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公开(公告)号:US20230020753A1
公开(公告)日:2023-01-19
申请号:US17305878
申请日:2021-07-16
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Yoshinori Fujiwara , Harish V. Gadamsetty , Gary Howe , Dennis G. Montierth , Michael A. Shore , Jason M. Johnson
IPC: G11C11/406 , G11C11/408 , G11C29/00 , G11C29/44
Abstract: Apparatuses, systems, and methods for refresh address masking. A memory device may refresh word lines as part of refresh operation by cycling through the word lines in a sequence. However, it may be desirable to avoid activating certain word lines (e.g., because they are defective). Refresh masking logic for each bank may include a fuse latch which stores a selected address associated with a word line to avoid. When a refresh address is generated it may be compared to the selected address. If there is a match, a refresh stop signal may be activated, which may prevent refreshing of the word line(s).
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公开(公告)号:US20190235760A1
公开(公告)日:2019-08-01
申请号:US15883956
申请日:2018-01-30
Applicant: Micron Technology, Inc.
Inventor: Gary Howe , Liang Chen , Daniel B. Penney
IPC: G06F3/06
Abstract: Techniques provided herein compensate for an internal and external timing skew between a data strobe (DQS) and a clock (CLK), by: executing at least one write leveling initialization procedure (WLInit) that uses a mode-register-write (MRW) command to synchronize a timing between a data strobe (DQS) with a clock (CLK) based upon capture of an internal write command. Internal and external timing skew is identified based upon the WLInit. The internal timing skew is skew caused internal to a memory device and the external timing skew is skew caused external to the memory device. A timing between the DQS and the CLK is adjusted based upon the internal and external timing skew.
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公开(公告)号:US10068648B1
公开(公告)日:2018-09-04
申请号:US15691217
申请日:2017-08-30
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Thanh K. Mai , Gary Howe
IPC: G11C7/00 , G11C16/08 , G11C11/406 , G11C11/16
Abstract: A semiconductor device may include a plurality of memory banks, a plurality of mode registers that may control an operational mode associated with each of the plurality of memory banks, and a set of global wiring lines coupled to each of the plurality of mode registers. The set of global wiring lines may include a first global wiring line to transmit data to each of the plurality of mode registers, a second global wiring line to transmit an address signal to each of the plurality of mode registers, a third global wiring line to transmit a read command signal to each of the plurality of mode registers, and a fourth global wiring line to transmit a write command signal to each of the plurality of mode registers.
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公开(公告)号:US20190065106A1
公开(公告)日:2019-02-28
申请号:US15691447
申请日:2017-08-30
Applicant: Micron Technology, Inc.
Inventor: Gary Howe
IPC: G06F3/06 , G11C11/408
Abstract: A memory device may include one or more memory banks that store data and one or more input buffers. The input buffers may receive command address signals to access the one or more memory banks. The memory device may operate in one of a first mode of operation or a second mode of operation. The one or more input buffers may operate under a first bias current when the memory device is in the first mode of operation or a second bias current when the memory device is in the second mode of operation, and the first bias current may be greater than the second bias current.
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公开(公告)号:US09196321B2
公开(公告)日:2015-11-24
申请号:US14045521
申请日:2013-10-03
Applicant: Micron Technology, Inc.
Inventor: Brian W. Huber , Vijay Vankayala , Brian Gross , Gary Howe , Roy E. Greeff
CPC classification number: G11C7/02 , G11C5/063 , G11C7/1057 , G11C7/1084 , G11C29/025 , G11C29/028 , G11C2207/105
Abstract: Apparatuses and methods are disclosed herein, including those, performed by a memory die, that operate to detect that a command on a bus connected to the memory die is addressed to another memory die responsive to a chip select signal, and to change the impedance of an on-die termination circuit of the memory die responsive to the detecting.
Abstract translation: 本文公开的装置和方法包括由存储管芯执行的装置和方法,其操作用于检测连接到存储管芯的总线上的命令是否响应于芯片选择信号寻址到另一存储器管芯,并且改变阻抗 存储器管芯的片上终端电路响应于检测。
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公开(公告)号:US20150098285A1
公开(公告)日:2015-04-09
申请号:US14045521
申请日:2013-10-03
Applicant: Micron Technology, Inc.
