SEMICONDUCTOR LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS COMPRISING SAME

    公开(公告)号:US20230395768A1

    公开(公告)日:2023-12-07

    申请号:US18032594

    申请日:2020-10-22

    Inventor: Kyuhyun BANG

    CPC classification number: H01L33/62 H01L25/0753 H01L25/167

    Abstract: A semiconductor light-emitting device and a display apparatus comprising same are disclosed. The semiconductor light-emitting device according to an embodiment of the present disclosure comprises: a first conductive type semiconductor layer and a second conductive type semiconductor layer; an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a metal-semiconductor (MS) contact layer formed on one surface of the second conductive type semiconductor layer, which is spaced apart from the active layer; and a first metal layer formed on the first conductive type semiconductor layer and a second metal layer formed to cover the MS contact layer, wherein the area over which one surface of the second conductive type semiconductor layer comes into contact with the MS contact layer is different from the area of the active layer.

    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE
    3.
    发明申请
    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    使用半导体发光器件的显示器件

    公开(公告)号:US20150255505A1

    公开(公告)日:2015-09-10

    申请号:US14638930

    申请日:2015-03-04

    Abstract: A display device including a wiring substrate having a first substrate layer and a second substrate layer, a conductive adhesive layer configured to cover the wiring substrate, a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer and electrically connected to a first electrode and a second electrode. Further, the first electrode is disposed on the first substrate layer, and the second substrate layer has one surface facing the conductive adhesive layer and the other surface covering the first electrode, and an auxiliary electrode electrically connected to the first electrode and the second electrode are disposed on one surface of the second substrate layer.

    Abstract translation: 一种显示装置,包括具有第一基板层和第二基板层的布线基板,配置成覆盖布线基板的导电性粘合剂层,耦合到导电性粘合剂层并与第一电极电连接的多个半导体发光元件, 第二电极。 此外,第一电极设置在第一基板层上,第二基板层具有面向导电粘合剂层的一个表面和覆盖第一电极的另一表面,以及与第一电极和第二电极电连接的辅助电极 设置在第二基板层的一个表面上。

    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHOD FOR MANUFACTURING THE SAME 有权
    使用半导体发光装置的显示装置及其制造方法

    公开(公告)号:US20160218142A1

    公开(公告)日:2016-07-28

    申请号:US14868072

    申请日:2015-09-28

    Inventor: Kyuhyun BANG

    Abstract: A display device including a plurality of semiconductor light emitting devices on a wiring substrate; a connection part on the wiring substrate and configured to electrically-connect the plurality of semiconductor light emitting devices to the wiring substrate. Further, each of the plurality of semiconductor light emitting devices includes a first conductive semiconductor layer; a second conductive semiconductor layer overlapped with the first conductive semiconductor layer; a first conductive electrode on the first conductive semiconductor layer; and a second conductive electrode on the second conductive semiconductor layer. In addition, the connection part includes a first conductive layer formed of a same material as the first conductive electrode and a second conductive layer formed of a same material as the second conductive electrode.

    Abstract translation: 一种在布线基板上包括多个半导体发光器件的显示装置; 配线基板上的连接部,将多个半导体发光元件电连接到配线基板。 此外,多个半导体发光器件中的每一个包括第一导电半导体层; 与所述第一导电半导体层重叠的第二导电半导体层; 在所述第一导电半导体层上的第一导电电极; 以及在第二导电半导体层上的第二导电电极。 此外,连接部分包括由与第一导电电极相同的材料形成的第一导电层和由与第二导电电极相同的材料形成的第二导电层。

    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
    5.
    发明申请
    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME 有权
    使用半导体发光装置的显示装置及其制造方法

    公开(公告)号:US20150171297A1

    公开(公告)日:2015-06-18

    申请号:US14478599

    申请日:2014-09-05

    Abstract: Discussed is a display device including a wiring substrate disposed with a first electrode; a conductive adhesive layer disposed between the wiring substrate and a second electrode; and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode, wherein at least one of the plurality of semiconductor light emitting devices comprises a first conductive electrode and a second conductive electrode disposed to be separated from each other, the at least one of the semiconductor light emitting devices having a lateral surface, and wherein the second conductive electrode extends beyond the lateral surface of the at least one of semiconductor light emitting devices.

    Abstract translation: 讨论了包括布置有第一电极的布线基板的显示装置; 布置在所述布线基板和第二电极之间的导电粘合剂层; 以及耦合到所述导电粘合剂层并且电连接到所述第一电极和所述第二电极的多个半导体发光器件,其中所述多个半导体发光器件中的至少一个包括第一导电电极和设置的第二导电电极 所述至少一个所述半导体发光器件具有侧表面,并且其中所述第二导电电极延伸超过所述至少一个半导体发光器件的侧表面。

    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE
    6.
    发明申请
    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    使用半导体发光器件的显示器件

    公开(公告)号:US20150116985A1

    公开(公告)日:2015-04-30

    申请号:US14506308

    申请日:2014-10-03

    Inventor: Kyuhyun BANG

    Abstract: Discussed is a display device including a substrate having at least one of a first and a second electrode, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first and second electrode, wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate.

    Abstract translation: 讨论的是显示装置,其包括具有第一和第二电极中的至少一个的基板,被配置为覆盖布线基板的导电粘合剂层和耦合到导电粘合剂层的多个半导体发光器件,并且电连接到 所述第一和第二电极,其中所述导电粘合剂层具有设置在第一区域中的第一导电粘合剂层和设置在与所述第一区域相邻的第二区域中的第二导电粘合剂层,使得所述导电粘合剂层被分割成多个 布线基板上的区域。

    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE
    7.
    发明申请
    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    使用半导体发光器件的显示器件

    公开(公告)号:US20150115296A1

    公开(公告)日:2015-04-30

    申请号:US14506294

    申请日:2014-10-03

    Abstract: Discussed is a display device including a wiring substrate having a first substrate layer and a second substrate layer, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to a first electrode and a second electrode, wherein the first electrode is disposed at the first substrate layer, and the second substrate layer includes one surface facing the conductive adhesive layer and the other surface covering the first electrode, and an auxiliary electrode electrically connected to the first electrode and the second electrode are disposed on one surface of the second substrate layer.

    Abstract translation: 讨论了包括具有第一基板层和第二基板层的布线基板的显示装置,配置为覆盖布线基板的导电性粘合层,以及与导电性粘合剂层连接的多个半导体发光元件, 第一电极和第二电极,其中第一电极设置在第一衬底层处,并且第二衬底层包括面向导电粘合剂层的一个表面和覆盖第一电极的另一表面,以及辅助电极,电连接到 第一电极和第二电极设置在第二基板层的一个表面上。

    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20250015243A1

    公开(公告)日:2025-01-09

    申请号:US18713549

    申请日:2022-07-08

    Abstract: A display device and a method of manufacturing the same according to an embodiment include a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and overlapping each other, an insulating layer disposed between the first assembly wiring and the second assembly wiring, a planarization layer disposed on the first assembly wiring and the second assembly wiring, and having a first opening, and a light emitting device disposed inside the first opening, wherein the first electrode overlaps the first assembly wiring and the second assembly wiring. And, the first electrode is bonded to one of the first assembly wiring and the second assembly wiring.

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