公开(公告)号：US11153990B2

公开(公告)日：2021-10-19

申请号：US16231169

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Tim Liu ,  Gerry Juan ,  Jason Y. Jiang

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/08 ,  H05K1/02

Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.

公开(公告)号：US11930620B2

公开(公告)日：2024-03-12

申请号：US16914294

申请日：2020-06-27

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Cora Nien ,  Gavin Sung ,  Tim Liu ,  Lance Lin ,  Wan Yu Liu ,  Gerry Juan ,  Jason Y. Jiang ,  Justin M. Huttula ,  Evan Piotr Kuklinski ,  Juha Tapani Paavola ,  Arnab Sen ,  Hari Shanker Thakur ,  Prakash Kurma Raju

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  G06F1/203 ,  H01L23/427 ,  H05K7/20136 ,  H05K7/20336

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

公开(公告)号：US20190141854A1

公开(公告)日：2019-05-09

申请号：US16231169

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Tim Liu ,  Gerry Juan ,  Jason Y. Jiang

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/08 ,  H05K1/02

Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.

公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US11649993B2

公开(公告)日：2023-05-16

申请号：US16457229

申请日：2019-06-28

Applicant: INTEL CORPORATION

Inventor： Gavin Sung ,  Gerry Juan ,  Harish Jagadish ,  Ivan By Wang ,  Jason Y. Jiang ,  Sammi Wy Liu ,  Tim Liu ,  Jeff Ku

IPC: F25B21/02 ,  F25B9/00 ,  F25B25/00

CPC classification number: F25B21/02 ,  F25B9/006 ,  F25B25/00

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

公开(公告)号：US20210210051A1

公开(公告)日：2021-07-08

申请号：US17212834

申请日：2021-03-25

Applicant: Intel Corporation

Inventor： Andy B. Wang ,  Gavin Sung ,  Nee Shen Ho ,  Tim Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Tong Liang Chew

IPC: G09G5/12 ,  G06K7/14

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to configure multiple displays. An example apparatus disclosed herein includes memory, and a processor to execute instructions to detect, via a tag reader on a first display, a tag on a second display, the first display and second display communicatively coupled to a computing device, determine, based on a location of the tag reader relative to the first display, a position of the second display relative to the first display, and update an operating system of the computing device based on the determined position.

公开(公告)号：US20170374331A1

公开(公告)日：2017-12-28

申请号：US15193964

申请日：2016-06-27

Applicant: Intel Corporation

Inventor： Tim Liu ,  Gerry Juan ,  Simon Tsai ,  Jeff Ku ,  Gavin Sung

IPC: H04N9/31

CPC classification number: H04N9/3185 ,  G01B11/25 ,  G01B11/2504 ,  G03B21/53 ,  G06T5/006 ,  H04N9/3194 ,  H04N13/246 ,  H04N13/254 ,  H04N13/271

Abstract: An apparatus and method for performing automatic keystone correction and automatic focus correction in a system. In one embodiment, the method comprises analyzing an image projected on a projection surface by a projector of a device and captured by one or more cameras of the device to determine whether shape of the image indicates keystone correction is needed and adjusting display output of the projector to cause the display output to be rectangular on the projection surface.