Abstract:
Aspects of the disclosure provide a method for call management. The method includes receiving a signal from one of a first transceiver and a second transceiver in an electronic device. The signal indicates an incoming call managed by a first service provider that the electronic device subscribes service from. The method further includes determining whether the other of the first transceiver and the second transceiver is operative in an active call managed by a second service provider that the electronic device subscribes service from, and rejecting the incoming call when the other transceiver is operative in the active call managed by the second service provider.
Abstract:
A thermal power budget optimization method includes acquiring sensor log information from a plurality of sensors of a heating device, generating a virtual surface temperature of the heating device according to the sensor log information, setting a target surface temperature of the heating device, and dynamically adjusting a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time.
Abstract:
The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.
Abstract:
The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.
Abstract:
A method for controlling circuit modules within a chip is provided, wherein the circuit modules includes at least one processor and at least one network module, and the method includes: obtaining a plurality of temperature-related information of the circuit modules; and allocating power limits or throughput limits of the circuit modules according to the temperature-related information of the circuit modules, respectively.
Abstract:
A method for controlling circuit modules within a chip is provided, wherein the circuit modules includes at least one processor and at least one network module, and the method includes: obtaining a plurality of temperature-related information of the circuit modules; and allocating power limits or throughput limits of the circuit modules according to the temperature-related information of the circuit modules, respectively.
Abstract:
A thermal protection method includes: determining a thermal headroom based on a difference between a current temperature and a predetermined threshold temperature; determining a power budget based on the thermal headroom; and utilizing a processor-based system to employ a target computing power setting according to at least the power budget, wherein selection of the target computing power setting is constrained by the power budget to ensure that the target computing power setting does not make the current temperature exceed the predetermined threshold temperature when employed by the processor-based system.
Abstract:
A touch communication connection establishing method, for establishing a touch communication between a first touch panel device (500) with a first touch panel (501) and a second touch panel device (900) with a second touch panel (901). The touch communication connection establishing method comprises: sensing at least one control action, wherein the control action comprises at least one touch communication related action, and/or determining if an arrangement of the control action meets a predetermined rule to generate a determining result; and establishing the touch communication connection between the first touch panel device (500) and the second touch panel device (900) based on the determining result.
Abstract:
The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.