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    Methods and systems for laser processing of coated substrates
    2.
    发明授权
    Methods and systems for laser processing of coated substrates 有权
    涂层基材的激光加工方法和系统

    公开(公告)号：US08969220B2

    公开(公告)日：2015-03-03

    申请号：US13714896

    申请日：2012-12-14

    申请人： IMRA America, Inc.

    发明人： Alan Y. Arai ,  Gyu Cheon Cho ,  Jingzhou Xu

    IPC分类号： H01L21/268 ,  B23K26/00 ,  H01L21/78 ,  H01L33/00

    CPC分类号： H01L21/67092 ,  B23K26/0006 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/16 ,  B23K2103/172 ,  H01L21/2686 ,  H01L21/78 ,  H01L33/0095 ,  Y10S438/94

    摘要： Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

    摘要翻译： 公开了激光加工材料的方法和系统的实例。 用于单片化包括涂覆的基底的晶片的方法和系统可以利用激光输出具有对于晶片衬底是透明的但对涂层不透明的波长的光。 使用技术来管理激光束的注量和聚焦条件，涂层和基底材料可以分别通过消融和内部修饰进行处理。 内部修改可导致管芯分离。

    METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES
    5.
    发明申请
    METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES 审中-公开
    涂层基板激光加工方法与系统

    公开(公告)号：US20150136744A1

    公开(公告)日：2015-05-21

    申请号：US14607991

    申请日：2015-01-28

    申请人： IMRA America, Inc.

    发明人： Alan Y. Arai ,  Gyu Cheon Cho ,  Jingzhou Xu

    IPC分类号： B23K26/40 ,  B23K26/00 ,  H01L21/67

    CPC分类号： H01L21/67092 ,  B23K26/0006 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/16 ,  B23K2103/172 ,  H01L21/2686 ,  H01L21/78 ,  H01L33/0095 ,  Y10S438/94

    摘要： Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

    摘要翻译： 公开了激光加工材料的方法和系统的实例。 用于单片化包括涂覆的基底的晶片的方法和系统可以利用激光输出具有对于晶片衬底是透明的但对涂层不透明的波长的光。 使用技术来管理激光束的注量和聚焦条件，涂层和基底材料可以分别通过消融和内部修饰进行处理。 内部修改可导致管芯分离。

    LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS
    7.
    发明申请
    LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS 审中-公开
    透明材料的激光改性

    公开(公告)号：US20160318122A1

    公开(公告)日：2016-11-03

    申请号：US15208374

    申请日：2016-07-12

    申请人： IMRA America, Inc.

    发明人： Michiharu Ota ,  Alan Y. Arai ,  Zhenlin Liu

    IPC分类号： B23K26/0622 ,  B23K26/06 ,  C03B33/10 ,  B23K26/402 ,  B23K26/364 ,  B23K26/382 ,  B23K26/082

    CPC分类号： B23K26/0624 ,  B23K26/0604 ,  B23K26/082 ,  B23K26/36 ,  B23K26/364 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/102

    摘要： In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.

    摘要翻译： 在某些实施例中，公开了一种用于材料的基于激光的材料处理的方法和系统。 在至少一个优选的实施方案中，使用单独的脉冲激光源（例如纳秒（NS））和超短脉冲（USP）源（NS-USP）产生时间上重叠的脉冲序列。 脉冲作为一系列空间和时间重叠的脉冲对传送到材料。 材料可以但不一定是透明材料。 在透明材料加工的一些应用中，发现脉冲的组合比单独采用的单个脉冲系列可获得的材料变化和高加工质量要大得多。 公开了其它微加工方法和布置用于在基底上或内部形成精细特征。 这种方法和装置通常可以用NS-USP组合或与其他来源一起使用。