公开(公告)号：US10747375B2

公开(公告)日：2020-08-18

申请号：US15794961

申请日：2017-10-26

Applicant: FUJIFILM Corporation

Inventor： Masafumi Yoshida ,  Nobuyuki Tada

IPC: G06F3/044 ,  H01Q1/22 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/44 ,  H01Q13/10

Abstract: An antenna has a visible light transparent substrate, and a pattern including metal fine wires provided on the visible light transparent substrate and having a plurality of opening portions. In the pattern, a line width of the metal fine wire is 0.5 to 5.0 μm, an opening ratio is 70% or greater, and surface electrical resistance is 9 Ω/sq. or less. A method of manufacturing an antenna has a step of forming a pattern in which a line width of metal fine wires is 0.5 to 5.0 μm, and an opening ratio is 70% or greater by an electroless copper plating treatment. A touch sensor has a touch sensor unit which is provided in a visible light transparent substrate and which includes at least a detection electrode in which a plurality of opening portions are formed of conductive fine wires, and at least one antenna provided on the substrate.

公开(公告)号：US09376581B2

公开(公告)日：2016-06-28

申请号：US14483860

申请日：2014-09-11

Applicant: FUJIFILM Corporation

Inventor： Hirotaka Kitagawa ,  Masafumi Yoshida

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C09D11/101 ,  C08F220/18 ,  C08F236/20 ,  C08F2/48 ,  G03F7/00 ,  G03F7/004 ,  G03F7/027 ,  B05D5/00 ,  B29C59/00 ,  B29C59/16 ,  H01L21/027 ,  H01L21/308 ,  B29K33/00 ,  C08F220/58 ,  C08F220/32 ,  H01L21/311

CPC classification number: C09D11/101 ,  B05D5/00 ,  B29C59/005 ,  B29C59/16 ,  B29K2033/12 ,  C08F2/48 ,  C08F220/18 ,  C08F220/58 ,  C08F236/20 ,  C08F2220/325 ,  G03F7/0002 ,  G03F7/0046 ,  G03F7/027 ,  H01L21/0274 ,  H01L21/3086 ,  H01L21/31138 ,  H01L21/31144 ,  Y10T428/24802 ,  C08F2220/185 ,  C08F2222/1013 ,  C08F2220/1858

Abstract: To provide a photo-curable composition for imprints which can ensure high ratio of mold filling and low defect density during mold releasing, and can provide a resist material with high etching durability. A photo-curable composition for imprints comprising a monofunctional monomer, a polyfunctional monomer and a photo-polymerization initiator, having a viscosity at 25° C. of 15 mPa·s or smaller, an Ohnishi parameter of 3.0 or smaller, and a crosslink density calculated by (Formula 1) of 0.6 mmol/cm3 or larger; Crosslink density={Σ(Ratio of mixing of polyfunctional monomer (parts by mass)*Number of functional groups of polyfunctional monomer/Molecular weight of polyfunctional monomer)}/Specific gravity.

Abstract translation: 为了提供可以确保模具填充的高比例和脱模时的低缺陷密度的用于印痕的光固化性组合物，并且可以提供具有高蚀刻耐久性的抗蚀剂材料。 在25℃下的粘度为15mPa·s以下，Ohnishi参数为3.0以下的单官能单体，多官能单体和光聚合引发剂的印模用光固化性组合物和交联密度 由（式1）计算为0.6mmol / cm 3以上; 交联密度= {＆Sgr（多官能单体的混合比例（质量份）*多官能单体的官能团数/多官能单体的分子量）} /比重。

公开(公告)号：US10379264B2

公开(公告)日：2019-08-13

申请号：US16049840

申请日：2018-07-31

Applicant: FUJIFILM CORPORATION

Inventor： Toshiyuki Makuta ,  Yanlong Che ,  Masafumi Yoshida

IPC: G02B3/06 ,  B41M5/50 ,  B41M3/00 ,  B41J2/01 ,  B41M3/06 ,  B41M5/00 ,  B41M5/52 ,  B41M7/00 ,  G02B3/00 ,  G03B35/00 ,  B32B27/08 ,  B32B27/36 ,  C09D11/107 ,  C09D11/322 ,  G02B27/22 ,  B42D25/342

