公开(公告)号：US11474568B2

公开(公告)日：2022-10-18

申请号：US17227962

申请日：2021-04-12

Applicant: Intel Corporation

Inventor： Bijendra Singh ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Kathiravan D

IPC: G06F1/16

Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.

公开(公告)号：USD933059S1

公开(公告)日：2021-10-12

申请号：US29664946

申请日：2018-09-28

Applicant: Intel Corporation

Designer： Babu Triplicane Gopikrishnan ,  Kathiravan D ,  Prakash Kurma Raju ,  Prasanna Pichumani

公开(公告)号：US20210112684A1

公开(公告)日：2021-04-15

申请号：US17132477

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Penchala Pratap Binni Boyina ,  Kathiravan D ,  Babu Triplicane Gopikrishnan ,  Prakash Kurma Raju ,  Deepak Sekar ,  Hari Shanker Thakur

IPC: H05K7/20 ,  F28D15/04 ,  H01L23/427 ,  H01L23/40 ,  G06F1/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.

公开(公告)号：US20230337406A1

公开(公告)日：2023-10-19

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu BAWA ,  Ruander CARDENAS ,  Kathiravan D ,  Jia Yan GO ,  Chin Kung GOH ,  Jeff KU ,  Prakash Kurma RAJU ,  Baomin LIU ,  Twan Sing LOO ,  Mikko MAKINEN ,  Columbia MISHRA ,  Juha PAAVOLA ,  Prasanna PICHUMANI ,  Daniel RAGLAND ,  Kannan RAJA ,  Khai Ern SEE ,  Javed SHAIKH ,  Gokul SUBRAMANIAM ,  George Baoci SUN ,  Xiyong TIAN ,  Hua YANG ,  Mark CARBONE ,  Vivek PARANJAPE ,  Nehakausar PINJARI ,  Hari Shanker THAKUR ,  Christopher MOORE ,  Gustavo FRICKE ,  Justin HUTTULA ,  Gavin SUNG ,  Sammi WY LIU ,  Arnab SEN ,  Chun-Ting LIU ,  Jason Y. JIANG ,  Gerry JUAN ,  Shih Wei NIEN ,  Lance LIN ,  Evan KUKLINSKI

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20

CPC classification number: H05K7/20963 ,  H01L23/34 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2099 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20154

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20190179377A1

公开(公告)日：2019-06-13

申请号：US16274818

申请日：2019-02-13

Applicant: Intel Corporation

Inventor： Bijendra Singh ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Kathiravan D

IPC: G06F1/16

Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.

公开(公告)号：US11573055B2

公开(公告)日：2023-02-07

申请号：US16728812

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Mark Carbone ,  Vivek Paranjape ,  Prakash Kurma Raju ,  Mikko Antero Makinen ,  Christopher M. Moore ,  Gustavo Fricke ,  Kathiravan D ,  Ritu Bawa ,  Nehakausar Shaikh Ramjan Pinjari ,  Hari Shanker Thakur

IPC: F28D15/04 ,  H01L23/427 ,  H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

公开(公告)号：US20220225536A1

公开(公告)日：2022-07-14

申请号：US17711821

申请日：2022-04-01

Applicant: The Intel Corporation

Inventor： Arunpandi R. ,  Kathiravan D ,  Triplicane Gopikrishnan Babu ,  Doddi Raghavendra ,  Ritu Bawa ,  Bijendra Singh

IPC: H05K7/20 ,  G06F1/20

Abstract: Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.

公开(公告)号：US20210232184A1

公开(公告)日：2021-07-29

申请号：US17227962

申请日：2021-04-12

Applicant: Intel Corporation

Inventor： Bijendra Singh ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Kathiravan D

IPC: G06F1/16

Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.

公开(公告)号：US12114466B2

公开(公告)日：2024-10-08

申请号：US17132477

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Penchala Pratap Binni Boyina ,  Kathiravan D ,  Babu Triplicane Gopikrishnan ,  Prakash Kurma Raju ,  Deepak Sekar ,  Hari Shanker Thakur

IPC: H05K7/20 ,  F28D15/04 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427

CPC classification number: H05K7/20336 ,  F28D15/04 ,  G06F1/203 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4087

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.

公开(公告)号：US11206748B2

公开(公告)日：2021-12-21

申请号：US16713430

申请日：2019-12-13

Applicant: Intel Corporation

Inventor： Raghavendra Doddi ,  Ravishankar Srikanth ,  Kathiravan D ,  Prakash Kurma Raju

IPC: H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.