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公开(公告)号：US20230299253A1
公开(公告)日：2023-09-21
申请号：US18323544
申请日：2023-05-25
Applicant: NICHIA CORPORATION
Inventor： Hiroaki KAGEYAMA
Abstract: A light-emitting element includes: a support substrate; a semiconductor stacked body disposed on the support substrate, the semiconductor stacked body including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer; an insulating film including a first opening disposed above the first semiconductor layer and a plurality of second openings disposed above the second semiconductor layer; a first pad electrode disposed on the insulating film and electrically connected to the first semiconductor layer at the first opening; a second pad electrode disposed on the insulating film and electrically connected to the second semiconductor layer at the plurality of second openings; and a third pad electrode disposed on the insulating film and electrically insulated from the semiconductor stacked body.
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公开(公告)号：US20220102587A1
公开(公告)日：2022-03-31
申请号：US17489392
申请日：2021-09-29
Applicant: NICHIA CORPORATION
Inventor： Hiroaki KAGEYAMA
Abstract: A light-emitting element includes: a semiconductor layered body including first and second semiconductor layers, the first semiconductor layer having a plurality of exposed portions exposed from the second semiconductor layer at locations inward of an outer periphery of the second semiconductor layer; an insulating film covering the semiconductor layered body and defining a first opening above the exposed portions and a second opening above a part of the second semiconductor layer; first and second electrodes electrically connected to the first and second semiconductor layer through the first and second openings, respectively; first bumps and second bumps disposed on the first and second electrodes, respectively. The first electrode and the second electrode have a first surface and a second surface, respectively, that are located at the same height from the second semiconductor layer. The first and second bumps are respectively connected to the first and second surfaces.
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公开(公告)号：US20210082885A1
公开(公告)日：2021-03-18
申请号：US17020838
申请日：2020-09-15
Applicant: NICHIA CORPORATION
Inventor： Takashi ISHII , Dai WAKAMATSU , Hiroaki KAGEYAMA
IPC: H01L25/075 , H01L33/00
Abstract: A method of manufacturing a light-emitting module that includes providing a light-transmissive member joined body that includes a plurality of submounts, a plurality of light-emitting elements each of which is disposed on a respective one of submounts, and a single light-transmissive member disposed on the light-emitting elements. The method further includes disposing the light-transmissive member joined body on a module board such that the submounts face the module board, forming a plurality of element structures by dividing the single light-transmissive member for each light-emitting element into the element structures each of which includes the submount, the light-emitting element, and the light-transmissive member positioned in this order, and forming a first covering member on the module board to cover lateral surfaces of the element structures.
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公开(公告)号：US20240006248A1
公开(公告)日：2024-01-04
申请号：US18343426
申请日：2023-06-28
Applicant: NICHIA CORPORATION
Inventor： Hiroaki KAGEYAMA
Abstract: A method of manufacturing a light emitting device comprises: providing a structure body including a substrate and a plurality of semiconductor parts arranged on the substrate, wherein the semiconductor parts individually includes a first semiconductor layer, a second semiconductor layer, a first terminal and a second terminal; disposing an insulating member that covers the semiconductor parts; forming wirings at locations above the semiconductor parts, wherein, the wirings each connect the first terminal and the second terminal of two adjacent semiconductor parts in a direction of arrangement, the wirings serially connect the semiconductor parts, and an area of individual of the wirings is larger than an area of the first terminal or an area of the second terminal in a top view; evaluating electrical properties of the semiconductor parts connected by the wirings by bringing a testing device into contact with the wiring; and removing the insulating member and the wirings.
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公开(公告)号：US20230317688A1
公开(公告)日：2023-10-05
申请号：US18191192
申请日：2023-03-28
Applicant: NICHIA CORPORATION
Inventor： Hiroaki KAGEYAMA
IPC: H01L25/075 , H01L33/48
CPC classification number: H01L25/0753 , H01L33/486
Abstract: A light-emitting device includes a substrate including a base body and a metal layer disposed on an upper surface of the base body, and a plurality of light-emitting elements disposed on the metal layer. The metal layer includes, between adjacent ones of the light-emitting elements, a protrusion having a top located at a position higher than upper surfaces of the adjacent ones of the light-emitting elements. A manufacturing method of a light-emitting device includes: preparing a substrate that includes a base body and a metal layer disposed on an upper surface of the base body, the metal layer including a plurality of protrusions; and placing a light-emitting element on the metal layer between adjacent ones of the protrusions.
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Patent Agency Ranking
公开(公告)号：US20230134799A1
公开(公告)日：2023-05-04
申请号：US17967455
申请日：2022-10-17
Applicant: NICHIA CORPORATION
Inventor： Hiroaki KAGEYAMA
Abstract: A method for manufacturing a light-emitting device includes preparing light-emitting elements, each including a semiconductor structure body that includes a first surface including recesses, a second surface, and a lateral surface. The method includes disposing the light-emitting elements on an adhesive sheet member so that the second surfaces face the sheet member and the lateral surfaces are covered with the sheet member. The method includes causing a first member to contact the first surfaces so that the first member is located inside the recesses and located between the sheet member and a second member in a state in which the second member is located on the first member. The first member includes a transmissive uncured resin member. The second member includes a wavelength conversion material and has a higher hardness than the uncured resin member. The method includes curing the first member, and removing the sheet member.
