-
公开(公告)号：US5434490A
公开(公告)日：1995-07-18
申请号：US98956
申请日：1993-07-29
申请人： Hideo Ishida , Takashi Tanaka , Haruhiro Watanabe
发明人： Hideo Ishida , Takashi Tanaka , Haruhiro Watanabe
CPC分类号： G05D1/0022 , B61L23/005 , B62D1/28 , G05D1/0244 , G05D1/0263 , G05D1/0282 , G05D1/0274 , G05D2201/0216
摘要： An article transport system includes a plurality of article loading and unloading stations, at least one carriage for running between the stations to transport articles therebetween, and a base station installed on the ground to provide the carriage with running instructions at an article transport request received from one of the stations. Each of the base station, loading and unloading stations and carriage includes a radio communication unit. Article transport requests and running instructions are transmitted by radio communication.
摘要翻译： 物品输送系统包括多个物品装卸站，至少一个用于在车站之间运行的运输工具之间运送物品的托架以及安装在地面上的基站，以便在运送指令的基础上提供运送指令， 其中一个站。 基站，装卸台和托架均包括无线电通信单元。 通过无线电通信传送文章传输请求和运行指令。
-
公开(公告)号：US09421569B2
公开(公告)日：2016-08-23
申请号：US13981124
申请日：2012-01-13
IPC分类号： B05C5/00 , B05C9/14 , H01L21/3205 , B05B7/16 , C23C18/16 , H01L21/288 , B05D1/02 , C25D17/00 , H01L21/67 , G03F7/16
CPC分类号： B05C5/001 , B05D1/02 , C23C18/1614 , C23C18/1619 , C23C18/1676 , C23C18/168 , C25D17/001 , G03F7/162 , H01L21/288 , H01L21/67017
摘要： A plating apparatus includes a substrate holding/rotating device that holds/rotates a substrate; and a plating liquid supplying device that supplies a plating liquid onto the substrate. The plating liquid supplying device includes a supply tank that stores the plating liquid; a discharge nozzle that discharges the plating liquid onto the substrate; and a plating liquid supplying line through which the plating liquid of the supply tank is supplied into the discharge nozzle. Further, a first heating device is provided at either one of the supply tank and the plating liquid supplying line of the plating liquid supplying device, and heats the plating liquid to a first temperature. Furthermore, a second heating device is provided at the plating liquid supplying line between the first heating device and the discharge nozzle, and heats the plating liquid to a second temperature equal to or higher than the first temperature.
摘要翻译： 电镀装置包括：保持/旋转基板的基板保持/旋转装置; 以及将电镀液体供给到基板上的电镀液供给装置。 电镀液供给装置包括：储存电镀液的供给槽; 排出喷嘴，其将所述电镀液体排出到所述基板上; 以及电镀液体供给管路，供给槽的镀液通过该供给线供给到排出喷嘴。 此外，第一加热装置设置在电镀液供给装置的供给罐和电镀液供给管线中的任一个处，并将电镀液加热至第一温度。 此外，在第一加热装置和排出喷嘴之间的电镀液供给管线处设置第二加热装置，并将镀液加热到等于或高于第一温度的第二温度。
-
公开(公告)号：US09236212B2
公开(公告)日：2016-01-12
申请号：US13471733
申请日：2012-05-15
申请人： Takashi Tanaka , Motohisa Sakai , Yasuhiko Nakano , Kan Suganomata , Motoaki Esaki , Kayo Nakano
发明人： Takashi Tanaka , Motohisa Sakai , Yasuhiko Nakano , Kan Suganomata , Motoaki Esaki , Kayo Nakano
IPC分类号： C22F1/18 , H01J1/146 , B21C1/00 , B21C37/04 , B22F5/12 , C22C1/04 , C22C27/04 , H01J1/14 , H01J1/22 , H01J9/04 , H01J9/08 , H01K1/02 , H01K3/02 , B21B1/18 , B21B15/00 , B21B3/00
CPC分类号： H01J1/146 , B21B1/18 , B21B15/0035 , B21B2003/006 , B21B2015/0028 , B21C1/003 , B21C37/045 , B22F5/12 , B22F2998/10 , C22C1/045 , C22C27/04 , H01J1/14 , H01J1/22 , H01J9/04 , H01J9/08 , H01J2201/2889 , H01K1/02 , H01K3/02 , B22F3/10 , B22F3/18 , B22F3/17 , B22F3/20
摘要： One embodiment provides a tungsten wire containing 1 to 10% by mass of rhenium, the wire having a point indicating a 2% elongation within a quadrangle formed by joining points with straight lines, where the values of x and y are point (20, 75), point (20, 87), point (90, 75), and point (90, 58), in this order; wherein the wire diameter of the tungsten wire is represented by x μm, and the elongation of the tungsten wire is 2% after electrically heating with an electrical current which is a ratio of y % to the fusion current (FC) at the wire diameter x μm, and wherein a semi-logarithmic system of coordinates is expressed by a horizontal axis using a logarithmic scale of the wire diameter x and a vertical axis using a normal scale of ratio y to the fusion current.