Inventor: Brian W. Huber , Vijay Vankayala , Brian Gross , Gary Howe , Roy E. Greeff
IPC: G11C7/02
CPC classification number: G11C7/02 , G11C5/063 , G11C7/1057 , G11C7/1084 , G11C29/025 , G11C29/028 , G11C2207/105
Abstract: Apparatuses and methods are disclosed herein, including those, performed by a memory die, that operate to detect that a command on a bus connected to the memory die is addressed to another memory die responsive to a chip select signal, and to change the impedance of an on-die termination circuit of the memory die responsive to the detecting.
Abstract translation: 本文公开的装置和方法包括由存储管芯执行的装置和方法,其操作用于检测连接到存储管芯的总线上的命令是否响应于芯片选择信号寻址到另一存储器管芯,并且改变阻抗 存储器管芯的片上终端电路响应于检测。
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公开(公告)号:US11915775B2
公开(公告)日:2024-02-27
申请号:US17449297
申请日:2021-09-29
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Jack Riley , Scott Smith , Christian Mohr , Gary Howe , Joshua Alzheimer , Yoshinori Fujiwara , Sujeet Ayyapureddi , Randall Rooney
CPC classification number: G11C29/4401 , G11C29/18 , G11C29/46 , G11C29/76 , G11C29/787 , G11C2029/1202
Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for bad row mode. The memory may prevent proper access operations (e.g., read operations) from being performed on a selected bad row of the memory as part of a bad row mode. For example, the memory may store a bad row address and when an access address matches the bad row address, may suppress one or more signals, change data read from the address, or combinations thereof. The bad row mode may be used to provide a positive control for post package repair (PPR) operations on the memory. A controller may enter the memory into bad row mode and then test the memory to determine if the selected bad row can be located and repaired via PPR.
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8.
公开(公告)号:US20190156871A1
公开(公告)日:2019-05-23
申请号:US16047954
申请日:2018-07-27
Applicant: Micron Technology, Inc.
Inventor: Gary Howe , Eric J. Stave , Thomas H. Kinsley , Matthew A. Prather
CPC classification number: G11C7/222 , G06F13/4086 , G11C7/1045 , G11C7/1057 , G11C7/1084 , G11C7/1096 , G11C8/10 , G11C2207/10
Abstract: Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during multiple communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication and instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The device may receive a second command instructing the first portion to perform a second communication, and the device may perform, with the first portion, the second communication while the second portion remains in the ODT mode. The second portion may persist in the ODT mode for an indicated number of communications, or until instructed to exit the ODT mode.
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公开(公告)号:US20170357482A1
公开(公告)日:2017-12-14
申请号:US15690085
申请日:2017-08-29
Applicant: Micron Technology, Inc.
Inventor: Brian Huber , Gary Howe
Abstract: Apparatuses and methods for a timing domain transfer circuit are disclosed. Disclosed embodiments may be configured to receive an event from one timing domain, output the event to another timing domain, and further configured to mark the event as transferred. An example method includes receiving an Event in based in a first timing domain at a first latch and receiving an intermediate event from the first latch by a second latch. The event is transferred to a second timing domain by the second latch and the first latch is reset based on feedback.
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公开(公告)号:US20230096291A1
公开(公告)日:2023-03-30
申请号:US17449297
申请日:2021-09-29
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Jack Riley , Scott Smith , Christian Mohr , Gary Howe , Joshua Alzheimer , Yoshinori Fujiwara , Sujeet Ayyapureddi , Randall Rooney
Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for bad row mode. The memory may prevent proper access operations (e.g., read operations) from being performed on a selected bad row of the memory as part of a bad row mode. For example, the memory may store a bad row address and when an access address matches the bad row address, may suppress one or more signals, change data read from the address, or combinations thereof. The bad row mode may be used to provide a positive control for post package repair (PPR) operations on the memory. A controller may enter the memory into bad row mode and then test the memory to determine if the selected bad row can be located and repaired via PPR.
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