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公开(公告)号:US11514995B2
公开(公告)日:2022-11-29
申请号:US17211133
申请日:2021-03-24
Applicant: Micron Technology, Inc.
Inventor: Nathan A. Eckel , Keith A. Benjamin
Abstract: A method includes requesting, by a component of a memory sub-system controller, control of a data path associated with a memory device coupleable to the controller. The method can include generating, by the component, data corresponding to an operation to test the memory device and causing, by the component, the data to be injected to the data path such that the data is written to the memory device. The method can further include reading, by the component, the data written to the memory device and determining, by the component, whether the data read by the component from the memory device matches the data written to the memory device.
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公开(公告)号:US20210019073A1
公开(公告)日:2021-01-21
申请号:US17065226
申请日:2020-10-07
Applicant: Micron Technology, Inc.
Inventor: Jeffery J. Leyda , Nathan A. Eckel
IPC: G06F3/06 , G06F12/0804
Abstract: A variety of applications can include systems and/or methods of partial save of memory in an apparatus such as a non-volatile dual in-line memory module. In various embodiments, a set of control registers of a non-volatile dual in-line memory module can be configured to contain an identification of a portion of dynamic random-access memory of the non-volatile dual in-line memory module from which to back up content to non-volatile memory of the non-volatile dual in-line memory module. Registers of the set of control registers may also be allotted to contain an amount of content to transfer from the dynamic random-access memory content to the non-volatile memory. Additional apparatus, systems, and methods are disclosed.
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公开(公告)号:US10831393B2
公开(公告)日:2020-11-10
申请号:US16113221
申请日:2018-08-27
Applicant: Micron Technology, Inc.
Inventor: Jeffery J. Leyda , Nathan A. Eckel
IPC: G06F12/00 , G06F3/06 , G06F12/0804
Abstract: A variety of applications can include systems and/or methods of partial save of memory in an apparatus such as a non-volatile dual in-line memory module. In various embodiments, a set of control registers of a non-volatile dual in-line memory module can be configured to contain an identification of a portion of dynamic random-access memory of the non-volatile dual in-line memory module from which to back up content to non-volatile memory of the non-volatile dual in-line memory module. Registers of the set of control registers may also be allotted to contain an amount of content to transfer from the dynamic random-access memory content to the non-volatile memory. Additional apparatus, systems, and methods are disclosed.
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公开(公告)号:US09437263B2
公开(公告)日:2016-09-06
申请号:US14871723
申请日:2015-09-30
Applicant: Micron Technology, Inc.
Inventor: Nathan A. Eckel
CPC classification number: G11C7/22 , G06F13/1689 , G11C7/222
Abstract: Apparatuses and methods for providing strobe signals to memories are described herein. An example apparatus may include a plurality of memories and a memory controller. The memory controller may be coupled to the plurality of memories and configured to receive an input clock signal. The memory controller may further be configured to provide a timing strobe signal having a delay relative to the input clock signal to a memory of the plurality of memories. The memory controller may further be configured to receive a return strobe signal from the plurality of memories. In some examples, the return strobe signal may be based at least in part on the timing strobe signal and the memory controller may be configured to adjust the delay based, at least in part, on a phase difference of the input clock signal and the return strobe signal.
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公开(公告)号:US20240404581A1
公开(公告)日:2024-12-05
申请号:US18667791
申请日:2024-05-17
Applicant: Micron Technology, Inc.
Inventor: Ameen D. Akel , Brent Keeth , James Brian Johnson , Chun-Yi Liu , Shivasankar Gunasekaran , Paul A. Laberge , Gregory A. King , Sai Krishna Mylavarapu , Su Wei Lim , Nathan A. Eckel , Lance P. Johnson , Nathan D. Henningson
IPC: G11C11/4093 , H01L23/00 , H01L25/065 , H01L25/18 , H10B80/00
Abstract: Methods, systems, and devices for interface techniques for stacked memory architectures are described. A semiconductor system, such as a memory system, may distribute memory access circuitry among multiple semiconductor dies of a stack. A first die of the system may include logic circuitry operable to configure a set of multiple first interface blocks of the first die. Each first interface block may include circuitry operable to communicate with one or more second interface blocks of one or more second dies of the system to access a respective set of one or more memory arrays of the one or more second dies. In some examples, the system may include a respective controller for each first interface block to support access operations via the first interface block. The system may also include non-volatile storage, one or more sensors, or a combination thereof to support various operations of the system.
