公开(公告)号：US08897027B2

公开(公告)日：2014-11-25

申请号：US13117614

申请日：2011-05-27

申请人： Han-Chung Chen ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

发明人： Han-Chung Chen ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/02 ,  H05K1/11 ,  H01L33/62 ,  H05K3/34 ,  H01L23/00

CPC分类号： H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

摘要： A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

摘要翻译： 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US20110292625A1

公开(公告)日：2011-12-01

申请号：US13117614

申请日：2011-05-27

申请人： HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

发明人： HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC分类号： H05K7/06

CPC分类号： H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

摘要： A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

摘要翻译： 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US07667141B2

公开(公告)日：2010-02-23

申请号：US12180087

申请日：2008-07-25

申请人： Ying-Fang Xu ,  Ning-Hua Li ,  Chin-Mei Huang ,  Tsui-Chuan Wang

发明人： Ying-Fang Xu ,  Ning-Hua Li ,  Chin-Mei Huang ,  Tsui-Chuan Wang

IPC分类号： H05K1/00

CPC分类号： H05K1/0268 ,  H05K1/0393 ,  H05K3/0005 ,  H05K3/242 ,  H05K2203/175 ,  Y10T29/49155 ,  Y10T29/49156

摘要： The present invention discloses a flexible printed circuit (FPC) layout and a method thereof. The flexible printed circuit (FPC) layout method comprises steps of: providing a circuit board body; disposing at least an electroplating point on the circuit board body; disposing a plurality of solder pads on the circuit board body, the plurality of solder pads comprising at least a first solder pad and at least a second solder pad being connected respectively to the electroplating point through an internal wire, the first solder pad being further connected to an electroplating zone on the circuit board body through an external wire; performing an electroplating process from the electroplating zone through the external wire so that the external wire, the first solder pad connected to the external wire, the electroplating point connected through the internal wire to the first solder pad, and the second solder pad connected through the internal wire to the electroplating point are electroplated and electrically connected; and providing at least a via hole at the electroplating point on the circuit board body to form an open circuit between the first solder pad and the second solder pad. By using the disclosed method, the flexible printed circuit layout of the present invention can be formed.

摘要翻译： 本发明公开了一种柔性印刷电路（FPC）布局及其方法。 柔性印刷电路（FPC）布局方法包括以下步骤：提供电路板主体; 在电路板主体上设置至少一个电镀点; 在电路板主体上设置多个焊盘，所述多个焊盘至少包括第一焊盘和至少第二焊盘，其通过内部导线分别连接到电镀点，所述第一焊盘还被连接 通过外部电线连接到电路板主体上的电镀区; 通过外部电线从电镀区域进行电镀处理，使得外部电线，连接到外部电线的第一焊盘，通过内部电线连接到第一焊盘的电镀点，以及通过 电镀点的内部电线电镀并电连接; 以及在所述电路板主体上的所述电镀点处至少设置通孔，以在所述第一焊盘和所述第二焊盘之间形成开路。 通过使用所公开的方法，可以形成本发明的柔性印刷电路布局。

公开(公告)号：US20070015378A1

公开(公告)日：2007-01-18

申请号：US11358057

申请日：2006-02-22

申请人： Chin-Mei Huang

发明人： Chin-Mei Huang

IPC分类号： H05K1/00

CPC分类号： H05K1/118 ,  H05K3/28 ,  H05K3/4015 ,  H05K2201/09281 ,  H05K2201/0979

摘要： A flexible printed circuit board includes a flexible substrate, which has a bonding zone, a folding zone, and a folding line between the bonding zone and the folding zone, two electrically conductive contacts respectively located at the bonding zone, two lead wires each having an extension portion respectively electrically connected to the electrically conductive contacts and arranged in parallel to the folding line and a connecting portion extending integrally from the extension portion toward the folding zone, and a protective layer covered on the flexible substrate over the lead wires. The protective layer has openings corresponding to the electrically conductive contacts.

摘要翻译： 柔性印刷电路板包括柔性基板，其具有接合区域，折叠区域和接合区域和折叠区域之间的折叠线，分别位于接合区域处的两个导电触点，每个具有一个 延伸部分分别电连接到导电触头并且平行于折叠线布置，并且从延伸部分朝向折叠区域整体延伸的连接部分以及覆盖在引线上的柔性基板上的保护层。 保护层具有对应于导电触点的开口。

公开(公告)号：US20080026914A1

公开(公告)日：2008-01-31

申请号：US11494518

申请日：2006-07-28

申请人： Shih-Yuan Chen ,  Chin-Mei Huang

发明人： Shih-Yuan Chen ,  Chin-Mei Huang

IPC分类号： A63B15/02 ,  A63B24/00 ,  A63B71/00

CPC分类号： A63B71/0622 ,  A63B22/02 ,  A63B2071/0658 ,  A63B2225/50

摘要： The present invention provides a composite structure for display device, which includes a display device able to display exercise information and audiovisual entertainment, and the display unit is connected to an exercise equipment by means of a connecting port. Moreover, the display device comprises a control unit, a processor unit and an application interface. The control unit is responsible for adjustment of brightness, contrast, and vertical and horizontal positioning, and the processor unit is responsible for exercise information and adjustment control of audiovisual entertainment. Furthermore, the application interface is connected to the processor unit by means of the connecting port. Hence, the display device including the control unit, the processor unit and the application interface enables an exerciser to achieve the objective of working out to keep fit and enjoying entertainment when exercising on the exercise equipment.

摘要翻译： 本发明提供了一种显示装置的复合结构，其包括能够显示运动信息和视听娱乐的显示装置，并且显示单元通过连接端口连接到运动器材。 此外，显示装置包括控制单元，处理器单元和应用接口。 控制单元负责亮度，对比度和垂直和水平定位的调整，处理器单元负责视听娱乐的运动信息和调整控制。 此外，应用接口通过连接端口连接到处理器单元。 因此，包括控制单元，处理器单元和应用接口的显示设备使练习者能够实现在运动锻炼设备上锻炼时保持适合和娱乐的目的。

公开(公告)号：US07333344B2

公开(公告)日：2008-02-19

申请号：US11358057

申请日：2006-02-22

申请人： Chin-Mei Huang

发明人： Chin-Mei Huang

IPC分类号： H05K1/00

CPC分类号： H05K1/118 ,  H05K3/28 ,  H05K3/4015 ,  H05K2201/09281 ,  H05K2201/0979

摘要： A flexible printed circuit board includes a flexible substrate, which has a bonding zone, a folding zone, and a folding line between the bonding zone and the folding zone, two electrically conductive contacts respectively located at the bonding zone, two lead wires each having an extension portion respectively electrically connected to the electrically conductive contacts and arranged in parallel to the folding line and a connecting portion extending integrally from the extension portion toward the folding zone, and a protective layer covered on the flexible substrate over the lead wires. The protective layer has openings corresponding to the electrically conductive contacts.

摘要翻译： 柔性印刷电路板包括柔性基板，其具有接合区域，折叠区域和接合区域和折叠区域之间的折叠线，分别位于接合区域处的两个导电触点，每个具有一个 延伸部分分别电连接到导电触头并且平行于折叠线布置，并且从延伸部分朝向折叠区域整体延伸的连接部分以及覆盖在引线上的柔性基板上的保护层。 保护层具有对应于导电触点的开口。