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公开(公告)号：US20200176632A1
公开(公告)日：2020-06-04
申请号：US16693547
申请日：2019-11-25
Applicant: NICHIA CORPORATION
Inventor： Hiroaki KAGEYAMA
Abstract: A light-emitting element includes: a base member including a first side and a second side, the first side and the second side being along a first direction, wherein a second direction from the first side toward the second side is orthogonal to the first direction; a semiconductor stacked body that is not electrically connected to the base member in a third direction, the third direction being orthogonal to a plane including the first direction and the second direction, the semiconductor stacked body comprising a p-type semiconductor layer, a light-emitting layer, and an n-type semiconductor layer; a first pad electrode that is not electrically connected to the base member in the third direction; a second pad electrode that is not electrically connected to the base member in the third direction; a first conductive layer; and a second conductive layer.
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公开(公告)号：US20160315225A1
公开(公告)日：2016-10-27
申请号：US15139617
申请日：2016-04-27
Applicant: Nichia Corporation
Inventor： Hiroaki KAGEYAMA
IPC: H01L33/38
CPC classification number: H01L33/38
Abstract: A light emitting device includes a light emitting element, a p-side and an n-side post electrode. The light emitting element includes a semiconductor body having n-type and p-type semiconductor layers and a peripheral portion, a first edge, and a second edge. The light emitting element further includes an n-side electrode and a p-side electrode disposed on an insulating film having n-side openings and a p-side opening. The n-side electrode includes second n-contact portions electrically connected to the n-type semiconductor layer through the n-side openings. In a plan view, a p-side post electrode and at least one of the second n-contact portions are at the first edge side. An n-side post electrode electrically connected to the second n-contact portions and at least one of the second n-contact portions are at the second edge side. Fewer second n-contact portions are on the first edge side than that on the second edge side.
Abstract translation: 发光器件包括发光元件，p侧和n侧柱状电极。 发光元件包括具有n型和p型半导体层以及周边部分，第一边缘和第二边缘的半导体本体。 发光元件还包括设置在具有n侧开口和p侧开口的绝缘膜上的n侧电极和p侧电极。 n侧电极包括通过n侧开口电连接到n型半导体层的第二n接触部分。 在平面图中，p侧柱电极和第二n接触部中的至少一个位于第一边缘侧。 电连接到第二n接触部分和第二n接触部分中的至少一个的n侧柱状电极处于第二边缘侧。 在第一边缘侧比第二边缘侧更少的第二n接触部分。
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公开(公告)号：US20250038036A1
公开(公告)日：2025-01-30
申请号：US18771582
申请日：2024-07-12
Applicant: Nichia Corporation
Inventor： Hiroaki KAGEYAMA
IPC: H01L21/683 , B32B43/00 , H01L33/62
Abstract: A method for manufacturing a light-emitting device includes preparing a stacked body including a substrate and a semiconductor layer on the substrate; and separating the substrate from the semiconductor layer by irradiating the stacked body with a laser light. A first region of the stacked body corresponding to an outer perimeter region of the semiconductor layer and a second region of the stacked body corresponding to a center region of the semiconductor layer are simultaneously irradiated with the laser light during the separating. An irradiation intensity of the laser light at the second region of the stacked body is greater than an irradiation intensity of the laser light at the first region of the stacked body.
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公开(公告)号：US20240332247A1
公开(公告)日：2024-10-03
申请号：US18613110
申请日：2024-03-22
Applicant: NICHIA CORPORATION
Inventor： Hiroaki KAGEYAMA , Yuka IMADA , Hiroki HANAOKA
IPC: H01L23/00 , H01L21/66 , H01L25/075 , H01L33/40 , H01L33/62
CPC classification number: H01L24/80 , H01L22/22 , H01L24/05 , H01L24/08 , H01L24/95 , H01L25/0753 , H01L33/40 , H01L33/62 , H01L2224/05644 , H01L2224/08225 , H01L2224/80052 , H01L2224/80201 , H01L2224/80444 , H01L2224/95 , H01L2924/12041 , H01L2933/0066
Abstract: A method of manufacturing a light emitting device includes preparing a plurality of first elements including first bonding parts and a wiring substrate including a plurality of second bonding parts. The method further includes placing the first elements on the wiring substrate by bonding the first bonding parts and the second bonding parts under first bonding conditions, and bonding the first bonding parts and the second bonding parts under second bonding conditions by placing a buffer sheet on the first elements and applying pressure on the first elements via the buffer sheet towards the wiring substrate. The bonding conducted under the second bonding conditions is performed multiple times.
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