公开(公告)号：US11772095B2

公开(公告)日：2023-10-03

申请号：US16771025

申请日：2018-12-20

Applicant: IMEC VZW

Inventor： Chengxun Liu ,  Bivragh Majeed ,  Abdulkadir Yurt

IPC: B01L3/00 ,  G01N15/14 ,  G01N15/00

CPC classification number: B01L3/502761 ,  B01L3/502707 ,  B01L3/502715 ,  G01N15/1434 ,  B01L2200/0652 ,  B01L2200/12 ,  B01L2300/0654 ,  B01L2300/0887 ,  G01N15/1484 ,  G01N2015/0065 ,  G01N2015/149

Abstract: A microfluidic routing device for routing objects of interest in a microfluidic flow includes a substrate; a first layer provided on the substrate, in which the first layer forms a bottom wall of a microfluidic channel. At least two holes through the first layer form respectively an inlet and an outlet for the microfluidic channel The microfluidic routing device further includes a second layer spaced away from the first layer, in which the second layer forms a top wall of the microfluidic channel. The second layer is configured to transmit an optical signal from the microfluidic channel. The microfluidic routing device includes an actuator for actuating the objects of interest in a sorting junction of the microfluidic channel.

公开(公告)号：US10124338B2

公开(公告)日：2018-11-13

申请号：US15526922

申请日：2015-11-19

Applicant: IMEC VZW

Inventor： Chengxun Liu ,  Peter Peumans ,  Liesbet Lagae ,  Bivragh Majeed

IPC: B07C5/00 ,  B01L3/00 ,  G01N15/10 ,  G01N15/14

Abstract: The present disclosure relates to microbubble generator devices for deflecting objects in a liquid, systems for sorting objects that utilize such devices, and methods for fabricating such devices. At least one embodiment relates to a micro-fluidic device for deflecting objects in a liquid. The device includes a substrate for providing an object-containing liquid thereon. The device also includes a microbubble generator that includes at least one microbubble generating element. The microbubble generator is located on a surface of the substrate and in direct contact with the object-containing liquid when the object-containing liquid is provided on the substrate. The at least one microbubble generating element is configured to deflect a single object in the object-containing liquid through generation of a plurality of microbubbles.

公开(公告)号：US20170341078A1

公开(公告)日：2017-11-30

申请号：US15526922

申请日：2015-11-19

Applicant: IMEC VZW

Inventor： Chengxun Liu ,  Peter Peumans ,  Liesbet Lagae ,  Bivragh Majeed

IPC: B01L3/00 ,  G01N15/10 ,  G01N15/14

CPC classification number: B01L3/502761 ,  B01L2200/0652 ,  B01L2300/0645 ,  B01L2300/0864 ,  B01L2300/1827 ,  B01L2400/0442 ,  B01L2400/046 ,  B01L2400/06 ,  G01N2015/1006 ,  G01N2015/149

Abstract: The present disclosure relates to microbubble generator devices for deflecting objects in a liquid, systems for sorting objects that utilize such devices, and methods for fabricating such devices. At least one embodiment relates to a micro-fluidic device for deflecting objects in a liquid. The device includes a substrate for providing an object-containing liquid thereon. The device also includes a microbubble generator that includes at least one microbubble generating element. The microbubble generator is located on a surface of the substrate and in direct contact with the object-containing liquid when the object-containing liquid is provided on the substrate. The at least one microbubble generating element is configured to deflect a single object in the object-containing liquid through generation of a plurality of microbubbles.

公开(公告)号：US20210162414A1

公开(公告)日：2021-06-03

申请号：US16771025

申请日：2018-12-20

Applicant: IMEC VZW

Inventor： Chengxun Liu ,  Bivragh Majeed ,  Abdulkadir Yurt

IPC: B01L3/00 ,  G01N15/14

Abstract: A microfluidic routing device for routing objects of interest in a microfluidic flow includes a substrate; a first layer provided on the substrate, in which the first layer forms a bottom wall of a microfluidic channel. At least two holes through the first layer form respectively an inlet and an outlet for the microfluidic channel The microfluidic routing device further includes a second layer spaced away from the first layer, in which the second layer forms a top wall of the microfluidic channel. The second layer is configured to transmit an optical signal from the microfluidic channel. The microfluidic routing device includes an actuator for actuating the objects of interest in a sorting junction of the microfluidic channel.

公开(公告)号：US10128123B2

公开(公告)日：2018-11-13

申请号：US15159172

申请日：2016-05-19

Applicant: IMEC VZW

Inventor： Bivragh Majeed ,  Philippe Soussan

IPC: H01L23/52 ,  H01L21/311 ,  H01L23/532 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

Abstract: Micro bump interconnection structures for semiconductor devices, and more specifically, a substrate structure comprising an array of micrometer scale copper pillar based structures or micro bumps eventually comprising a solder material and a method for manufacturing the same are provided.

公开(公告)号：US20160343655A1

公开(公告)日：2016-11-24

申请号：US15159172

申请日：2016-05-19

Applicant: IMEC VZW

Inventor： Bivragh Majeed ,  Philippe Soussan

IPC: H01L23/528 ,  H01L21/311 ,  H01L21/321 ,  H01L23/532 ,  H01L21/768

CPC classification number: H01L21/31122 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03009 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/10145 ,  H01L2224/11009 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11602 ,  H01L2224/119 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/14131 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/2064 ,  H01L2924/01074

Abstract: Micro bump interconnection structures for semiconductor devices, and more specifically, a substrate structure comprising an array of micrometer scale copper pillar based structures or micro bumps eventually comprising a solder material and a method for manufacturing the same are provided

Abstract translation: 提供了用于半导体器件的微凸块互连结构，更具体地说，提供一种包括微米级铜柱基结构阵列或最终包括焊料材料的微凸块及其制造方法的衬底结构