日：2016-08-17

Applicant: Dow Global Technologies LLC

Inventor： Huiqing Zhang ,  Douglas E. Beyer ,  John A. Naumovitz

IPC: C08L27/08 ,  C08L91/06 ,  C08L23/06 ,  C08L23/30 ,  C08F220/18 ,  C08K5/00

Abstract: The present invention relates generally to vinylidene chloride polymer compositions. In one embodiment, a vinylidene chloride polymer composition comprises (a) a vinylidene chloride polymer formed from a monomer mixture comprising from 60 to 99 weight percent vinylidene chloride monomer and from 40 to 1 weight percent of a monoethylenically unsaturated monomer copolymerizable therewith; (b) 0.3 to 5 weight percent of an acrylic polymer based on the total weight of the polymer composition; and (c) 0.2 to 7 weight percent of at least one additive comprising (i) at least one wax in an amount of from 0.01 to 2 weight percent based on the total weight of the polymer composition, (ii) at least one polyethylene having a density greater than 0.940 g/cm3 in an amount of from 0.1 to 5 weight percent based on the total weight of the polymer composition, or combinations thereof.

公开(公告)号：US20160149063A1

公开(公告)日：2016-05-26

申请号：US14901342

申请日：2014-06-13

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Huiqing Zhang ,  Aude Pochon ,  John A. Naumovitz ,  Rudolf J. Koopmans ,  Ray E. Drumright

IPC: H01L31/048 ,  B32B7/10 ,  B32B7/12 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B27/32 ,  H01L31/049 ,  B32B27/08

CPC classification number: H01L31/0481 ,  B32B7/10 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/304 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2457/12 ,  H01L31/049

Abstract: A backsheet or frontsheet having an outer layer with a melting temperature greater than or equal to 150° C. includes at least one surface comprising a surface modification to improve adhesion between the backsheet or frontsheet and an encapsulant. The adhesion of the backsheet or frontsheet and encapsulant, after lamination, is at least 20 N/cm, preferably at least 40 N/cm or no adhesion failure. More preferably, the adhesion is at least 20 N/cm, even more preferably 40 N/cm or no adhesion failure, before and after 1,000 hours, preferably 2,000 hours, of damp heat aging at 85° C. and 85% humidity.

Abstract translation: 具有熔融温度大于或等于150℃的外层的底片或前片包括至少一个表面，其包括表面改性以改善底片或前片与密封剂之间的粘附。 底片或前片和密封剂在层压之后的粘附力为至少20N / cm，优选至少40N / cm，或无粘附破坏。 更优选地，在85℃和85％湿度下，在1000小时，优选2000小时的湿热老化之前和之后，粘合力至少为20N / cm，甚至更优选为40N / cm，或者没有粘附破坏。

公开(公告)号：US20150013753A1

公开(公告)日：2015-01-15

申请号：US14371136

申请日：2013-02-01

Applicant: Dow Global Technologies LLC

Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Rajen M. Patel ,  Morgan M. Hughes ,  Frank J. Cerk

IPC: H01L31/048 ,  C08J5/18

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10697 ,  C08F4/65908 ,  C08F4/65912 ,  C08F255/02 ,  C08J5/18 ,  C08J2351/06 ,  H01L31/048 ,  H02S40/34 ,  Y02E10/50 ,  C08F230/08 ,  C08F2500/08 ,  C08F2500/26 ,  C08F210/16 ,  C08F210/14 ,  C08F4/64093 ,  C08F4/6592

Abstract: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).

Abstract translation: 在本申请中更详细地公开的是具有一层或多层的乙烯互聚物膜，其包含表面层，其包含：（A）含硅烷的乙烯互聚物，其包含（1）密度小于0.905g / cm 3的乙烯互聚物，以及 （2）至少0.1重量％的烷氧基硅烷; 其特征在于：（3）在60℃下测量的体积电阻率大于5×1015欧姆 - 厘米。在一个实施方案中，这种乙烯互聚物的残余硼含量小于10ppm，残余铝含量小于100 ppm。 还公开了层压电子器件模块，其包括：A.至少一个电子器件，以及B.如上所述的乙烯互聚物膜之一，与电子器件的至少一个表面紧密接触。 已经示出了根据本发明的这种层压电子器件模块遭受降低的电位诱导退化（“PID”）。

公开(公告)号：US20130112270A1

公开(公告)日：2013-05-09

申请号：US13667722

申请日：2012-11-02

Applicant: Dow Global Technologies LLC

Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC: C08F210/02 ,  H01L31/048

CPC classification number: C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Abstract translation: 电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。 通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。 任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。