公开(公告)号：US20230282626A1

公开(公告)日：2023-09-07

申请号：US18163417

申请日：2023-02-02

Applicant: MEDIATEK INC.

Inventor： Tai-Yu CHEN ,  Bo-Jiun YANG ,  Tsung-Yu PAN ,  Yin-Fa CHEN ,  Ta-Jen YU ,  Bo-Hao MA ,  Wen-Sung HSU ,  Yao-Pang HSU

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/14

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L23/147 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/182 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1511 ,  H01L2924/152

Abstract: A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.

公开(公告)号：US20230046413A1

公开(公告)日：2023-02-16

申请号：US17812786

申请日：2022-07-15

Applicant: MEDIATEK INC.

Inventor： Tai-Yu CHEN ,  Chin-Lai CHEN ,  Hsiao-Yun CHEN ,  Wen-Sung HSU ,  Haw-Kuen SU ,  Duen-Yi HO ,  Bo-Jiun YANG ,  Ta-Jen YU ,  Bo-Hao MA

IPC: H01L25/10 ,  H01L25/18

Abstract: A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.

公开(公告)号：US20230260866A1

公开(公告)日：2023-08-17

申请号：US18157159

申请日：2023-01-20

Applicant: MEDIATEK INC.

Inventor： Yin-Fa CHEN ,  Bo-Jiun YANG ,  Ta-Jen YU ,  Bo-Hao MA ,  Chih-Wei CHANG ,  Tsung-Yu PAN ,  Tai-Yu CHEN ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13

CPC classification number: H01L23/3675 ,  H01L24/73 ,  H01L24/16 ,  H01L24/32 ,  H01L24/17 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/13 ,  H01L2924/1511 ,  H01L2924/15151 ,  H01L2924/152 ,  H01L2924/15331 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/17051 ,  H01L2924/1011

Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, an interposer, an adhesive layer, and a molding material. The semiconductor die is disposed over the package substrate. The interposer is disposed over the semiconductor die. The adhesive layer connects the semiconductor die and the interposer. The molding material surrounds the semiconductor die and the adhesive layer.