公开(公告)号：US20200218317A1

公开(公告)日：2020-07-09

申请号：US16648595

申请日：2018-01-12

Applicant: Intel Corporation

Inventor： Tao SHU ,  Chuansheng LIU ,  Na CHEN ,  Liguang DU

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/02

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide cooling to a heat source. In embodiments, a first set of cooling fins are thermally coupled to a heat source in a first orientation to allow first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source. A second set of cooling fins thermally coupled to the heat source in a second orientation to allow second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source. A barrier may be coupled to the second set of cooling fins to substantially divert the second airflow away from the first airflow about to pass through in between the first set of cooling fins so that pre-heated air does not flow over the first set of cooling fins.

公开(公告)号：US20230420338A1

公开(公告)日：2023-12-28

申请号：US18034133

申请日：2021-03-06

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tong Wa CHAO ,  Ying-Feng PANG ,  Yi XIA ,  Rahima K. MOHAMMED ,  Victor P. POLYANKO ,  Ridvan A. SAHAN ,  Guangying ZHANG ,  Guoliang YING ,  Chuanlou WANG ,  Jun LU ,  Liguang DU ,  Peng WEI ,  Xiang QUE

IPC: H01L23/473 ,  G06F1/20 ,  H01L23/367

CPC classification number: H01L23/473 ,  G06F1/206 ,  H01L23/3672 ,  G06F2200/201

Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

公开(公告)号：US20240314973A1

公开(公告)日：2024-09-19

申请号：US18671881

申请日：2024-05-22

Applicant: Intel Corporation

Inventor： Chen ZHANG ,  Xiang QUE ,  Yang YAO ,  Yuehong FAN ,  Guangying ZHANG ,  Liguang DU ,  Shaorong ZHOU ,  Chuanlou WANG ,  Yingqiong BU ,  Yue YANG

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20236 ,  H05K1/0203 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20409 ,  H05K7/20763 ,  H05K7/20263

Abstract: An apparatus is described that includes an immersion bath chamber and a cover that is to seal the immersion bath chamber. An apparatus is described that includes an immersion bath chamber and an installable/removable transfer member. The installable/removable transfer member has fluidic connectors designed to couple to respective warmed fluid flow output ports of pluggable units to be cooled in the immersion bath chamber and having respective backplane interface designs. An apparatus is described that includes an immersion bath chamber and an overflow chamber. The overflow chamber is to receive an overflow of liquid coolant from the immersion bath chamber, wherein a first exit flow channel from the overflow chamber is coupled to a second exit fluid flow channel from the immersion bath chamber through a valve, wherein, an opening of the valve is controllable to vary a gravitational fluid flow within the immersion bath chamber.

公开(公告)号：US20230309262A1

公开(公告)日：2023-09-28

申请号：US18203904

申请日：2023-05-31

Applicant: Intel Corporation

Inventor： Liguang DU ,  Guangying ZHANG ,  Shaorong ZHOU ,  David PIDWERBECKI ,  Chuanlou WANG ,  Sandeep AHUJA ,  Mark MACDONALD ,  Sung Ki KIM ,  Xiang QUE ,  Haifeng GONG ,  Jessica GULLBRAND ,  Drew DAMM ,  Eric D. MCAFEE ,  Suchismita SARANGI

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/2039 ,  H05K7/20772

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

公开(公告)号：US20220200177A1

公开(公告)日：2022-06-23

申请号：US17540636

申请日：2021-12-02

Applicant: Intel Corporation

Inventor： Jun LU ,  Wei LIAO ,  Guangying ZHANG ,  Liguang DU ,  Guoliang YING ,  Fangbo ZHU ,  Song Kok HANG ,  Juan A. OROZCO RAMIREZ ,  Wesley B. MORGAN

IPC: H01R12/70 ,  G06F1/18 ,  H01R13/627

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

公开(公告)号：US20220139843A1

公开(公告)日：2022-05-05

申请号：US17428565

申请日：2019-04-10

Applicant: INTEL CORPORATION

Inventor： Jun LU ,  Wei LIAO ,  Chen ZHANG ,  Guangying ZHANG ,  Liguang DU ,  Chuansheng LIU ,  Michael LEDDIGE ,  Weimin SHI ,  Eduardo MICHEL ,  Guillermo RENTERIA ZAMUDIO

IPC: H01L23/552 ,  H01L23/00

Abstract: An integrated circuit assembly may be formed having at least one integrated circuit device electrically attached to an electronic substrate. The integrated circuit assembly may further include at least one electromagnetic interference structure attached to the electronic substrate adjacent to the at least one integrated circuit device. The at least one electromagnetic interference structure may be electrically attached to the electronic substrate with at least one resilient connector extending therebetween. In one embodiment, the at least one electromagnetic interference structure may be grounded to the electronic substrate.

公开(公告)号：US20210143566A1

公开(公告)日：2021-05-13

申请号：US16976380

申请日：2018-06-22

Applicant: Intel Corporation

Inventor： Jun LU ,  Wei LIAO ,  Guangying ZHANG ,  Liguang DU ,  Guoliang YING ,  Fangbo ZHU ,  Song Kok HANG ,  Juan A. OROZCO RAMIREZ ,  Wesley B. MORGAN

IPC: H01R12/70 ,  H01R13/627 ,  G06F1/18

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.