摘要翻译： 一个实施方案提供了含有1〜10质量％的铼的钨丝，该丝具有通过连接点与直线形成的四边形内的2％伸长率的点，其中x和y的值为点（20,75 ），点（20,87），点（90,75）和点（90,58）; 其中钨丝的线直径由x m表示，并且在电加热后，钨线的伸长率为2％，电流是电线直径x上的y％与熔化电流（FC）的比值 并且其中使用线径x的对数刻度和使用与融合电流的比率y的正常刻度的垂直轴由水平轴表示坐标的半对数坐标系。
-
公开(公告)号：US08866183B2
公开(公告)日：2014-10-21
申请号：US13822454
申请日：2011-09-26
CPC分类号： H01L33/64 , H01L24/48 , H01L25/167 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/15156 , H01L2924/181 , H01L2224/48091 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.
摘要翻译： LED模块包括：具有设置在相对侧壁的外表面上的电极的封装和连接到电极并安装在封装上的发光元件; 具有铜金属的基底构件; 绝缘层，堆叠在所述基底构件的表面上并具有绝缘材料; 以及通过焊接连接到电极并形成在绝缘层的表面上的导电布线图案。 所述绝缘层具有通过去除所述封装所位于的部分的一部分而形成的通孔，以及通过在所述封装的背面与所述基部构件之间焊接而形成的通孔， 孔之间。
-
5.发明申请公开(公告)号：US20140302242A1
公开(公告)日：2014-10-09
申请号：US13881431
申请日：2011-08-24
CPC分类号： B05D7/50 , B05B12/04 , B05B12/14 , B05D1/02 , C23C18/1632 , C23C18/1651 , C23C18/31 , C23C18/54 , C25D17/001
摘要： A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.
摘要翻译： 电镀装置1可以通过将电镀液供给到基板2的表面来进行电镀处理。电镀装置1包括：基板旋转保持器，其构造成保持和旋转基板2; 电镀液供给单元29,30，被配置为向基板2的表面供给不同种类的电镀液; 电镀液排出单元31，其被配置为根据电镀液的种类排出从基板2分散的镀液; 以及控制器32，被配置为控制基板旋转保持器25，电镀液供给单元29和30，电镀液排出单元31.在保持基板2并旋转的同时，在基板2的表面上进行电镀处理 依次通过将不同种类的电镀液体供给到基板2的表面上。
-
6.发明授权公开(公告)号：US08770138B2
公开(公告)日：2014-07-08
申请号：US13180702
申请日：2011-07-12
CPC分类号： H01L21/288 , C23C18/1628 , H01L21/76849
摘要： A plated film having a uniform film thickness is formed on a surface of a substrate. A semiconductor manufacturing apparatus includes: a holding mechanism for holding a substrate rotatably; a nozzle for supplying a processing solution for performing a plating process on a processing target surface of the substrate; a substrate rotating mechanism for rotating the substrate held by the holding mechanism in a direction along the processing target surface; a nozzle driving mechanism for moving the nozzle in a direction along the processing target surface at a position facing the processing target surface of the substrate held by the holding mechanism; and a control unit for controlling the supply of the processing solution by the nozzle and the movement of the nozzle by the nozzle driving mechanism.
摘要翻译： 在基板的表面上形成具有均匀膜厚的镀膜。 半导体制造装置包括：可旋转地保持基板的保持机构; 用于向所述基板的处理目标表面供给用于进行电镀处理的处理液的喷嘴; 基板旋转机构，用于沿着所述处理对象表面的方向旋转由所述保持机构保持的所述基板; 喷嘴驱动机构，用于沿着与所述保持机构保持的所述基板的处理对象面对置的位置沿着所述处理对象面的方向移动所述喷嘴; 以及控制单元，用于控制由喷嘴供应处理溶液和通过喷嘴驱动机构移动喷嘴。
-
公开(公告)号：US20140148006A1
公开(公告)日：2014-05-29
申请号：US13879175
申请日：2011-08-31
申请人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita
发明人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita
IPC分类号： H01L21/67 , H01L21/288
CPC分类号： H01L21/6723 , C23C18/1619 , C23C18/1653 , C23C18/1675 , C23C18/1676 , C23C18/168 , C23C18/50 , H01L21/288
摘要： A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply hole through which the temperature-controlled plating liquid in the temperature controlling container is discharged to a processing surface of the substrate; a pushing unit for pushing the temperature-controlled plating liquid in the temperature controlling container toward the supply hole of the nozzle; and a supply control unit for controlling a timing when the plating liquid is pushed by the pushing unit. The temperature controller controls the temperature of the plating liquid in the temperature controlling container based on the timing when the plating liquid is pushed by the pushing unit.
