Memory cells for storing operational data

    公开(公告)号:US11417398B2

    公开(公告)日:2022-08-16

    申请号:US17108783

    申请日:2020-12-01

    摘要: Methods, systems, and devices for memory cells for storing operational data are described. A memory device may include an array of memory cells with different sets of cells for storing data. A first set of memory cells may store data for operating the memory device, and the associated memory cells may each contain a chalcogenide storage element. A second set of memory cells may store host data. Some memory cells included in the first set may be programmed to store a first logic state and other memory cells in the first set may be left unprogrammed (and may represent a second logic state). Sense circuitry may be coupled with the array and may determine a value of data stored by the first set of memory cells.

    Implementations to store fuse data in memory devices

    公开(公告)号:US11037613B2

    公开(公告)日:2021-06-15

    申请号:US16514431

    申请日:2019-07-17

    IPC分类号: G11C7/22 G11C11/16

    摘要: Methods, systems, devices, and other implementations to store fuse data in memory devices are described. Some implementations may include an array of memory cells with different portions of cells for storing data. A first portion of the array may store fuse data and may contain a chalcogenide storage element, while a second portion of the array may store user data. Sense circuitry may be coupled with the array, and may determine the value of the fuse data using various signaling techniques. In some cases, the sense circuitry may implement differential storage and differential signaling to determine the value of the fuse data stored in the first portion of the array.

    Self-aligned memory decks in cross-point memory arrays

    公开(公告)号:US11018300B2

    公开(公告)日:2021-05-25

    申请号:US16665955

    申请日:2019-10-28

    IPC分类号: H01L45/00 H01L27/24

    摘要: A multi-layer memory device with an array having multiple memory decks of self-selecting memory cells is provided in which N memory decks may be fabricated with N+1 mask operations. The multiple memory decks may be self-aligned and certain manufacturing operations may be performed for multiple memory decks at the same time. For example, patterning a bit line direction of a first memory deck and a word line direction in a second memory deck above the first memory deck may be performed in a single masking operation, and both decks may be etched in a same subsequent etching operation. Such techniques may provide efficient fabrication which may allow for enhanced throughput, additional capacity, and higher yield for fabrication facilities relative to processing techniques in which each memory deck is processed using two or more mask and etch operations per memory deck.

    ACCESS LINE FORMATION FOR A MEMORY ARRAY

    公开(公告)号:US20210043685A1

    公开(公告)日:2021-02-11

    申请号:US16534952

    申请日:2019-08-07

    摘要: Methods, systems, and devices for access line formation for a memory array are described. The techniques described herein may be used to fabricate access lines for one or more decks of a memory array. In some examples, one or more access lines of a deck may be formed using an independent processing step. For example, different fabrication processes may be used to form a plurality of access lines in a deck and to form the pillars (e.g., the memory cells) that are coupled with the access lines. In some examples, an offset between the access lines and the pillars may exist due to the components being fabricated in different processing steps.

    IMPLEMENTATIONS TO STORE FUSE DATA IN MEMORY DEVICES

    公开(公告)号:US20210020218A1

    公开(公告)日:2021-01-21

    申请号:US16514431

    申请日:2019-07-17

    IPC分类号: G11C11/16

    摘要: Methods, systems, devices, and other implementations to store fuse data in memory devices are described. Some implementations may include an array of memory cells with different portions of cells for storing data. A first portion of the array may store fuse data and may contain a chalcogenide storage element, while a second portion of the array may store user data. Sense circuitry may be coupled with the array, and may determine the value of the fuse data using various signaling techniques. In some cases, the sense circuitry may implement differential storage and differential signaling to determine the value of the fuse data stored in the first portion of the array.

    Tapered cell profile and fabrication

    公开(公告)号:US10693065B2

    公开(公告)日:2020-06-23

    申请号:US15893100

    申请日:2018-02-09

    IPC分类号: H01L45/00 H01L27/24 G11C13/00

    摘要: Methods, systems, and devices for a tapered cell profile and fabrication are described. A memory storage component may contain multiple chalcogenide materials and may include a tapered profile. For example, a first chalcogenide material may be coupled with a second chalcogenide material. Each of the chalcogenide materials may be further coupled with a conductive material (e.g., an electrode). Through an etching process, the chalcogenide materials may tapered (e.g., step tapered). A pulse may be applied to the tapered chalcogenide materials resulting in a memory storage component that includes a mixture of the chalcogenide materials.

    TAPERED CELL PROFILE AND FABRICATION
    9.
    发明申请

    公开(公告)号:US20190252605A1

    公开(公告)日:2019-08-15

    申请号:US15893100

    申请日:2018-02-09

    IPC分类号: H01L45/00 H01L27/24

    摘要: Methods, systems, and devices for a tapered cell profile and fabrication are described. A memory storage component may contain multiple chalcogenide materials and may include a tapered profile. For example, a first chalcogenide material may be coupled with a second chalcogenide material. Each of the chalcogenide materials may be further coupled with a conductive material (e.g., an electrode). Through an etching process, the chalcogenide materials may tapered (e.g., step tapered). A pulse may be applied to the tapered chalcogenide materials resulting in a memory storage component that includes a mixture of the chalcogenide materials.