摘要:
Provided are a photosensitive coloring composition including a coloring material, a photopolymerization initiator A1 having a light absorption coefficient of 1.0×104 mL/g·cm or more at a wavelength of 365 nm in methanol, a photopolymerization initiator A2 having a light absorption coefficient of 1.0×102 mL/g·cm or less at a wavelength of 365 nm in methanol and having a light absorption coefficient of 1.0×103 mL/g·cm or more at a wavelength of 254 nm in methanol, and a polymerizable monomer, in which a content of the polymerizable monomer in a total solid content of the photosensitive coloring composition is 15% by mass or more; a cured film, a method for forming a pattern, a color filter, a solid-state imaging element, and an image display device.
摘要:
An optical member set which has a first optical member formed by curing a composition of curable resins, and a second optical member which is covered by the first optical member, in which the contact angle with water on a surface, which comes into contact with a first optical member, of the second optical member is 70 to 97° and the contact angle with the water on a surface of the opposite side to the side, which comes into contact with the second optical member, of the first optical member is 80 to 115°.
摘要:
A gap embedding composition used for embedding a patterned gap formed between photosensitive resin film portions on a semiconductor substrate surface, the gap embedding composition, at least having: a hydrolysis condensate of an aryloxysilane raw material; and an aromatic compound, as a solvent.
摘要:
A curable resin composition, for forming a first optical member of an optical member set, the optical member having the first optical member and a second optical member covered with the first optical member, the first optical member being formed by curing a siloxane resin, comprising: a siloxane resin, a surfactant, and a solvent, the siloxane resin and the surfactant being contained in the solvent, the surfactant having a polyoxyalkylene structure, the siloxane resin being defined in 65% by mass to 100% by mass thereof having a particular polysilsesquioxane structure.