摘要翻译： 在多个基板上连续进行电镀处理的液体处理装置包括：容纳电镀液的温度控制容器; 温度控制器，用于控制温度控制容器中的电镀液的温度; 保持单元，用于将预定位置一个接一个地保持; 具有供给孔的喷嘴，所述温度控制容器中的所述温度控制电镀液通过所述供给孔排出到所述基板的处理面; 推压单元，用于将温度控制容器中的温度控制电镀液朝向喷嘴的供给孔推动; 以及供应控制单元，用于控制当推动单元推动电镀液体时的定时。 温度控制器基于由推动单元推动电镀液的时机，控制温度控制容器中的电镀液的温度。
-
公开(公告)号：US08600213B2
公开(公告)日：2013-12-03
申请号：US13281975
申请日：2011-10-26
IPC分类号： H04N5/775
CPC分类号： G06T5/10 , G06T5/001 , G06T2207/10016 , G06T2207/20052 , G06T2207/30076
摘要： What is disclosed is a system and method for reconstructing a video signal such that selected signal components have been emphasized. Methods are disclosed for reducing the source video data to its independent signal components for selection. The source video is reconstructed, in a manner more fully disclosed herein, such that the selected component(s) are emphasized in the reconstructed video during video playback. The methods disclosed herein provide a solution for filtering an original video such that technicians can use the reconstructed video to visually examine, for instance, a dominant region of a patient's vital signals. The teachings hereof find their uses in a wide array of remote sensing applications and, in particular, the telemedicine arts.
摘要翻译： 公开的是用于重建视频信号的系统和方法，使得已经强调所选择的信号分量。 公开了用于将源视频数据减少到其独立信号分量用于选择的方法。 以更全面地公开的方式重建源视频，使得在视频重放期间在重建的视频中强调所选择的组件。 本文公开的方法提供了用于过滤原始视频的解决方案，使得技术人员可以使用重建的视频来目视检查患者生命信号的主要区域。 这些教导在各种遥感应用，特别是远程医疗艺术中发现其用途。
-
公开(公告)号：US08404354B2
公开(公告)日：2013-03-26
申请号：US12309650
申请日：2007-07-23
申请人： Yoshiyuki Yukawa , Takashi Tanaka
发明人： Yoshiyuki Yukawa , Takashi Tanaka
CPC分类号： C09D133/066 , C08L33/066 , C08L33/14 , C09D5/024 , C09D161/28 , Y10T428/31935 , Y10T428/31938 , C08L2666/04
摘要： The invention discloses water-based paint compositions which comprise a copolymer of polymerizable unsaturated monomer having polyoxyalkylene chain; hydroxyl-containing polymerizable unsaturated monomer having no polyoxyalkylene chain; polymerizable unsaturated monomer having at least one cationic functional group selected from the group consisting of tertiary amino groups and quaternary ammonium salt groups; at least one monomer selected from the group consisting of bridged alicyclic hydrocarbon group-containing polymerizable unsaturated monomers and C6-18 alkyl group-containing polymerizable unsaturated monomers; and other polymerizable unsaturated monomer: a hydroxyl-containing resin: and a melamine resin having a weight-average molecular weight within the range of 1,000-5,000. The invention also discloses film-forming methods using the compositions.
摘要翻译： 本发明公开了一种水性涂料组合物，其包含具有聚氧化烯链的可聚合不饱和单体的共聚物; 不含聚氧化烯链的含羟基的可聚合不饱和单体; 具有选自叔氨基和季铵盐基团中的至少一个阳离子官能团的可聚合不饱和单体; 至少一种选自含有桥连的含脂环烃基的可聚合不饱和单体和含C6-18烷基的可聚合不饱和单体的单体; 和其它可聚合不饱和单体：含羟基树脂和重均分子量在1,000-5,000范围内的三聚氰胺树脂。 本发明还公开了使用该组合物的成膜方法。
-
10.发明授权Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux 有权用于去除无铅焊剂的清洁剂组合物，以及去除无铅焊剂的方法公开(公告)号：US08372792B2
公开(公告)日：2013-02-12
申请号：US12668798
申请日：2008-08-08
申请人： Takashi Tanaka , Kazutaka Zenfuku
发明人： Takashi Tanaka , Kazutaka Zenfuku
IPC分类号： C11D7/50
CPC分类号： C11D7/265 , C11D7/263 , C11D7/3227 , C11D7/5022 , C11D11/0041 , H05K3/26
摘要： The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water.
摘要翻译： 本发明的目的是提供一种新颖的清洁剂组合物，其不仅可以通过火焰降低点火并且对环境的影响较小，而且还具有优异的性质，即溶解粘附在窄部分上的焊剂残余物或者在 用无铅焊料进行焊接的待清洁物体，并且可以减少水洗过程中物体的再污染。 本发明使用由特定的式表示的无卤素的有机溶剂（A） 由特定的式表示的胺系化合物（B） 不含氨基的螯合剂（C）; 并根据需要提供水。
-
-
-
-
-
-
-
-
-
搜索结果
257 条记录 (耗时 0.038 秒)
