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    Printed circuit board using paste bump and manufacturing method thereof
    6.
    发明申请
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US20080283288A1

    公开(公告)日：2008-11-20

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于糊状凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

    Printed circuit board having fine pattern and manufacturing method thereof
    7.
    发明申请
    Printed circuit board having fine pattern and manufacturing method thereof 审中-公开
    具有精细图案的印刷电路板及其制造方法

    公开(公告)号：US20070059917A1

    公开(公告)日：2007-03-15

    申请号：US11520729

    申请日：2006-09-14

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

    IPC分类号： H01L21/44 ,  H01L21/4763

    CPC分类号： H05K3/4664 ,  H05K3/0023 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09536 ,  H05K2203/0143 ,  H05K2203/0568

    摘要： A manufacturing method for a printed circuit board having a fine pattern is disclosed, comprising: providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

    摘要翻译： 公开了一种具有精细图案的印刷电路板的制造方法，包括：提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层，然后在感光材料中形成第二电路图案; 形成第二电路层，并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。

    Printed circuit board using paste bump and manufacturing method thereof
    8.
    发明授权
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US07973248B2

    公开(公告)日：2011-07-05

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H01R12/04 ,  H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于粘贴凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

    Printed circuit board having fine pattern and manufacturing method thereof
    9.
    发明申请
    Printed circuit board having fine pattern and manufacturing method thereof 审中-公开
    具有精细图案的印刷电路板及其制造方法

    公开(公告)号：US20090229875A1

    公开(公告)日：2009-09-17

    申请号：US12453741

    申请日：2009-05-20

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

    IPC分类号： H05K1/11

    CPC分类号： H05K3/4664 ,  H05K3/0023 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09536 ,  H05K2203/0143 ,  H05K2203/0568

    摘要： A printed circuit board having a fine pattern and related manufacturing method that includes providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

    摘要翻译： 一种具有精细图案和相关制造方法的印刷电路板，包括提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层，然后在感光材料中形成第二电路图案; 形成第二电路层，并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。