公开(公告)号：US20120107228A1

公开(公告)日：2012-05-03

申请号：US12674323

申请日：2008-08-11

申请人： Kiyohito Ishida ,  Ryosuke Kainuma ,  Ikuo Ohnuma ,  Toshihiro Omori ,  Yoshikazu Takaku ,  Takehito Hagisawa

发明人： Kiyohito Ishida ,  Ryosuke Kainuma ,  Ikuo Ohnuma ,  Toshihiro Omori ,  Yoshikazu Takaku ,  Takehito Hagisawa

IPC分类号： C01B3/08 ,  C22C13/00 ,  C22C12/00 ,  C22C21/02 ,  C22C30/00 ,  C22C21/12 ,  C22C21/10 ,  C22C21/06 ,  C22C21/00 ,  C22C28/00

CPC分类号： C22C12/00 ,  B22F9/04 ,  C01B3/08 ,  C22C13/00 ,  C22C21/00 ,  C22C30/04 ,  Y02E60/36

摘要： There is provided a hydrogen gas generating member which safely facilitates the hydrogen gas generation reaction by bringing an Al alloy which is subjected to rolling treatment or powdering treatment into contact with water.A hydrogen gas generating member 20 includes a texture in which Al is finely dispersed in a metal matrix, where hydrogen gas is generated by bringing the hydrogen gas generating member into contact with water. A fixing member 14 for mounting the hydrogen gas generating member 20 is provided in a hydrogen generating apparatus 10 and is brought into contact with a water 15 that is stored inside. The hydrogen gas generated from the surface is supplied outside through a hydrogen gas collecting, pipe 12 and stored in a storage tank (not shown).

摘要翻译： 提供了一种通过使经受轧制处理或粉化处理的Al合金与水接触来安全地促进氢气产生反应的氢气产生元件。 氢气发生元件20包括其中Al细分散在金属基体中的结构，其中通过使氢气产生元件与水接触而产生氢气。 在氢生成装置10中设置有用于安装氢气产生部件20的固定部件14，与储存在内部的水15接触。 从表面产生的氢气通过氢气收集管12供给到外部，并储存在储存罐（未示出）中。

公开(公告)号：US09605334B2

公开(公告)日：2017-03-28

申请号：US14345424

申请日：2012-04-16

申请人： Kiyohito Ishida ,  Yoshikazu Takaku ,  Toshihiro Omori

发明人： Kiyohito Ishida ,  Yoshikazu Takaku ,  Toshihiro Omori

IPC分类号： C22C5/04 ,  C22F1/14

CPC分类号： C22F1/14 ,  C22C5/04

摘要： The present invention is a heat-resistant material comprising a Rh-based alloy, wherein the Rh-based alloy is a high heat-resistant and high strength alloy comprising a Rh-based alloy where Al and W as essential additive elements are added to Rh (0.2 to 15.0 mass % of Al, 15.0 to 45.0 mass % of W and Rh as the remainder), and a γ′ phase (Rh3 (Al, W)) having an L12 structure is dispersed as a strengthening phase in a matrix. The Rh-based alloy of the present invention can be further improved in workability and high temperature oxidation characteristics by optionally adding B, C, Mg, Ca, Y, La or misch metals, Ni, Co, Cr, Fe, Mo, Ti, Nb, Ta, V, Zr, Hf, Ir, Re, Pd, Pt or Ru as an additive element. The Rh-based alloy of the present invention is a heat-resistant material having excellent high-temperature-resistant characteristics and a good balance of factors such as weight.

公开(公告)号：US20140345758A1

公开(公告)日：2014-11-27

申请号：US14345424

申请日：2012-04-16

申请人： Kiyohito Ishida ,  Yoshikazu Takaku ,  Toshihiro Omori

发明人： Kiyohito Ishida ,  Yoshikazu Takaku ,  Toshihiro Omori

IPC分类号： C22F1/14 ,  C22C5/04

CPC分类号： C22F1/14 ,  C22C5/04

摘要： The present invention is a heat-resistant material comprising a Rh-based alloy, wherein the Rh-based alloy is a high heat-resistant and high strength alloy comprising a Rh-based alloy where Al and W as essential additive elements are added to Rh (0.2 to 15.0 mass % of Al, 15.0 to 45.0 mass % of W and Rh as the remainder), and a γ′ phase (Rh3 (Al, W)) having an L12 structure is dispersed as a strengthening phase in a matrix. The Rh-based alloy of the present invention can be further improved in workability and high temperature oxidation characteristics by optionally adding B, C, Mg, Ca, Y, La or misch metals, Ni, Co, Cr, Fe, Mo, Ti, Nb, Ta, V, Zr, Hf, Ir, Re, Pd, Pt or Ru as an additive element. The Rh-based alloy of the present invention is a heat-resistant material having excellent high-temperature-resistant characteristics and a good balance of factors such as weight.