Abstract: A method of producing a lenticular printed material includes: an ink jetting step of jetting an aqueous ink, containing a colorant, resin particles, water and a water-soluble high boiling point solvent, onto an ink receiving layer of a lenticular sheet including a resin layer, a lens layer disposed at one surface side of the resin layer, and the ink receiving layer, which is disposed at the other surface side of the resin layer, which contains particles and a resin, and which has a porous structure and a void volume of 50% or greater, according to an ink jetting method; and a drying step of drying the aqueous ink, under conditions in which a surface temperature of the ink receiving layer is set to 30° C. or higher, to form a parallax picture.

公开(公告)号：US09073102B2

公开(公告)日：2015-07-07

申请号：US13932126

申请日：2013-07-01

Applicant: FUJIFILM Corporation

Inventor： Masafumi Yoshida

IPC: B08B3/12 ,  B29C33/62 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/00 ,  C11D11/00 ,  G03F7/30

CPC classification number: B08B3/12 ,  B29C33/62 ,  B82Y10/00 ,  B82Y40/00 ,  C11D11/0047 ,  G03F7/0002 ,  G03F7/3014

Abstract: A method for cleansing a mold of the present invention suppresses generation of damage is a method for cleansing a nanoimprinting mold, in which a mesa type mold is immersed in cleansing fluid and ultrasonic cleansing is performed in a state in which a mold release layer containing a fluorine compound is provided on a patterned region of the mesa type mold.

Abstract translation: 本发明的清洁模具的方法抑制损伤的产生是一种清洁纳米压印模具的方法，其中将台面型模具浸入清洁液中并在超声波清洗中进行超声波清洗，其中含有 氟化合物设置在台面型模具的图案化区域上。

公开(公告)号：US09716025B2

公开(公告)日：2017-07-25

申请号：US14865961

申请日：2015-09-25

Applicant: FUJIFILM Corporation

Inventor： Ichiro Koyama ,  Yu Iwai ,  Masafumi Yoshida

IPC: H01L21/30 ,  H01L21/683 ,  C09J7/02

CPC classification number: H01L21/6835 ,  C09J7/40 ,  C09J2201/622 ,  C09J2203/326 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes (A) a release layer and (B) an adhesive layer, wherein the release layer (A) comprises (a1) a first release layer having a softening point of 200° C. or more and adjoining the adhesive layer (B), and (a2) a second release layer adjoining the first release layer (a1); the second release layer (a2) contains a resin; and the resin after curing has a capable of being dissolved at 5% by mass or more, at 25° C., in at least one kind of solvents selected from hexane and the like.

公开(公告)号：US09601706B2

公开(公告)日：2017-03-21

申请号：US14689216

申请日：2015-04-17

Applicant: FUJIFILM Corporation

Inventor： Yu Iwai ,  Atsushi Nakamura ,  Yoshitaka Kamochi ,  Masafumi Yoshida

IPC: G03F7/11 ,  H01L51/00 ,  H01L21/02 ,  G03F7/027 ,  G03F7/038 ,  G03F7/039 ,  G03F7/32 ,  C09D101/00 ,  C09D105/00 ,  G03F7/20 ,  H01L51/10 ,  H01L51/44 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L51/0093 ,  C09D101/00 ,  C09D105/00 ,  G03F7/027 ,  G03F7/0388 ,  G03F7/0392 ,  G03F7/11 ,  G03F7/20 ,  G03F7/325 ,  H01L21/02118 ,  H01L21/3065 ,  H01L51/004 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5253 ,  H01L51/56

Abstract: There is provided a resin composition for use in formation of a protective film to protect a substrate or a film formed on the substrate, from a developer containing an organic solvent to be used for development in pattern formation, and which contains two or more kinds of resins in which their main chain structures having a hydroxyl group are different, and contains water, a pattern forming method using the resin composition, and layered products comprising a substrate, an organic semiconductor film on the substrate, and a protective film comprising two or more kinds of resins in which their main chain structures having a hydroxyl group are different, on the organic semiconductor film.