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公开(公告)号：US20230115310A1
公开(公告)日：2023-04-13
申请号：US17956300
申请日：2022-09-29
Applicant: NICHIA CORPORATION
Inventor： Daisuke SANGA , Yoshiki YAMAJI , Yoshiyuki KAGEYAMA , Hiroaki KURODA
Abstract: A method for estimating a temperature of a light emitting module having a plurality of light emitting elements is provided. The method includes, based on a lighting pattern of the light emitting module, which represents an intensity of light emitted from each of the light emitting elements, estimating respective temperatures of at least a part of the light emitting elements that are operated in accordance with the lighting pattern.
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公开(公告)号：US20180233637A1
公开(公告)日：2018-08-16
申请号：US15893411
申请日：2018-02-09
Applicant: NICHIA CORPORATION
Inventor： Toru TARUKI , Daisuke SANGA
CPC classification number: H01L33/505 , F21V23/003 , F21Y2115/10 , H01L25/0753 , H01L27/156 , H01L33/0079 , H01L33/22 , H01L33/502 , H01L33/62 , H01L2224/48091 , H01L2933/0041 , H01L2933/0066 , H01L2924/00014
Abstract: A method for manufacturing a light emitting device includes: providing a wafer that includes, successively from an upper face side, an electrode structure that includes multilayer wiring, a semiconductor layer electrically connected to the electrode structure, and a growth substrate; bonding the wafer to a support substrate; exposing the semiconductor layer by removing the growth substrate from the wafer; separating the semiconductor layer into a plurality of light emitting elements, which comprises forming grooves on a semiconductor layer side surface of the wafer; and forming a phosphor layer having protrusions and recesses at a surface thereof such that the phosphor layer covers surfaces of the light emitting elements, which comprises: forming a coating film on surfaces of the light emitting elements by applying a slurry comprising phosphor particles contained in a solvent, and vaporizing the solvent in the coating film to form the phosphor layer.
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公开(公告)号：US20150041844A1
公开(公告)日：2015-02-12
申请号：US14452827
申请日：2014-08-06
Applicant: NICHIA CORPORATION
Inventor： Tsuyoshi OKAHISA , Yuta OKA , Daisuke SANGA
CPC classification number: H01L33/54
Abstract: A light emitting device has a lens, extended to outside of the mounting substrate on which a semiconductor a light emitting element is mounted, and leakage of light is reduced. A light emitting element, a substrate having the light emitting element mounted on its upper surface, and a lens, having a curved upper surface encloses the light emitting element and the upper surface of the substrate is included. From the bottom surface of the lens, a lower surface of the substrate is exposed. In a top view from a perpendicular direction to the upper surface of the substrate, the bottom surface of the lens includes an outer extending portion where the bottom surface is extended to outside of the substrate, and a inclined portion, which inclines with respect to a direction approximately in parallel to the upper surface of the substrate, at an end portion of the outer extending portion.
Abstract translation: 发光装置具有透镜，延伸到其上安装有发光元件的半导体的安装基板的外部，并且光的泄漏减少。 包括发光元件，具有安装在其上表面上的发光元件的基板和具有包围发光元件和基板的上表面的弯曲上表面的透镜。 从透镜的底面露出基板的下表面。 在从与基板的上表面垂直的方向的俯视图中，透镜的底面包括外延伸部分，其中底表面延伸到基板外侧，倾斜部分相对于 方向大致平行于基板的上表面，在外延伸部分的端部处。
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公开(公告)号：US20220384698A1
公开(公告)日：2022-12-01
申请号：US17846793
申请日：2022-06-22
Applicant: NICHIA CORPORATION
Inventor： Daisuke SANGA
IPC: H01L33/62 , H01L25/075
Abstract: A method of manufacturing a light emitting device includes: providing a light emitting element including a p-side electrode and a n-side electrode on a same surface side; providing a substrate on which first and second wiring seed layers are formed; forming a resist pattern within an area on the substrate where the light emitting element is to be placed; placing the light emitting element on the resist pattern such that the p-side electrode and the first wiring seed layer are separated from and face each other, and the n-side electrode and the second wiring seed layer are separated from and face each other; joining the first wiring seed layer with the p-side electrode, and joining the second wiring seed layer with the n-side electrode, by plating using the resist pattern as a mask; and removing the resist pattern.