摘要翻译： 本发明是一种包含Rh基合金的耐热材料，其中Rh基合金是一种高耐热和高强度的合金，其中Al和W作为必需添加元素加入Rh中的Rh基合金 （Al为0.2〜15.0质量％，W为15.0〜45.0质量％，Rh为余量），具有L12结构的γ'相（Rh 3（Al，W））作为强化相分散在基体中。 通过任意添加B，C，Mg，Ca，Y，La或混合稀土金属，Ni，Co，Cr，Fe，Mo，Ti等，能够进一步提高本发明的Rh系合金的加工性和高温氧化特性， Nb，Ta，V，Zr，Hf，Ir，Re，Pd，Pt或Ru作为添加元素。 本发明的Rh系合金是具有优异的耐高温特性和重量等因素的良好平衡的耐热材料。

公开(公告)号：US09617622B2

公开(公告)日：2017-04-11

申请号：US12674323

申请日：2008-08-11

申请人： Kiyohito Ishida ,  Ryosuke Kainuma ,  Ikuo Ohnuma ,  Toshihiro Omori ,  Yoshikazu Takaku ,  Takehito Hagisawa

发明人： Kiyohito Ishida ,  Ryosuke Kainuma ,  Ikuo Ohnuma ,  Toshihiro Omori ,  Yoshikazu Takaku ,  Takehito Hagisawa

IPC分类号： C22C21/00 ,  C22C12/00 ,  C22C13/00 ,  C22C30/00 ,  B22F9/04 ,  C01B3/08 ,  C22C30/04

CPC分类号： C22C12/00 ,  B22F9/04 ,  C01B3/08 ,  C22C13/00 ,  C22C21/00 ,  C22C30/04 ,  Y02E60/36

摘要： A hydrogen gas generating member includes a metal alloy having dispersed aluminum. The metal alloy includes an Al—X alloy, where X is Sn: 10.1 to 99.5% by mass, Bi: 30.1 to 99.5% by mass, In: 10.1 to 99.5% by mass, Sn +Bi: 20.1 to 99.5% by mass, Sn +In: to 10 to 99.5% by mass, Bi+In: 20.1 to 99.5% by mass, or Sn+Bi+In: 20 to 99.5% by mass. Hydrogen gas is generated by bringing the hydrogen gas generating member into contact with water.

公开(公告)号：US20100193801A1

公开(公告)日：2010-08-05

申请号：US12669346

申请日：2008-11-19

申请人： Yasushi Yamada ,  Yuji Yagi ,  Yoshikazu Takaku ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Takashi Atsumi ,  Ikuo Nakagawa ,  Mikio Shirai

发明人： Yasushi Yamada ,  Yuji Yagi ,  Yoshikazu Takaku ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Takashi Atsumi ,  Ikuo Nakagawa ,  Mikio Shirai

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L29/12 ,  H01B5/00 ,  B23K35/14 ,  B23K1/20 ,  B05D3/00

CPC分类号： C22C18/04 ,  B23K35/282 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29298 ,  H01L2224/32014 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19042 ,  H01L2924/351 ,  Y10T428/12222 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

摘要： A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.

摘要翻译： 本发明的锌基焊料55通过在其上除去氧化膜501或不存在氧化膜501的锌基材料50的表面上设置涂覆层51来制备，该涂层51包含 主要是氧化物比氧化膜501更容易还原的金属。在本发明的接合体和功率半导体模块中，在接合部使用锌基焊料55，在接合后，涂层51 不存在。

公开(公告)号：US20100109016A1

公开(公告)日：2010-05-06

申请号：US12596382

申请日：2008-04-17

申请人： Yuji Yagi ,  Yasushi Yamada ,  Ikuo Nakagawa ,  Takashi Atsumi ,  Mikio Shirai ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Yoshikazu Takaku

发明人： Yuji Yagi ,  Yasushi Yamada ,  Ikuo Nakagawa ,  Takashi Atsumi ,  Mikio Shirai ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Yoshikazu Takaku

IPC分类号： H01L23/488 ,  H01L29/12

CPC分类号： H01L23/3735 ,  H01L23/473 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/83205

摘要： Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.