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公开(公告)号:US20240402909A1
公开(公告)日:2024-12-05
申请号:US18670074
申请日:2024-05-21
Applicant: Micron Technology, Inc.
Inventor: Nathan A. Eckel , Lance P. Johnson , Paul A. Laberge
IPC: G06F3/06
Abstract: Methods, systems, and devices for an interface layout for stacked memory architectures are described. A memory interface block may interface a plurality of memory dies to a host controller. The memory interface block may include an interface block coupled with multiple memory dies, which may be stacked on the memory interface block using through-silicon-vias. The memory interface block may include controllers, datapath blocks, and interface blocks associated with each memory die. As such, the memory interface block may perform functions such as queueing, ECC, and performing row repair and column repair procedures. In some examples, a layout for the memory interface block may include pairing controllers for at least two memory devices, such that a pair of controllers may share a command port to a pair of memory dies. Further, the memory interface block may include interfaces to the host controller that are different from the interface to each memory die.
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公开(公告)号:US20190245689A1
公开(公告)日:2019-08-08
申请号:US16103184
申请日:2018-08-14
Applicant: Micron Technology, Inc.
Inventor: Nathan A. Eckel , Steven D. Check
IPC: H04L9/08 , G06F21/74 , G06F12/0804
CPC classification number: H04L9/0894 , G06F12/0804 , G06F21/74 , G06F2212/1032 , H04L9/0869
Abstract: An apparatus comprises an encryption key generator to generate a media encryption key to encrypt data in number of memory components, where the encryption key generator is configured to wrap the media encryption key to generate an encrypted media encryption key. The encrypted media encryption key is stored in a non-volatile memory. The apparatus comprises firmware having instructions to transition the apparatus to and from a secure state using the encrypted media encryption key.
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公开(公告)号:US20240402925A1
公开(公告)日:2024-12-05
申请号:US18671485
申请日:2024-05-22
Applicant: Micron Technology, Inc.
Inventor: Nathan A. Eckel
IPC: G06F3/06
Abstract: Methods, systems, and devices for boot and initialization techniques for stacked memory architectures are described. A memory system may include a common logic block operable to output an indication to each of a set of multiple interface blocks to initiate an initialization program, an evaluation program, or both, where the interface blocks may each be operable to access memory arrays via a respective set of one or more channels. The common logic block may receive a command to initialize or evaluate operations associated with the interface blocks or the respective memory arrays. The common logic block may output an indication of a set of instructions associated with the initialization or evaluation. The interface blocks may, using the received indication, obtain the instructions and perform one or more operations associated with the instructions. In some examples, the common logic block may output the indication in response to identifying a power-on condition.
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公开(公告)号:US11074131B2
公开(公告)日:2021-07-27
申请号:US16847008
申请日:2020-04-13
Applicant: Micron Technology, Inc.
Inventor: James E. Dunn , Nathan A. Eckel
IPC: G06F11/14 , G06F13/42 , G11C14/00 , G11C5/14 , G11C7/20 , G11C11/4072 , G11C11/406
Abstract: Devices and techniques for a storage backed memory package save trigger are disclosed herein. Data can be received via a first interface. The data is stored in a volatile portion of the memory package. Here, the memory package includes a second interface arranged to connect a host to a controller in the memory package. A reset signal can be received at the memory package via the first interface. The data stored in the volatile portion of the memory package can be saved to a non-volatile portion of the memory package in response to the reset signal.
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公开(公告)号:US20190243713A1
公开(公告)日:2019-08-08
申请号:US16107259
申请日:2018-08-21
Applicant: Micron Technology, Inc.
Inventor: James E. Dunn , Nathan A. Eckel
CPC classification number: G06F11/1441 , G06F11/1456 , G06F13/4282 , G11C5/148 , G11C14/0018
Abstract: Devices and techniques for a storage backed memory package save trigger are disclosed herein. Data can be received via a first interface. The data is stored in a volatile portion of the memory package. Here, the memory package includes a second interface arranged to connect a host to a controller in the memory package. A reset signal can be received at the memory package via the first interface. The data stored in the volatile portion of the memory package can be saved to a non-volatile portion of the memory package in response to the reset signal.
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