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公开(公告)号：US11541659B2
公开(公告)日：2023-01-03
申请号：US16991524
申请日：2020-08-12
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Silam J Choy , Michael W Cumbie , Devin Alexander Mourey , Chien-Hua Chen
Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
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公开(公告)号：US09925789B2
公开(公告)日：2018-03-27
申请号：US15326081
申请日：2014-07-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Silam J Choy , David Olsen , Kevin E Swier
CPC classification number: B41J2/17596 , B41J2/175 , B41J2/17563 , B41J2/18 , F16K31/44
Abstract: A regulator component includes a pressure regulator, a liquid filter, a vent with air filter downstream of the liquid filter, a second vent with air filter upstream of the liquid filter, and an outlet.
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公开(公告)号：US20170368835A1
公开(公告)日：2017-12-28
申请号：US15542024
申请日：2015-01-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： David R Otis , Silam J Choy , Kevin E Swier , Zhuqing Zhang
CPC classification number: B41J2/19 , B41J2/175 , B41J2002/14483
Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.
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公开(公告)号：US20150208507A1
公开(公告)日：2015-07-23
申请号：US14417821
申请日：2012-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Robert G Walmsley , Zhqing Zhang , Jenninfer Wu , Sheldon A Bernard , Silam J Choy
CPC classification number: H05K1/18 , B81B7/0048 , B81B2201/0235 , G01P15/0802 , H01L24/32 , H01L2224/32014 , H05K13/0469 , H05K2203/06 , Y10T156/10
Abstract: A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.
Abstract translation: 一种包括半导体，衬底和中介层的器件。 插入器附接在半导体和衬底之间以吸收半导体和衬底之间的应力。
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Patent Agency Ranking
公开(公告)号：US11931738B2
公开(公告)日：2024-03-19
申请号：US17045873
申请日：2018-11-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： John Lahmann , Pavel Kornilovich , Silam J Choy
IPC: B01L3/00
CPC classification number: B01L3/50273 , B01L3/502715 , B01L2200/027 , B01L2300/0645 , B01L2400/0406 , B01L2400/0442
Abstract: An example method includes providing fluid to a chamber. The chamber feeds a first channel terminating at a first droplet ejector and a second channel terminating at a second droplet ejector. The method further includes sequencing ejection of droplets at the first droplet ejector and the second droplet ejector to induce negative pressure to provide a sequenced output flow of the fluid through the first channel to a first target microfluidic network and through the second channel to a second target microfluidic network, and controlling the first and second target microfluidic networks to perform an analytical process with the fluid.
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公开(公告)号：US10603922B2
公开(公告)日：2020-03-31
申请号：US15542024
申请日：2015-01-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： David R Otis , Silam J Choy , Kevin E Swier , Zhuqing Zhang
Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.
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公开(公告)号：US10195852B2
公开(公告)日：2019-02-05
申请号：US15507043
申请日：2014-08-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Silam J Choy , Devin Mourey , Eric L Nikkel
Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.
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公开(公告)号：US09908327B2
公开(公告)日：2018-03-06
申请号：US15303998
申请日：2014-04-23
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Silam J Choy , Peter James Fricke
CPC classification number: B41J2/04541 , B41J2/04581 , B41J2/1404 , B41J2/14201 , B41J2/1433 , B41J2002/14491 , B41J2202/20
Abstract: In one example, a printhead assembly includes multiple printheads arranged along a line in a staggered configuration in which each printhead in a group of far printheads overlaps a printhead in a group of near printheads. Each printhead includes a pedestal, a printhead die mounted to the pedestal, an IC to drive fluid ejector elements in the printhead die, and a flex circuit. The IC is connected to the printhead die and mounted to the pedestal next to the die. The body of a flex circuit is connected to and covers the IC. The tail of each flex circuit from a far printhead extends past a pedestal in a near printhead.
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公开(公告)号：US20170266973A1
公开(公告)日：2017-09-21
申请号：US15507043
申请日：2014-08-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Silam J Choy , Devin Mourey , Eric L Nikkel
CPC classification number: B41J2/1637 , B41J2/14024 , B41J2/14072 , B41J2/1408 , B41J2/155 , B41J2/1603
Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.
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