摘要翻译： 提供了一种功率半导体模块，其中两个部件通过Bi基焊料材料接合。 在其表面上设置有Cu层，以通过Bi基焊料材料粘接在双组分上。 两个部件，即待接合的部件，是半导体元件和绝缘部件的组合，或绝缘部件和散热器板的组合。 绝缘部由Cu / SiNx / Cu层叠体构成。

公开(公告)号：US08283783B2

公开(公告)日：2012-10-09

申请号：US12669346

申请日：2008-11-19

申请人： Yasushi Yamada ,  Yuji Yagi ,  Yoshikazu Takaku ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Takashi Atsumi ,  Ikuo Nakagawa ,  Mikio Shirai

发明人： Yasushi Yamada ,  Yuji Yagi ,  Yoshikazu Takaku ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Takashi Atsumi ,  Ikuo Nakagawa ,  Mikio Shirai

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： C22C18/04 ,  B23K35/282 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29298 ,  H01L2224/32014 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19042 ,  H01L2924/351 ,  Y10T428/12222 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

摘要： A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.

摘要翻译： 本发明的锌基焊料55通过在其上除去氧化膜501或不存在氧化膜501的锌基材料50的表面上设置涂覆层51来制备，该涂层51包含 主要是氧化物比氧化膜501更容易还原的金属。在本发明的接合体和功率半导体模块中，在接合部使用锌基焊料55，在接合后，涂层51 不存在。

公开(公告)号：US20060210790A1

公开(公告)日：2006-09-21

申请号：US10997182

申请日：2004-11-24

申请人： Yuma Horio ,  Takahiro Hayashi ,  Kenzaburo Iijima ,  Junya Suzuki ,  Masayoshi Sekine ,  Kiyohito Ishida ,  Ryosuke Kainuma ,  Ikuo Ohnuma ,  Yoshikazu Takaku ,  Cui Wang

发明人： Yuma Horio ,  Takahiro Hayashi ,  Kenzaburo Iijima ,  Junya Suzuki ,  Masayoshi Sekine ,  Kiyohito Ishida ,  Ryosuke Kainuma ,  Ikuo Ohnuma ,  Yoshikazu Takaku ,  Cui Wang

IPC分类号： H01L35/08 ,  B32B5/16 ,  B32B15/04 ,  C22C9/04 ,  C22C9/00

CPC分类号： H01L35/08 ,  B23K35/0244 ,  B23K35/0255 ,  B23K35/264 ,  H01L35/10 ,  Y10T428/25 ,  Y10T428/31678

摘要： A thermoelectric module comprises a plurality of thermoelectric elements which are arranged between a pair of substrates having electrode patterns and which are bonded with the electrode patterns via solder in which at least one dispersion phase is dispersed into a matrix phase, wherein the melting temperature of the dispersion phase is higher than that of the matrix phase (i.e., 240° C. or over), and the dispersion phase comprises fine particles whose average diameter is 5 μm or less. The solder is constituted by an alloy so as to realize a volume ratio of 40% or less, wherein it is composed of a Bi—Cu—X alloy or a Bi—Zn—X alloy (where ‘X’ represents at least one element selected in advance). Preferably, the solder is constituted by powder containing fine particles whose average diameter is 100 μm or less or thin plates whose average thickness is 500 μm or less.

摘要翻译： 热电模块包括多个热电元件，其布置在具有电极图案的一对基板之间，并且通过焊料与电极图案结合，其中至少一个分散相分散在基体相中，其中熔融温度 分散相高于基质相（即240℃以上），分散相包含平均粒径为5μm以下的微粒。 焊料由合金构成，以实现40％以下的体积比，其中由Bi-Cu-X合金或Bi-Zn-X合金（其中“X”表示至少一种元素 提前选择）。 优选地，焊料由平均粒径为100μm以下的微粒或平均厚度为500μm以下的薄板的粉末构成。