DISPLAY PANEL
    2.
    发明申请
    DISPLAY PANEL 审中-公开

    公开(公告)号:US20170133445A1

    公开(公告)日:2017-05-11

    申请号:US15415838

    申请日:2017-01-25

    Abstract: A display device including a TFT substrate and a display layer is provided. The TFT substrate includes a substrate, a gate layer, a semiconductor layer, a gate dielectric layer, a first electrode layer, a first passivation layer, a second passivation layer, and a second electrode layer. A via penetrates the first passivation layer and the second passivation layer to expose a portion of the first electrode layer, and the via has a sidewall. The second electrode layer is electrically connected to the first electrode layer through the via, the first passivation layer has a first edge on the sidewall of the via, the second passivation layer has a second edge on the sidewall of the via, and the first edge and the second edge are separated by a distance in the range of 500-2000 Å.

    LIGHT-EMITTING DIODE DISPLAY DEVICE
    4.
    发明申请

    公开(公告)号:US20180040822A1

    公开(公告)日:2018-02-08

    申请号:US15662522

    申请日:2017-07-28

    Abstract: A light-emitting diode display device includes a light-emitting diode and a substrate. The light-emitting diode includes a central axis, and the substrate includes a first connecting portion and a second connecting portion. The central axis is extended through the first connecting portion. The second connecting portion is disposed outside of the first connecting portion and is spaced apart from the first connecting portion by a distance which is greater than zero, and the first connecting portion and the second connecting portion are respectively electrically connected to the light-emitting diode.

    MANUFACTURING METHOD OF ELECTRONIC DEVICE
    5.
    发明公开

    公开(公告)号:US20240250219A1

    公开(公告)日:2024-07-25

    申请号:US18403510

    申请日:2024-01-03

    CPC classification number: H01L33/486 H01L25/0753 H01L25/167

    Abstract: A manufacturing method of an electronic device includes: providing a first substrate, which has a base layer and a plurality of electronic components disposed on the base layer; adhering adhesive material to each of the plurality of electronic components; providing a target substrate, wherein the target substrate and the first substrate are separated from each other by a distance; and transferring at least part of the plurality of electronic components adhered with the adhesive material to the target substrate through a laser process, wherein at least part of the plurality of electronic components are attached to the target substrate via the adhesive material.

    DISPLAY DEVICE
    6.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20200266388A1

    公开(公告)日:2020-08-20

    申请号:US16865673

    申请日:2020-05-04

    Abstract: A display device is provided. The display device includes a light-emitting unit. The light-emitting unit includes a light-emitting part, wherein a light extraction structure is disposed on a first surface of the light-emitting part. The light-emitting unit also includes a connective part disposed on a second surface opposite to the first surface of the light-emitting part. The light-emitting unit further includes a protective part surrounding the light-emitting part and the connective part. In addition, the display device includes a substrate having a plurality of active elements and at least one bonding pad, wherein the bonding pad is electrically connected to the corresponding connective part of the light-emitting unit. The roughness of the light extraction structure is greater than or equal to 0.2 μm and less than or equal to 5 μm.

    ELECTRONIC DEVICE
    7.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20190326329A1

    公开(公告)日:2019-10-24

    申请号:US16360521

    申请日:2019-03-21

    Abstract: An electronic device is provided. The electronic device includes a substrate, a plurality of thin-film transistors disposed on the substrate, and a plurality of light-emitting units. One of the light-emitting units has an encapsulating glue and at least one light-emitting chip. The encapsulating glue is disposed on the light-emitting chip, and the light-emitting unit is electrically connected to at least one of the thin-film transistors.

    DISPLAY PANEL
    8.
    发明申请
    DISPLAY PANEL 有权
    显示面板

    公开(公告)号:US20150228798A1

    公开(公告)日:2015-08-13

    申请号:US14610085

    申请日:2015-01-30

    Abstract: A display panel whose TFT substrate comprises a substrate, a gate layer, a gate dielectric layer, a semiconductor layer, a first electrode layer, a first passivation layer, a second passivation layer, a via and a second electrode layer is provided. The gate layer is disposed on the substrate. The gate dielectric layer is disposed on the gate layer. The semiconductor layer is disposed on the gate dielectric layer. The first electrode layer is disposed on the semiconductor layer. The first and second passivation layers are sequentially disposed on the first electrode layer. The via penetrates the passivation layers to expose the first electrode layer. The second electrode layer is electrically connected to the first electrode layer through the via. The first and second passivation layers have first and second taper angles respectively. The difference between the first and second taper angles is below 30°.

    Abstract translation: 提供了TFT基板包括基板,栅极层,栅极介电层,半导体层,第一电极层,第一钝化层,第二钝化层,通孔和第二电极层的显示面板。 栅极层设置在基板上。 栅极电介质层设置在栅极层上。 半导体层设置在栅介质层上。 第一电极层设置在半导体层上。 第一和第二钝化层依次设置在第一电极层上。 通孔穿透钝化层以露出第一电极层。 第二电极层通过通孔与第一电极层电连接。 第一和第二钝化层分别具有第一和第二锥角。 第一和第二锥角之间的差值低于30°。

    ELECTRONIC DEVICE
    9.
    发明申请

    公开(公告)号:US20250160085A1

    公开(公告)日:2025-05-15

    申请号:US19026215

    申请日:2025-01-16

    Inventor: Ming-Chang LIN

    Abstract: An electronic device is provided by the present disclosure. The electronic device includes a substrate, an electronic component, and a bonding structure. The bonding structure is disposed between the electronic component and the substrate, and the bonding structure includes at least a first bonding layer and at least one compressible layer.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220199875A1

    公开(公告)日:2022-06-23

    申请号:US17529166

    申请日:2021-11-17

    Inventor: Ming-Chang LIN

    Abstract: An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes following steps: providing a substrate; forming a first compressible layer on the substrate; forming a first bonding pad on the first compressible layer; providing an electronic component; forming a second bonding pad on the electronic component; and bonding the electronic component with the substrate by contacting the second bonding pad with the first bonding pad.

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