公开(公告)号：US09659131B2

公开(公告)日：2017-05-23

申请号：US14754585

申请日：2015-06-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Anson Jay Call ,  Vijayeshwar Das Khanna ,  Douglas Oliver Powell ,  David John Russell

IPC: H05K1/03 ,  G06F17/50 ,  H01L23/00 ,  H01L23/498 ,  H01L23/14

CPC classification number: G06F17/5072 ,  G06F17/5009 ,  G06F2217/42 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.

公开(公告)号：US09543253B2

公开(公告)日：2017-01-10

申请号：US14598258

申请日：2015-01-16

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Thomas E. Lombardi ,  Donald A. Merte ,  Steven P. Ostrander ,  Thomas Weiss ,  Jiantao Zheng

IPC: B23K1/00 ,  B23K1/20 ,  B23K31/00 ,  B23K31/02 ,  B23K37/04 ,  H01L21/00 ,  H01L23/00 ,  H01L21/66 ,  H01L21/673

CPC classification number: H01L23/562 ,  H01L21/67333 ,  H01L22/12 ,  H01L22/20 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2924/3511 ,  Y02P80/30

Abstract: A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.

Abstract translation: 一种方法，包括提供层压基板，表征层压基板的翘曲特性，基于翘曲特性确定水平面变形，并将层压基板放置在具有调整的固定装置中，以校正水平面失真，调节位于 所述层叠基板的中心，其中所述调节接触所述层叠基板。 该方法可以进一步包括助熔层压基板，将芯片放置在层压基板上，以及将固定装置放置在回流炉中以连接芯片和层叠基板。

公开(公告)号：US20160211161A1

公开(公告)日：2016-07-21

申请号：US15084893

申请日：2016-03-30

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Vijayeshwar D. Khanna ,  Oswald J. Mantilla

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/687 ,  H01L21/67092 ,  H01L24/75 ,  H01L2224/73204 ,  H01L2224/75703 ,  Y10T29/49826 ,  Y10T29/49998

Abstract: A clamping apparatus applies a force to a workpiece during processing. The clamping apparatus includes a base defining a work area configured to receive a joined structure having multiple elements. The base defines a recess in the work area. An adjustable mechanism is configured to releasably couple to the base and apply a adjustable downward force to the joined structure to bend the joined structure downwardly into the recess during a process. A resilient plunger is part of the adjustable mechanism. The resilient plunger extends downwardly from a top plate of the adjustable mechanism, and the resilient plunger is configured to contact a top of a first element of the joined structure to apply the downward force.

Abstract translation: 夹紧装置在加工过程中对工件施加力。 夹紧装置包括限定被配置为接收具有多个元件的接合结构的工作区域的基座。 基座在工作区域中定义了一个凹槽。 可调机构构造成可释放地联接到基座并且向接合的结构施加可调节的向下的力，以在接合的结构中将接合的结构向下弯曲到凹部中。 弹性柱塞是可调机构的一部分。 弹性柱塞从可调节机构的顶板向下延伸，并且弹性柱塞构造成接触连接结构的第一元件的顶部以施加向下的力。

公开(公告)号：US09293439B2

公开(公告)日：2016-03-22

申请号：US14567052

申请日：2014-12-11

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Elaine Cyr ,  Benjamin Vito Fasano ,  Paul Francis Fortier ,  Marcus E. Interrante ,  Roger Lam ,  Shidong Li ,  Thomas Edward Lombardi ,  Hilton T. Toy ,  Thomas Weiss

IPC: H01L23/00 ,  H01L21/50 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/055 ,  H01L23/42 ,  H01L23/498

CPC classification number: H01L24/83 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83862 ,  H01L2924/15311

Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.

公开(公告)号：US09305894B2

公开(公告)日：2016-04-05

申请号：US13910152

申请日：2013-06-05

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Vijayeshwar D. Khanna ,  Oswald J. Mantilla

IPC: H01L23/00

CPC classification number: H01L21/687 ,  H01L21/67092 ,  H01L24/75 ,  H01L2224/73204 ,  H01L2224/75703 ,  Y10T29/49826 ,  Y10T29/49998

Abstract: A clamping apparatus applies a force to a workpiece during processing. The clamping apparatus includes a base defining a work area configured to receive a joined structure having multiple elements. The base defines a recess in the work area. An adjustable mechanism is configured to releasably couple to the base and apply a adjustable downward force to the joined structure to bend the joined structure downwardly into the recess during a process. A resilient plunger is part of the adjustable mechanism. The resilient plunger extends downwardly from a top plate of the adjustable mechanism, and the resilient plunger is configured to contact a top of a first element of the joined structure to apply the downward force.

Abstract translation: 夹紧装置在加工过程中对工件施加力。 夹紧装置包括限定被配置为接收具有多个元件的接合结构的工作区域的基座。 基座在工作区域中定义了一个凹槽。 可调机构构造成可释放地联接到基座并且向接合的结构施加可调节的向下的力，以在接合的结构中将接合的结构向下弯曲到凹部中。 弹性柱塞是可调机构的一部分。 弹性柱塞从可调节机构的顶板向下延伸，并且弹性柱塞构造成接触连接结构的第一元件的顶部以施加向下的力。