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公开(公告)号：US20210187928A1
公开(公告)日：2021-06-24
申请号：US17197606
申请日：2021-03-10
Applicant: NICHIA CORPORATION
Inventor： Daisuke SANGA , Masatsugu ICHIKAWA , Shunsuke MINATO , Toru TAKASONE , Masahiko SANO
Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.
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Patent Agency Ranking
公开(公告)号：US20190006336A1
公开(公告)日：2019-01-03
申请号：US16024605
申请日：2018-06-29
Applicant: NICHIA CORPORATION
Inventor： Shinichi DAIKOKU , Daisuke SANGA
Abstract: A method of manufacturing a light emitting device includes: providing a semiconductor stack including a first semiconductor layer and a second semiconductor layer; forming light emitting cells by forming grooves in column and row directions; exposing a portion of the first semiconductor layer from the second semiconductor layer in each light emitting cell; forming a first insulation layer having a first hole on the light emitting cells and the grooves; forming a wiring electrode to be in electrical connection with the first semiconductor layer at the first hole in each light emitting cell; forming a second hole in the first insulation layer; forming a second electrode to be in electrical connection with the second semiconductor layer at the second hole; thinning the first semiconductor layer; and exposing the first insulation layer from the first semiconductor layer at the grooves while roughening the surface of the first semiconductor layer.
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公开(公告)号：US20230126154A1
公开(公告)日：2023-04-27
申请号：US17959311
申请日：2022-10-04
Applicant: NICHIA CORPORATION
Inventor： Daisuke SANGA
IPC: F21S41/153
Abstract: A light-emitting module including a first wiring substrate, a second wiring substrate located on the first wiring substrate, a plurality of light-emitting elements located on the second wiring substrate, a wire connecting a first terminal of the first wiring substrate and a second terminal of the second wiring substrate, a first resin located on the first wiring substrate and on the second wiring substrate, and a protective member located on the first resin. The first resin covers the wire and surrounds the plurality of light-emitting elements when viewed in plan view. The protective member includes a light-transmitting member covering the first resin when viewed in plan view, and a light-shielding film located at a surface of the light-transmitting member. The light-shielding film covers the first resin when viewed in plan view.
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公开(公告)号：US20180229491A1
公开(公告)日：2018-08-16
申请号：US15883810
申请日：2018-01-30
Applicant: NICHIA CORPORATION
Inventor： Daisuke SANGA , Masatsugu ICHIKAWA , Shunsuke MINATO , Toru TAKASONE , Masahiko SANO
CPC classification number: B32B38/0004 , B32B37/02 , B32B2305/55 , B32B2307/412 , B32B2551/00 , H01L33/0079 , H01L33/58 , H01L33/60
Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.
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公开(公告)号：US20140103383A1
公开(公告)日：2014-04-17
申请号：US14109471
申请日：2013-12-17
Applicant: Nichia Corporation
Inventor： Daisuke SANGA
IPC: H01L33/60
CPC classification number: H01L33/60 , H01L33/54 , H01L33/62 , H01L2224/16 , H01L2924/01322 , H01L2924/00
Abstract: A light emitting device is provided with a base member, an interconnect pattern disposed on an upper surface of the base member, a light reflecting layer comprising a first layer disposed on a part of the interconnect pattern and formed from a metal material, and a second layer made of a dielectric multilayer reflecting film made with stacked layers of dielectric films having different refractive indices and covering an upper surface and side surfaces of the first layer, a light emitting element chip fixed so as to face at least a part of the light reflecting layer, and a light transmissive sealing member sealing the light reflecting layer and the light emitting element chip.
Abstract translation: 发光装置设置有基底构件，设置在基底构件的上表面上的布线图案，光反射层，包括设置在互连图案的一部分上并由金属材料形成的第一层，第二层 由电介质多层反射膜制成的层，该电介质多层反射膜由具有不同折射率的电介质膜层叠而成，并覆盖第一层的上表面和侧表面;发光元件芯片，被固定为面对至少一部分光反射 以及密封光反射层和发光元件芯片的透光密封构件。
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公开(公告)号：US20160300987A1
公开(公告)日：2016-10-13
申请号：US15184578
申请日：2016-06-16
Applicant: NICHIA CORPORATION
Inventor： Daisuke SANGA , Yuta OKA
CPC classification number: H01L33/60 , H01L33/0095 , H01L33/38 , H01L33/46 , H01L33/50 , H01L33/54 , H01L33/58 , H01L2933/0033
Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.
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